KR102381412B1 - 기판 이송 장치 - Google Patents

기판 이송 장치 Download PDF

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Publication number
KR102381412B1
KR102381412B1 KR1020167022339A KR20167022339A KR102381412B1 KR 102381412 B1 KR102381412 B1 KR 102381412B1 KR 1020167022339 A KR1020167022339 A KR 1020167022339A KR 20167022339 A KR20167022339 A KR 20167022339A KR 102381412 B1 KR102381412 B1 KR 102381412B1
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KR
South Korea
Prior art keywords
drive
arms
axis
arm
power transmission
Prior art date
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Active
Application number
KR1020167022339A
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English (en)
Korean (ko)
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KR20160107327A (ko
Inventor
로버트 티. 케이브니
Original Assignee
브룩스 오토메이션 인코퍼레이티드
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Application filed by 브룩스 오토메이션 인코퍼레이티드 filed Critical 브룩스 오토메이션 인코퍼레이티드
Priority to KR1020227010326A priority Critical patent/KR20220044392A/ko
Publication of KR20160107327A publication Critical patent/KR20160107327A/ko
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Publication of KR102381412B1 publication Critical patent/KR102381412B1/ko
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Classifications

    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • H01L21/67718—
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020167022339A 2014-01-17 2015-01-16 기판 이송 장치 Active KR102381412B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227010326A KR20220044392A (ko) 2014-01-17 2015-01-16 기판 이송 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461928681P 2014-01-17 2014-01-17
US61/928,681 2014-01-17
PCT/US2015/011764 WO2015109189A1 (en) 2014-01-17 2015-01-16 Substrate transport apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227010326A Division KR20220044392A (ko) 2014-01-17 2015-01-16 기판 이송 장치

Publications (2)

Publication Number Publication Date
KR20160107327A KR20160107327A (ko) 2016-09-13
KR102381412B1 true KR102381412B1 (ko) 2022-03-31

Family

ID=53543480

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020167022339A Active KR102381412B1 (ko) 2014-01-17 2015-01-16 기판 이송 장치
KR1020237021822A Ceased KR20230104993A (ko) 2014-01-17 2015-01-16 기판 이송 장치
KR1020227010326A Ceased KR20220044392A (ko) 2014-01-17 2015-01-16 기판 이송 장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020237021822A Ceased KR20230104993A (ko) 2014-01-17 2015-01-16 기판 이송 장치
KR1020227010326A Ceased KR20220044392A (ko) 2014-01-17 2015-01-16 기판 이송 장치

Country Status (5)

Country Link
US (2) US11273558B2 (https=)
JP (3) JP6863744B2 (https=)
KR (3) KR102381412B1 (https=)
CN (2) CN106103011A (https=)
WO (1) WO2015109189A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180308728A1 (en) * 2017-02-07 2018-10-25 Brooks Automation, Inc. Method and apparatus for substrate transport
US11088004B2 (en) 2018-01-30 2021-08-10 Brooks Automation, Inc. Automatic wafer centering method and apparatus
US11574830B2 (en) 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
US11535460B2 (en) * 2018-05-31 2022-12-27 Brooks Automation Us, Llc Substrate processing apparatus
US11545380B2 (en) * 2018-11-01 2023-01-03 Brooks Automation Us Llc Transport apparatus with linear bearing
JP6522225B2 (ja) * 2018-12-19 2019-05-29 日本たばこ産業株式会社 霧化ユニットの製造方法、非燃焼型香味吸引器、霧化ユニット及び霧化ユニットパッケージ
CN121011552A (zh) * 2021-06-30 2025-11-25 北京屹唐半导体科技股份有限公司 传送装置和处理系统
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005125479A (ja) * 2003-04-16 2005-05-19 Daihen Corp 直線移動機構およびこれを用いた搬送ロボット
KR101268111B1 (ko) * 2013-03-14 2013-05-29 주식회사 티이에스 기판 이송 장치
JP2014030328A (ja) 2012-06-28 2014-02-13 Ichinomiya Denki:Kk モータ駆動システム

