CN106103011A - 衬底运输设备 - Google Patents

衬底运输设备 Download PDF

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Publication number
CN106103011A
CN106103011A CN201580014344.0A CN201580014344A CN106103011A CN 106103011 A CN106103011 A CN 106103011A CN 201580014344 A CN201580014344 A CN 201580014344A CN 106103011 A CN106103011 A CN 106103011A
Authority
CN
China
Prior art keywords
arm
axis
drive
arms
common
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580014344.0A
Other languages
English (en)
Chinese (zh)
Inventor
R.T.卡夫尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Borukos Automation Holding Co ltd
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Priority to CN202110464317.0A priority Critical patent/CN113270350A/zh
Publication of CN106103011A publication Critical patent/CN106103011A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201580014344.0A 2014-01-17 2015-01-16 衬底运输设备 Pending CN106103011A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110464317.0A CN113270350A (zh) 2014-01-17 2015-01-16 衬底运输设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461928681P 2014-01-17 2014-01-17
US61/928681 2014-01-17
PCT/US2015/011764 WO2015109189A1 (en) 2014-01-17 2015-01-16 Substrate transport apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202110464317.0A Division CN113270350A (zh) 2014-01-17 2015-01-16 衬底运输设备

Publications (1)

Publication Number Publication Date
CN106103011A true CN106103011A (zh) 2016-11-09

Family

ID=53543480

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580014344.0A Pending CN106103011A (zh) 2014-01-17 2015-01-16 衬底运输设备
CN202110464317.0A Pending CN113270350A (zh) 2014-01-17 2015-01-16 衬底运输设备

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202110464317.0A Pending CN113270350A (zh) 2014-01-17 2015-01-16 衬底运输设备

Country Status (5)

Country Link
US (2) US11273558B2 (https=)
JP (3) JP6863744B2 (https=)
KR (3) KR102381412B1 (https=)
CN (2) CN106103011A (https=)
WO (1) WO2015109189A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902245A (zh) * 2018-01-30 2020-11-06 布鲁克斯自动化公司 自动晶片定心方法和设备
CN112470266A (zh) * 2018-05-31 2021-03-09 布鲁克斯自动化公司 衬底输送设备
CN113227594A (zh) * 2018-11-01 2021-08-06 布鲁克斯自动化公司 带有线性轴承的传送装置及其方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
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US20180308728A1 (en) * 2017-02-07 2018-10-25 Brooks Automation, Inc. Method and apparatus for substrate transport
US11574830B2 (en) 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
JP6522225B2 (ja) * 2018-12-19 2019-05-29 日本たばこ産業株式会社 霧化ユニットの製造方法、非燃焼型香味吸引器、霧化ユニット及び霧化ユニットパッケージ
CN121011552A (zh) * 2021-06-30 2025-11-25 北京屹唐半导体科技股份有限公司 传送装置和处理系统
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

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JPH11188670A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
US20040001750A1 (en) * 2002-05-09 2004-01-01 Izya Kremerman Dual arm robot
CN1561535A (zh) * 2001-08-31 2005-01-05 阿赛斯特技术公司 通用模块化晶片输送系统
US20050036877A1 (en) * 2003-04-16 2005-02-17 Daihen Corporation Linear moving mechanism and transfer robot using the same
JP2006240867A (ja) * 2005-03-07 2006-09-14 Hitachi Plant Technologies Ltd 移載機におけるテレスコピックアームの旋回機構
US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
CN103053017A (zh) * 2010-08-24 2013-04-17 株式会社爱发科 输送装置
WO2013120054A1 (en) * 2012-02-10 2013-08-15 Brooks Automation, Inc. Substrate processing apparatus
US20130213171A1 (en) * 2012-02-21 2013-08-22 Samsung Electronics Co., Ltd. Substrate transfer apparatus

