KR102362929B1 - 프로브 니들의 니들 팁 위치 조정 방법 및 검사 장치 - Google Patents

프로브 니들의 니들 팁 위치 조정 방법 및 검사 장치 Download PDF

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Publication number
KR102362929B1
KR102362929B1 KR1020207017822A KR20207017822A KR102362929B1 KR 102362929 B1 KR102362929 B1 KR 102362929B1 KR 1020207017822 A KR1020207017822 A KR 1020207017822A KR 20207017822 A KR20207017822 A KR 20207017822A KR 102362929 B1 KR102362929 B1 KR 102362929B1
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KR
South Korea
Prior art keywords
needle
probe
needle tip
image
camera
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KR1020207017822A
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English (en)
Korean (ko)
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KR20200090211A (ko
Inventor
신지로 와타나베
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20200090211A publication Critical patent/KR20200090211A/ko
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Publication of KR102362929B1 publication Critical patent/KR102362929B1/ko

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/022Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of tv-camera scanning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020207017822A 2017-12-01 2018-11-16 프로브 니들의 니들 팁 위치 조정 방법 및 검사 장치 KR102362929B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017231874A JP2019102640A (ja) 2017-12-01 2017-12-01 プローブ針の針先位置調整方法および検査装置
JPJP-P-2017-231874 2017-12-01
PCT/JP2018/042384 WO2019107173A1 (ja) 2017-12-01 2018-11-16 プローブ針の針先位置調整方法および検査装置

Publications (2)

Publication Number Publication Date
KR20200090211A KR20200090211A (ko) 2020-07-28
KR102362929B1 true KR102362929B1 (ko) 2022-02-14

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KR1020207017822A KR102362929B1 (ko) 2017-12-01 2018-11-16 프로브 니들의 니들 팁 위치 조정 방법 및 검사 장치

Country Status (5)

Country Link
JP (1) JP2019102640A (ja)
KR (1) KR102362929B1 (ja)
CN (1) CN111386595A (ja)
TW (1) TW201928364A (ja)
WO (1) WO2019107173A1 (ja)

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* Cited by examiner, † Cited by third party
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DE112020004743T5 (de) * 2019-10-31 2022-08-04 Baker Hughes Oilfield Operations Llc Tests und inspektionsverfahren und system
CN112684224A (zh) * 2020-12-29 2021-04-20 无锡圆方半导体测试有限公司 一种高效预防芯片焊点扎针偏移的方法及系统
TWI769698B (zh) * 2021-02-08 2022-07-01 鴻勁精密股份有限公司 取像裝置及其應用之作業設備
CN113687215B (zh) * 2021-08-04 2024-03-19 深圳市森美协尔科技有限公司 一种提高探针与晶圆测试点接触精度的方法及设备
CN114088979A (zh) * 2021-12-20 2022-02-25 百及纳米科技(上海)有限公司 探针校准方法、表面测量方法以及探针控制设备
JP2024010713A (ja) 2022-07-13 2024-01-25 東京エレクトロン株式会社 検査装置、検査方法及びプログラム

Citations (8)

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JP2000077502A (ja) * 1998-08-27 2000-03-14 Ando Electric Co Ltd 電子部品検査装置及び電子部品検査方法
JP2001144197A (ja) 1999-11-11 2001-05-25 Fujitsu Ltd 半導体装置、半導体装置の製造方法及び試験方法
JP2006177787A (ja) * 2004-12-22 2006-07-06 Matsushita Electric Ind Co Ltd 針圧調整用プローブカード、プローブ針の針圧調整方法および半導体装置の特性検査方法
JP2007010671A (ja) 2005-06-30 2007-01-18 Feinmetall Gmbh 被験体を電気的に検査する方法および装置ならびに検査時に使用される接触装置の製造方法
JP2007071765A (ja) 2005-09-08 2007-03-22 Tokyo Seimitsu Co Ltd プローブ位置測定のためのプローブ制御装置、及び、プローブ制御方法
JP2013003108A (ja) * 2011-06-21 2013-01-07 Panasonic Corp 半導体検査装置
JP2013137224A (ja) 2011-12-28 2013-07-11 Sharp Corp マルチチッププローバ、そのコンタクト位置補正方法、制御プログラムおよび可読記録媒体
JP2017183755A (ja) 2016-03-28 2017-10-05 株式会社東京精密 プローブカードの傾き検出方法及びプローバ

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JPH01119036A (ja) * 1987-10-31 1989-05-11 Canon Inc ウエハプローバ
JPH0536767A (ja) * 1991-08-01 1993-02-12 Tokyo Electron Yamanashi Kk プローブ装置
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JP2661872B2 (ja) * 1994-03-28 1997-10-08 東京エレクトロン株式会社 プローブ装置及びプロービング方法
JP2737744B2 (ja) * 1995-04-26 1998-04-08 日本電気株式会社 ウエハプロービング装置
JPH10247669A (ja) 1997-03-04 1998-09-14 Canon Inc ボンディングワイヤ検査装置および方法
JP4071461B2 (ja) * 2001-07-05 2008-04-02 大日本スクリーン製造株式会社 基板処理システム、基板処理装置、プログラム及び記録媒体
JP2005351807A (ja) * 2004-06-11 2005-12-22 Kawasaki Microelectronics Kk プローブカードおよびプローブカードの管理方法
US7538564B2 (en) * 2005-10-18 2009-05-26 Gsi Group Corporation Methods and apparatus for utilizing an optical reference
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP5374651B2 (ja) * 2010-03-12 2013-12-25 カスケード マイクロテック インコーポレイテッド 半導体試験システム
KR101891364B1 (ko) * 2011-02-01 2018-08-23 로셰 디아그노스틱스 헤마톨로지, 인크. 현미경 이미징에서의 빠른 오토-포커스
JP6445887B2 (ja) * 2015-02-09 2018-12-26 キヤノン株式会社 焦点調節装置、撮像装置およびこれらの制御方法、プログラム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077502A (ja) * 1998-08-27 2000-03-14 Ando Electric Co Ltd 電子部品検査装置及び電子部品検査方法
JP2001144197A (ja) 1999-11-11 2001-05-25 Fujitsu Ltd 半導体装置、半導体装置の製造方法及び試験方法
JP2006177787A (ja) * 2004-12-22 2006-07-06 Matsushita Electric Ind Co Ltd 針圧調整用プローブカード、プローブ針の針圧調整方法および半導体装置の特性検査方法
JP2007010671A (ja) 2005-06-30 2007-01-18 Feinmetall Gmbh 被験体を電気的に検査する方法および装置ならびに検査時に使用される接触装置の製造方法
JP2007071765A (ja) 2005-09-08 2007-03-22 Tokyo Seimitsu Co Ltd プローブ位置測定のためのプローブ制御装置、及び、プローブ制御方法
JP2013003108A (ja) * 2011-06-21 2013-01-07 Panasonic Corp 半導体検査装置
JP2013137224A (ja) 2011-12-28 2013-07-11 Sharp Corp マルチチッププローバ、そのコンタクト位置補正方法、制御プログラムおよび可読記録媒体
JP2017183755A (ja) 2016-03-28 2017-10-05 株式会社東京精密 プローブカードの傾き検出方法及びプローバ

Also Published As

Publication number Publication date
JP2019102640A (ja) 2019-06-24
TW201928364A (zh) 2019-07-16
WO2019107173A1 (ja) 2019-06-06
KR20200090211A (ko) 2020-07-28
CN111386595A (zh) 2020-07-07

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