JP5428860B2 - 嫌気硬化性組成物 - Google Patents
嫌気硬化性組成物 Download PDFInfo
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- JP5428860B2 JP5428860B2 JP2009534333A JP2009534333A JP5428860B2 JP 5428860 B2 JP5428860 B2 JP 5428860B2 JP 2009534333 A JP2009534333 A JP 2009534333A JP 2009534333 A JP2009534333 A JP 2009534333A JP 5428860 B2 JP5428860 B2 JP 5428860B2
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- 239000000203 mixture Substances 0.000 title claims description 29
- -1 N, N-diethyl-N-methyl (2-methoxyethyl) ammonium bis (trifluoromethanesulfonyl) imide salt Chemical class 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- 239000002608 ionic liquid Substances 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 4
- SZBRISJDXSIRRE-UHFFFAOYSA-M 1-butyl-3-methylpyridin-1-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]1=CC=CC(C)=C1 SZBRISJDXSIRRE-UHFFFAOYSA-M 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
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- IDTCZPKYVMKLRZ-UHFFFAOYSA-N 1-(2-methoxyethyl)-1-methylpyrrolidin-1-ium Chemical compound COCC[N+]1(C)CCCC1 IDTCZPKYVMKLRZ-UHFFFAOYSA-N 0.000 description 3
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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- DNJIEGIFACGWOD-UHFFFAOYSA-N ethanethiol Chemical compound CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- UICBCXONCUFSOI-UHFFFAOYSA-N n'-phenylacetohydrazide Chemical compound CC(=O)NNC1=CC=CC=C1 UICBCXONCUFSOI-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- PBIMIGNDTBRRPI-UHFFFAOYSA-N trifluoro borate Chemical compound FOB(OF)OF PBIMIGNDTBRRPI-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- FNQJDLTXOVEEFB-UHFFFAOYSA-N 1,2,3-benzothiadiazole Chemical compound C1=CC=C2SN=NC2=C1 FNQJDLTXOVEEFB-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
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- USOIOQCOUFEVEB-UHFFFAOYSA-M 1-butyl-2,3-dimethylimidazol-3-ium;bromide Chemical compound [Br-].CCCCN1C=C[N+](C)=C1C USOIOQCOUFEVEB-UHFFFAOYSA-M 0.000 description 1
- HHHYPTORQNESCU-UHFFFAOYSA-M 1-butyl-2,3-dimethylimidazol-3-ium;chloride Chemical compound [Cl-].CCCCN1C=C[N+](C)=C1C HHHYPTORQNESCU-UHFFFAOYSA-M 0.000 description 1
- KSOGGGZFEJTGPZ-UHFFFAOYSA-M 1-butyl-2,3-dimethylimidazol-3-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]=1C=CN(C)C=1C KSOGGGZFEJTGPZ-UHFFFAOYSA-M 0.000 description 1
- HOISBTKPPVRFDS-UHFFFAOYSA-M 1-decyl-3-methylimidazol-3-ium;bromide Chemical compound [Br-].CCCCCCCCCC[N+]=1C=CN(C)C=1 HOISBTKPPVRFDS-UHFFFAOYSA-M 0.000 description 1
- HTZVLLVRJHAJJF-UHFFFAOYSA-M 1-decyl-3-methylimidazolium chloride Chemical compound [Cl-].CCCCCCCCCCN1C=C[N+](C)=C1 HTZVLLVRJHAJJF-UHFFFAOYSA-M 0.000 description 1
- WDXRMHIGMAONJV-UHFFFAOYSA-N 1-ethyl-2,3-dimethyl-2h-imidazole Chemical compound CCN1C=CN(C)C1C WDXRMHIGMAONJV-UHFFFAOYSA-N 0.000 description 1
- NUJYCYLTUXYHQU-UHFFFAOYSA-M 1-ethyl-2,3-dimethylimidazol-3-ium;chloride Chemical compound [Cl-].CCN1C=C[N+](C)=C1C NUJYCYLTUXYHQU-UHFFFAOYSA-M 0.000 description 1