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JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
US5180276A (en) 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
JP2659676B2 (ja) * 1993-11-02 1997-09-30 シーケーディ株式会社 ウェハ把持装置
JP3806272B2 (ja) * 1999-09-13 2006-08-09 三菱重工業株式会社 マルチチャンバ型真空処理システム及び基板搬送装置
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JP4319504B2 (ja) * 2003-10-06 2009-08-26 東京エレクトロン株式会社 基板搬送装置および基板処理システム
US7797968B2 (en) 2004-06-01 2010-09-21 INVISTA North America S.à.r.l. Method to make circular knit elastic fabric comprising spandex and hard yarns
US8419341B2 (en) * 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
JP2008246644A (ja) * 2007-03-30 2008-10-16 Daihen Corp 搬送装置
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
JPWO2008140093A1 (ja) * 2007-05-15 2010-08-05 株式会社アルバック 搬送装置及びこれを用いた真空処理装置
JP4766274B2 (ja) 2007-07-18 2011-09-07 株式会社安川電機 基板搬送ロボット及びそれを備えた半導体製造装置
JP4971063B2 (ja) * 2007-07-27 2012-07-11 株式会社ダイヘン 搬送装置
JP4824645B2 (ja) 2007-08-03 2011-11-30 株式会社アルバック 基板搬送装置
JP5304601B2 (ja) * 2009-11-10 2013-10-02 株式会社安川電機 アーム機構およびそれを備えた真空ロボット
CN201781112U (zh) 2010-07-22 2011-03-30 番禺得意精密电子工业有限公司 电连接器
JP6525499B2 (ja) * 2010-10-08 2019-06-05 ブルックス オートメーション インコーポレイテッド 同軸駆動真空ロボット
JP2013544034A (ja) * 2010-11-10 2013-12-09 ブルックス オートメーション インコーポレイテッド 双腕ロボット
JP2012152851A (ja) * 2011-01-26 2012-08-16 Sinfonia Technology Co Ltd 搬送アーム装置
US9188973B2 (en) * 2011-07-08 2015-11-17 Restoration Robotics, Inc. Calibration and transformation of a camera system's coordinate system
JP2013084823A (ja) * 2011-10-11 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
JP5274702B1 (ja) * 2012-06-28 2013-08-28 株式会社一宮電機 モータ駆動システム
JP5663638B2 (ja) * 2012-10-11 2015-02-04 株式会社ティーイーエス 基板移送装置
KR101246362B1 (ko) * 2012-10-11 2013-03-25 주식회사 티이에스 기판 이송 장치
KR101268111B1 (ko) 2013-03-14 2013-05-29 주식회사 티이에스 기판 이송 장치

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11188670A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
CN1561535A (zh) * 2001-08-31 2005-01-05 阿赛斯特技术公司 通用模块化晶片输送系统
US20040001750A1 (en) * 2002-05-09 2004-01-01 Izya Kremerman Dual arm robot
US20050036877A1 (en) * 2003-04-16 2005-02-17 Daihen Corporation Linear moving mechanism and transfer robot using the same
JP2006240867A (ja) * 2005-03-07 2006-09-14 Hitachi Plant Technologies Ltd 移載機におけるテレスコピックアームの旋回機構
US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
CN103053017A (zh) * 2010-08-24 2013-04-17 株式会社爱发科 输送装置
WO2013120054A1 (en) * 2012-02-10 2013-08-15 Brooks Automation, Inc. Substrate processing apparatus
US20130213171A1 (en) * 2012-02-21 2013-08-22 Samsung Electronics Co., Ltd. Substrate transfer apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902245A (zh) * 2018-01-30 2020-11-06 布鲁克斯自动化公司 自动晶片定心方法和设备
US11764093B2 (en) 2018-01-30 2023-09-19 Brooks Automation Us, Llc Automatic wafer centering method and apparatus
CN111902245B (zh) * 2018-01-30 2024-02-23 博鲁可斯自动化美国有限责任公司 自动晶片定心方法和设备
CN112470266A (zh) * 2018-05-31 2021-03-09 布鲁克斯自动化公司 衬底输送设备
CN113227594A (zh) * 2018-11-01 2021-08-06 布鲁克斯自动化公司 带有线性轴承的传送装置及其方法

Also Published As

Publication number Publication date
JP2021106288A (ja) 2021-07-26
KR20160107327A (ko) 2016-09-13
KR102381412B1 (ko) 2022-03-31
JP7280309B2 (ja) 2023-05-23
JP6863744B2 (ja) 2021-04-21
KR20220044392A (ko) 2022-04-07
WO2015109189A1 (en) 2015-07-23
CN113270350A (zh) 2021-08-17
JP2017504492A (ja) 2017-02-09
US20220266460A1 (en) 2022-08-25
KR20230104993A (ko) 2023-07-11
JP2023100955A (ja) 2023-07-19
US11273558B2 (en) 2022-03-15
US20160325440A1 (en) 2016-11-10

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20220310

Address after: Massachusetts

Applicant after: Borucos automation USA Co.,Ltd.

Address before: Massachusetts

Applicant before: Borukos automation Holding Co.,Ltd.

Effective date of registration: 20220310

Address after: Massachusetts

Applicant after: Borukos automation Holding Co.,Ltd.

Address before: Massachusetts

Applicant before: BROOKS AUTOMATION, Inc.

TA01 Transfer of patent application right
RJ01 Rejection of invention patent application after publication

Application publication date: 20161109

RJ01 Rejection of invention patent application after publication