KR102337600B1 - 템플레이트 어셈블리의 선별방법과 워크의 연마방법 및 템플레이트 어셈블리 - Google Patents

템플레이트 어셈블리의 선별방법과 워크의 연마방법 및 템플레이트 어셈블리 Download PDF

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KR102337600B1
KR102337600B1 KR1020187031793A KR20187031793A KR102337600B1 KR 102337600 B1 KR102337600 B1 KR 102337600B1 KR 1020187031793 A KR1020187031793 A KR 1020187031793A KR 20187031793 A KR20187031793 A KR 20187031793A KR 102337600 B1 KR102337600 B1 KR 102337600B1
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South Korea
Prior art keywords
template
template assembly
retaining ring
polishing
outer diameter
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Korean (ko)
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KR20190002506A (ko
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카즈야 사토
나오키 카미하마
히로마사 하시모토
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신에쯔 한도타이 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020187031793A 2016-05-13 2017-03-14 템플레이트 어셈블리의 선별방법과 워크의 연마방법 및 템플레이트 어셈블리 Active KR102337600B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016096794A JP6508123B2 (ja) 2016-05-13 2016-05-13 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JPJP-P-2016-096794 2016-05-13
PCT/JP2017/010203 WO2017195460A1 (ja) 2016-05-13 2017-03-14 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ

Publications (2)

Publication Number Publication Date
KR20190002506A KR20190002506A (ko) 2019-01-08
KR102337600B1 true KR102337600B1 (ko) 2021-12-10

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KR1020187031793A Active KR102337600B1 (ko) 2016-05-13 2017-03-14 템플레이트 어셈블리의 선별방법과 워크의 연마방법 및 템플레이트 어셈블리

Country Status (8)

Country Link
US (1) US11731236B2 (https=)
JP (1) JP6508123B2 (https=)
KR (1) KR102337600B1 (https=)
CN (1) CN109070308B (https=)
DE (1) DE112017002055B4 (https=)
SG (1) SG11201809720VA (https=)
TW (1) TWI722164B (https=)
WO (1) WO2017195460A1 (https=)

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JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP7070502B2 (ja) * 2019-05-16 2022-05-18 信越半導体株式会社 測定装置および研磨ヘッドの選定方法ならびにウエーハの研磨方法
JP7388324B2 (ja) * 2019-12-05 2023-11-29 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法、およびウェーハの片面研磨装置
CN114406896A (zh) * 2022-01-25 2022-04-29 上海江丰平芯电子科技有限公司 一种快速检测寿命的保持环及其使用方法
TW202543057A (zh) * 2024-02-27 2025-11-01 日商三菱綜合材料股份有限公司 晶圓保持用環構件

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WO2010119606A1 (ja) 2009-04-13 2010-10-21 信越半導体株式会社 研磨ヘッドの製造方法及び研磨装置
JP2014184511A (ja) 2013-03-22 2014-10-02 Shin Etsu Handotai Co Ltd テンプレートアセンブリ及びテンプレートアセンブリの製造方法
JP2014233815A (ja) 2013-06-04 2014-12-15 信越半導体株式会社 研磨ヘッドの製造方法及び研磨装置

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JP2000296461A (ja) * 1999-04-13 2000-10-24 Speedfam-Ipec Co Ltd バッキングパッド構造体
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JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ

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JP2009260142A (ja) 2008-04-18 2009-11-05 Panasonic Corp ウェハ研磨装置及びウェハ研磨方法
WO2010119606A1 (ja) 2009-04-13 2010-10-21 信越半導体株式会社 研磨ヘッドの製造方法及び研磨装置
JP2010247254A (ja) 2009-04-13 2010-11-04 Shin Etsu Handotai Co Ltd 研磨ヘッドの製造方法及び研磨装置
JP2014184511A (ja) 2013-03-22 2014-10-02 Shin Etsu Handotai Co Ltd テンプレートアセンブリ及びテンプレートアセンブリの製造方法
JP2014233815A (ja) 2013-06-04 2014-12-15 信越半導体株式会社 研磨ヘッドの製造方法及び研磨装置

Also Published As

Publication number Publication date
TWI722164B (zh) 2021-03-21
TW201805115A (zh) 2018-02-16
CN109070308B (zh) 2021-01-12
SG11201809720VA (en) 2018-12-28
US20190126431A1 (en) 2019-05-02
JP6508123B2 (ja) 2019-05-08
KR20190002506A (ko) 2019-01-08
DE112017002055B4 (de) 2024-06-06
US11731236B2 (en) 2023-08-22
JP2017202556A (ja) 2017-11-16
DE112017002055T5 (de) 2018-12-27
CN109070308A (zh) 2018-12-21
WO2017195460A1 (ja) 2017-11-16

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