KR102339249B1 - 액 처리 방법, 액 처리 장치 및 기억 매체 - Google Patents

액 처리 방법, 액 처리 장치 및 기억 매체 Download PDF

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Publication number
KR102339249B1
KR102339249B1 KR1020170062714A KR20170062714A KR102339249B1 KR 102339249 B1 KR102339249 B1 KR 102339249B1 KR 1020170062714 A KR1020170062714 A KR 1020170062714A KR 20170062714 A KR20170062714 A KR 20170062714A KR 102339249 B1 KR102339249 B1 KR 102339249B1
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KR
South Korea
Prior art keywords
liquid
processing
wafer
bevel
discharge nozzle
Prior art date
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KR1020170062714A
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English (en)
Korean (ko)
Other versions
KR20170137625A (ko
Inventor
데루히코 고다마
신고 가미토모
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20170137625A publication Critical patent/KR20170137625A/ko
Application granted granted Critical
Publication of KR102339249B1 publication Critical patent/KR102339249B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
KR1020170062714A 2016-06-03 2017-05-22 액 처리 방법, 액 처리 장치 및 기억 매체 KR102339249B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016111952A JP6696306B2 (ja) 2016-06-03 2016-06-03 液処理方法、液処理装置及び記憶媒体
JPJP-P-2016-111952 2016-06-03

Publications (2)

Publication Number Publication Date
KR20170137625A KR20170137625A (ko) 2017-12-13
KR102339249B1 true KR102339249B1 (ko) 2021-12-14

Family

ID=60657766

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170062714A KR102339249B1 (ko) 2016-06-03 2017-05-22 액 처리 방법, 액 처리 장치 및 기억 매체

Country Status (2)

Country Link
JP (1) JP6696306B2 (ja)
KR (1) KR102339249B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7117956B2 (ja) * 2018-09-20 2022-08-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339364A (ja) * 2005-06-01 2006-12-14 Toshiba Corp 洗浄方法及び洗浄装置
JP2010118519A (ja) * 2008-11-13 2010-05-27 Tokyo Electron Ltd ウエハの洗浄方法及び記憶媒体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179211A (ja) * 2002-11-25 2004-06-24 Nec Kansai Ltd レジスト塗布装置のエッジリンス機構
JP4601452B2 (ja) * 2005-02-22 2010-12-22 大日本スクリーン製造株式会社 基板処理装置
JP5729326B2 (ja) * 2012-02-14 2015-06-03 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5747842B2 (ja) * 2012-02-27 2015-07-15 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5835188B2 (ja) 2012-11-06 2015-12-24 東京エレクトロン株式会社 基板周縁部の塗布膜除去方法、基板処理装置及び記憶媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339364A (ja) * 2005-06-01 2006-12-14 Toshiba Corp 洗浄方法及び洗浄装置
JP2010118519A (ja) * 2008-11-13 2010-05-27 Tokyo Electron Ltd ウエハの洗浄方法及び記憶媒体

Also Published As

Publication number Publication date
JP2017220489A (ja) 2017-12-14
JP6696306B2 (ja) 2020-05-20
KR20170137625A (ko) 2017-12-13

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