KR102376559B1 - 점착 시트 - Google Patents

점착 시트 Download PDF

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Publication number
KR102376559B1
KR102376559B1 KR1020150040510A KR20150040510A KR102376559B1 KR 102376559 B1 KR102376559 B1 KR 102376559B1 KR 1020150040510 A KR1020150040510 A KR 1020150040510A KR 20150040510 A KR20150040510 A KR 20150040510A KR 102376559 B1 KR102376559 B1 KR 102376559B1
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KR
South Korea
Prior art keywords
adhesive sheet
pressure
sensitive adhesive
acrylate
alkyl
Prior art date
Application number
KR1020150040510A
Other languages
English (en)
Korean (ko)
Other versions
KR20150111864A (ko
Inventor
시게유키 야마시타
도모하루 미야나가
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20150111864A publication Critical patent/KR20150111864A/ko
Application granted granted Critical
Publication of KR102376559B1 publication Critical patent/KR102376559B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
KR1020150040510A 2014-03-26 2015-03-24 점착 시트 KR102376559B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014063610A JP6334223B2 (ja) 2014-03-26 2014-03-26 粘着シート
JPJP-P-2014-063610 2014-03-26

Publications (2)

Publication Number Publication Date
KR20150111864A KR20150111864A (ko) 2015-10-06
KR102376559B1 true KR102376559B1 (ko) 2022-03-18

Family

ID=54345168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150040510A KR102376559B1 (ko) 2014-03-26 2015-03-24 점착 시트

Country Status (3)

Country Link
JP (1) JP6334223B2 (ja)
KR (1) KR102376559B1 (ja)
TW (1) TWI668287B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017150145A1 (ja) * 2016-03-04 2017-09-08 リンテック株式会社 保護膜形成用複合シート
KR101943705B1 (ko) 2016-06-27 2019-01-29 삼성에스디아이 주식회사 점착필름, 이를 포함하는 광학부재 및 이를 포함하는 광학표시장치
JP6812213B2 (ja) * 2016-11-14 2021-01-13 日東電工株式会社 シート、テープおよび半導体装置の製造方法
JP6821261B2 (ja) * 2017-04-21 2021-01-27 株式会社ディスコ 被加工物の加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194167A (ja) * 2000-12-27 2002-07-10 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂組成物を成形してなるフィルムまたはシート
JP2009206311A (ja) * 2008-02-28 2009-09-10 Lintec Corp レーザーダイシングシートおよびチップ体の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
JP4754278B2 (ja) * 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
EP2184331A4 (en) * 2007-08-30 2013-10-02 Denki Kagaku Kogyo Kk AUTOCOLLATING SHEET AND PROCESS FOR PRODUCING ELECTRONIC COMPONENT
JP5613982B2 (ja) 2008-04-11 2014-10-29 日立化成株式会社 半導体チップの製造方法及びダイシングテープ
JP5193752B2 (ja) * 2008-08-28 2013-05-08 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
KR101242237B1 (ko) * 2009-08-25 2013-03-12 (주)엘지하우시스 아크릴 필름의 제조 방법 및 아크릴 필름
JPWO2011065252A1 (ja) * 2009-11-30 2013-04-11 電気化学工業株式会社 粘着シート及び電子部品
JP5128575B2 (ja) * 2009-12-04 2013-01-23 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
KR101314398B1 (ko) * 2011-09-23 2013-10-04 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 테이프
KR101393895B1 (ko) * 2011-11-02 2014-05-13 (주)엘지하우시스 절단성이 우수한 반도체 웨이퍼 표면보호용 점착필름
KR101742647B1 (ko) * 2011-12-26 2017-06-01 듀폰-미츠이 폴리케미칼 가부시키가이샤 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법
JP5554351B2 (ja) * 2012-01-25 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP6009188B2 (ja) * 2012-03-23 2016-10-19 リンテック株式会社 ワーク加工用シート基材およびワーク加工用シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194167A (ja) * 2000-12-27 2002-07-10 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂組成物を成形してなるフィルムまたはシート
JP2009206311A (ja) * 2008-02-28 2009-09-10 Lintec Corp レーザーダイシングシートおよびチップ体の製造方法

Also Published As

Publication number Publication date
TWI668287B (zh) 2019-08-11
TW201608003A (zh) 2016-03-01
KR20150111864A (ko) 2015-10-06
JP6334223B2 (ja) 2018-05-30
JP2015183169A (ja) 2015-10-22

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