KR102366241B1 - 연마 헤드, 연마 헤드를 갖는 cmp 연마 장치 및 cmp 연마 장치를 이용한 반도체 집적회로 장치의 제조 방법 - Google Patents

연마 헤드, 연마 헤드를 갖는 cmp 연마 장치 및 cmp 연마 장치를 이용한 반도체 집적회로 장치의 제조 방법 Download PDF

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Publication number
KR102366241B1
KR102366241B1 KR1020170099002A KR20170099002A KR102366241B1 KR 102366241 B1 KR102366241 B1 KR 102366241B1 KR 1020170099002 A KR1020170099002 A KR 1020170099002A KR 20170099002 A KR20170099002 A KR 20170099002A KR 102366241 B1 KR102366241 B1 KR 102366241B1
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South Korea
Prior art keywords
airbag
polishing
wafer
spherical shape
polishing head
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Expired - Fee Related
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KR1020170099002A
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English (en)
Korean (ko)
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KR20180018356A (ko
Inventor
스케히로 야마모토
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에이블릭 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020170099002A 2016-08-10 2017-08-04 연마 헤드, 연마 헤드를 갖는 cmp 연마 장치 및 cmp 연마 장치를 이용한 반도체 집적회로 장치의 제조 방법 Expired - Fee Related KR102366241B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016157371A JP6713377B2 (ja) 2016-08-10 2016-08-10 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路装置の製造方法
JPJP-P-2016-157371 2016-08-10

Publications (2)

Publication Number Publication Date
KR20180018356A KR20180018356A (ko) 2018-02-21
KR102366241B1 true KR102366241B1 (ko) 2022-02-22

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KR1020170099002A Expired - Fee Related KR102366241B1 (ko) 2016-08-10 2017-08-04 연마 헤드, 연마 헤드를 갖는 cmp 연마 장치 및 cmp 연마 장치를 이용한 반도체 집적회로 장치의 제조 방법

Country Status (5)

Country Link
US (1) US10300577B2 (enExample)
JP (1) JP6713377B2 (enExample)
KR (1) KR102366241B1 (enExample)
CN (1) CN107717719B (enExample)
TW (1) TWI730154B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7158223B2 (ja) * 2018-09-20 2022-10-21 株式会社荏原製作所 研磨ヘッドおよび研磨装置
CN111168561B (zh) * 2019-12-26 2022-05-13 西安奕斯伟材料科技有限公司 研磨头及晶圆研磨装置
KR102304948B1 (ko) * 2020-01-13 2021-09-24 (주)제이쓰리 반도체 웨이퍼 형상을 제어하는 웨이퍼 가공용 헤드 장치
CN111993268A (zh) * 2020-08-24 2020-11-27 台州市老林装饰有限公司 一种晶圆研磨头装置
CN112677047A (zh) * 2020-12-09 2021-04-20 杭州蒙托机械科技有限公司 一种避免摇晃且能够吹散灰尘的小型抛光头保护装置
CN115673908B (zh) * 2023-01-03 2023-03-10 北京特思迪半导体设备有限公司 一种半导体基材抛光设备中晶圆压头及其设计方法

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JP2016010836A (ja) * 2014-06-30 2016-01-21 株式会社東芝 研磨装置、研磨方法、及び研磨パッド

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US4909877A (en) * 1987-01-31 1990-03-20 Kabushiki Kaisha Cubic Engineering Method for manufacturing sheet-formed buffer material using gelled material
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
JP3770956B2 (ja) * 1996-05-20 2006-04-26 松下電器産業株式会社 研磨装置及び研磨方法
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
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US6203414B1 (en) * 1997-04-04 2001-03-20 Tokyo Seimitsu Co., Ltd. Polishing apparatus
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co. Ltd., Mitaka Halbleiterscheibe Poliervorrichtung mit Halterring
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
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Also Published As

Publication number Publication date
TWI730154B (zh) 2021-06-11
US10300577B2 (en) 2019-05-28
KR20180018356A (ko) 2018-02-21
JP6713377B2 (ja) 2020-06-24
JP2018026453A (ja) 2018-02-15
US20180043496A1 (en) 2018-02-15
CN107717719B (zh) 2021-03-12
TW201805109A (zh) 2018-02-16
CN107717719A (zh) 2018-02-23

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