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
US5180276A (en) 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
JP2659676B2 (ja) * 1993-11-02 1997-09-30 シーケーディ株式会社 ウェハ把持装置
JPH11188670A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
JP3806272B2 (ja) * 1999-09-13 2006-08-09 三菱重工業株式会社 マルチチャンバ型真空処理システム及び基板搬送装置
CN1996553A (zh) 2001-08-31 2007-07-11 阿赛斯特技术公司 用于半导体材料处理系统的一体化机架
US7066707B1 (en) * 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
KR100582697B1 (ko) * 2003-07-16 2006-05-23 동경 엘렉트론 주식회사 피처리 기판의 반송 장치 및 회전 위치를 검출하는 기능을갖는 구동 기구
JP4319504B2 (ja) * 2003-10-06 2009-08-26 東京エレクトロン株式会社 基板搬送装置および基板処理システム
US7797968B2 (en) 2004-06-01 2010-09-21 INVISTA North America S.à.r.l. Method to make circular knit elastic fabric comprising spandex and hard yarns
JP2006240867A (ja) * 2005-03-07 2006-09-14 Hitachi Plant Technologies Ltd 移載機におけるテレスコピックアームの旋回機構
US8419341B2 (en) * 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
JP2008246644A (ja) * 2007-03-30 2008-10-16 Daihen Corp 搬送装置
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
JPWO2008140093A1 (ja) * 2007-05-15 2010-08-05 株式会社アルバック 搬送装置及びこれを用いた真空処理装置
JP4766274B2 (ja) 2007-07-18 2011-09-07 株式会社安川電機 基板搬送ロボット及びそれを備えた半導体製造装置
JP4971063B2 (ja) * 2007-07-27 2012-07-11 株式会社ダイヘン 搬送装置
JP4824645B2 (ja) 2007-08-03 2011-11-30 株式会社アルバック 基板搬送装置
US8777547B2 (en) * 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
JP5304601B2 (ja) * 2009-11-10 2013-10-02 株式会社安川電機 アーム機構およびそれを備えた真空ロボット
CN201781112U (zh) 2010-07-22 2011-03-30 番禺得意精密电子工业有限公司 电连接器
CN103053017B (zh) * 2010-08-24 2015-09-02 株式会社爱发科 输送装置
JP6525499B2 (ja) * 2010-10-08 2019-06-05 ブルックス オートメーション インコーポレイテッド 同軸駆動真空ロボット
JP2013544034A (ja) * 2010-11-10 2013-12-09 ブルックス オートメーション インコーポレイテッド 双腕ロボット
JP2012152851A (ja) * 2011-01-26 2012-08-16 Sinfonia Technology Co Ltd 搬送アーム装置
US9188973B2 (en) * 2011-07-08 2015-11-17 Restoration Robotics, Inc. Calibration and transformation of a camera system's coordinate system
JP2013084823A (ja) * 2011-10-11 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
TWI629743B (zh) 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
KR20130096072A (ko) 2012-02-21 2013-08-29 삼성전자주식회사 기판 반송 장치
JP5663638B2 (ja) * 2012-10-11 2015-02-04 株式会社ティーイーエス 基板移送装置
KR101246362B1 (ko) * 2012-10-11 2013-03-25 주식회사 티이에스 기판 이송 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005125479A (ja) * 2003-04-16 2005-05-19 Daihen Corp 直線移動機構およびこれを用いた搬送ロボット
JP2014030328A (ja) 2012-06-28 2014-02-13 Ichinomiya Denki:Kk モータ駆動システム
KR101268111B1 (ko) * 2013-03-14 2013-05-29 주식회사 티이에스 기판 이송 장치

Also Published As

Publication number Publication date
JP2021106288A (ja) 2021-07-26
KR20160107327A (ko) 2016-09-13
JP7280309B2 (ja) 2023-05-23
JP6863744B2 (ja) 2021-04-21
CN106103011A (zh) 2016-11-09
KR20220044392A (ko) 2022-04-07
WO2015109189A1 (en) 2015-07-23
CN113270350A (zh) 2021-08-17
JP2017504492A (ja) 2017-02-09
US20220266460A1 (en) 2022-08-25
KR20230104993A (ko) 2023-07-11
JP2023100955A (ja) 2023-07-19
US11273558B2 (en) 2022-03-15
US20160325440A1 (en) 2016-11-10

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