KR102334672B1 - 경화성 조성물 및 전자 부품 - Google Patents

경화성 조성물 및 전자 부품 Download PDF

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Publication number
KR102334672B1
KR102334672B1 KR1020150077780A KR20150077780A KR102334672B1 KR 102334672 B1 KR102334672 B1 KR 102334672B1 KR 1020150077780 A KR1020150077780 A KR 1020150077780A KR 20150077780 A KR20150077780 A KR 20150077780A KR 102334672 B1 KR102334672 B1 KR 102334672B1
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KR
South Korea
Prior art keywords
peroxide
curable composition
meth
acrylate
ethylenically unsaturated
Prior art date
Application number
KR1020150077780A
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English (en)
Korean (ko)
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KR20150139454A (ko
Inventor
가즈노부 후쿠시마
마사키 사사키
가즈타카 나카다
다이사쿠 스토
겐타로 오부치
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Publication of KR20150139454A publication Critical patent/KR20150139454A/ko
Application granted granted Critical
Publication of KR102334672B1 publication Critical patent/KR102334672B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
KR1020150077780A 2014-06-03 2015-06-02 경화성 조성물 및 전자 부품 KR102334672B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2014-115315 2014-06-03
JP2014115315 2014-06-03
JPJP-P-2014-162882 2014-08-08
JP2014162882 2014-08-08
JPJP-P-2015-021064 2015-02-05
JP2015021064 2015-02-05

Publications (2)

Publication Number Publication Date
KR20150139454A KR20150139454A (ko) 2015-12-11
KR102334672B1 true KR102334672B1 (ko) 2021-12-06

Family

ID=55020600

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150077780A KR102334672B1 (ko) 2014-06-03 2015-06-02 경화성 조성물 및 전자 부품

Country Status (3)

Country Link
KR (1) KR102334672B1 (zh)
CN (1) CN105295763B (zh)
TW (1) TWI669374B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101716551B1 (ko) 2014-11-27 2017-03-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치
KR20170038691A (ko) * 2015-09-30 2017-04-07 다이요 잉키 세이조 가부시키가이샤 도전성 접착제와 그의 제조 방법, 경화물 및 전자 부품
JP2017145382A (ja) * 2016-02-15 2017-08-24 太陽インキ製造株式会社 導電性接着剤とその製造方法、硬化物および電子部品
JP6710120B2 (ja) * 2015-09-30 2020-06-17 太陽インキ製造株式会社 導電性接着剤、電子部品および電子部品の製造方法
JP2018060788A (ja) * 2016-09-30 2018-04-12 太陽インキ製造株式会社 導電性接着剤、硬化物および電子部品
TWI761477B (zh) * 2017-03-30 2022-04-21 日商太陽油墨製造股份有限公司 導電性接著劑、硬化物、電子零件及電子零件之製造方法
KR102208045B1 (ko) * 2018-12-13 2021-01-26 황진상 접착증진제를 포함한 자외선경화형 접착제 수지조성물의 제조방법 및 이에 의하여 제조되는 자외선경화형 접착제 수지조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226140A (ja) 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法
JP2012186161A (ja) 2011-02-17 2012-09-27 Sekisui Chem Co Ltd 異方性導電材料、接続構造体及び接続構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5428860B2 (ja) * 2007-09-25 2014-02-26 株式会社スリーボンド 嫌気硬化性組成物
JP5561454B2 (ja) * 2008-05-23 2014-07-30 スリーボンドファインケミカル株式会社 硬化型樹脂組成物
JP5760170B2 (ja) 2010-11-30 2015-08-05 パナソニックＩｐマネジメント株式会社 はんだペースト
JP2013051353A (ja) 2011-08-31 2013-03-14 Tamura Seisakusho Co Ltd 配線基板の接続方法
WO2014010524A1 (ja) * 2012-07-11 2014-01-16 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226140A (ja) 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法
KR101355709B1 (ko) * 2010-06-15 2014-01-27 데쿠세리아루즈 가부시키가이샤 접속 구조체의 제조 방법 및 그로부터 제조된 접속 구조체
JP2012186161A (ja) 2011-02-17 2012-09-27 Sekisui Chem Co Ltd 異方性導電材料、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
TWI669374B (zh) 2019-08-21
CN105295763A (zh) 2016-02-03
TW201606045A (zh) 2016-02-16
CN105295763B (zh) 2019-05-14
KR20150139454A (ko) 2015-12-11

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