- BGSUDDILQRFOKZ-UHFFFAOYSA-M 1-hexyl-3-methylimidazol-3-ium;bromide Chemical compound [Br-].CCCCCCN1C=C[N+](C)=C1 BGSUDDILQRFOKZ-UHFFFAOYSA-M 0.000 description 1
- RABFGPMWVQNDHI-UHFFFAOYSA-M 1-hexyl-3-methylimidazol-3-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCCCC[N+]=1C=CN(C)C=1 RABFGPMWVQNDHI-UHFFFAOYSA-M 0.000 description 1
- NKRASMXHSQKLHA-UHFFFAOYSA-M 1-hexyl-3-methylimidazolium chloride Chemical compound [Cl-].CCCCCCN1C=C[N+](C)=C1 NKRASMXHSQKLHA-UHFFFAOYSA-M 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
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- 150000003949 imides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KTQDYGVEEFGIIL-UHFFFAOYSA-N n-fluorosulfonylsulfamoyl fluoride Chemical compound FS(=O)(=O)NS(F)(=O)=O KTQDYGVEEFGIIL-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 229940070891 pyridium Drugs 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Description
ニッケル粉末は平均粒径15μmの鱗片状粉末である、HCA−1(日興リカ社製)を使用した。銀粉末は微小球状の銀粒子であり、一次粒子径0.3μmである三井金属鉱業株式会社製のものを使用した。
これらの結果を表1〜4に記載する。
尚、抵抗値を「×」と示したものは、抵抗値測定限界を超えたことを意味する。
本出願は、2007年9月25日出願の日本特許出願2007−247763に基づくものであり、その内容はここに参照として取り込まれる。
Claims (3)
- (a)分子中に少なくとも1つ以上のラジカル重合性官能基を有する化合物、(b)有機過酸化物、(c)o−ベンゾイックスルフィミド、(d)イオン液体化合物:(a)成分100重量部に対し1〜40重量部、(e)銀粉末及びニッケル粉末の少なくとも一方から選ばれる導電性粉末:(a)成分100重量部に対し0.1〜10重量部、からなることを特徴とする嫌気硬化性組成物。
- 前記(a)成分として水酸基含有(メタ)アクリレートを含有する請求項1に記載の嫌気硬化性組成物。
- 前記(d)成分としてN,N−ジエチル−N−メチル(2−メトキシエチル)アンモニウム ビス(トリフルオロメタンスルホニル)イミド塩、N,N−ジエチル−N−メチル(2−メトキシエチル)アンモニウム テトラフルオロボレート塩、および1−ブチル−3−メチルピリジウム トリフルオロメタンスルホネート塩から選択される請求項1に記載の嫌気硬化性組成物。
Priority Applications (1)
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JP2009534333A JP5428860B2 (ja) | 2007-09-25 | 2008-09-24 | 嫌気硬化性組成物 |
Applications Claiming Priority (4)
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JP2007247763 | 2007-09-25 | ||
JP2007247763 | 2007-09-25 | ||
JP2009534333A JP5428860B2 (ja) | 2007-09-25 | 2008-09-24 | 嫌気硬化性組成物 |
PCT/JP2008/067206 WO2009041445A1 (ja) | 2007-09-25 | 2008-09-24 | 嫌気硬化性組成物 |
Publications (2)
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JPWO2009041445A1 JPWO2009041445A1 (ja) | 2011-01-27 |
JP5428860B2 true JP5428860B2 (ja) | 2014-02-26 |
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JP (1) | JP5428860B2 (ja) |
CN (1) | CN101809041B (ja) |
WO (1) | WO2009041445A1 (ja) |
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CA2760462C (en) * | 2009-05-01 | 2017-05-30 | Henkel Corporation | Cure accelerators for anaerobic curable compositions |
CN102559069B (zh) * | 2010-12-16 | 2014-03-12 | 湖北回天胶业股份有限公司 | 一种高触变抗冻融预涂型厌氧胶及其制备方法 |
KR102334672B1 (ko) * | 2014-06-03 | 2021-12-06 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 조성물 및 전자 부품 |
JP2016035044A (ja) * | 2014-06-03 | 2016-03-17 | 太陽インキ製造株式会社 | 導電性接着剤および電子部品 |
US10174886B2 (en) * | 2015-07-31 | 2019-01-08 | Sharp Kabushiki Kaisha | Wavelength conversion member and light emitting device |
CN108779190B (zh) * | 2016-03-10 | 2024-02-09 | 三键有限公司 | 厌氧固化性树脂组合物 |
WO2020050169A1 (ja) * | 2018-09-03 | 2020-03-12 | 日東電工株式会社 | 粘着剤組成物、粘着シート、及び接合体 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11323261A (ja) * | 1998-05-11 | 1999-11-26 | Three Bond Co Ltd | ハードディスクドライブの磁気ヘッドの製造用接着剤組成物 |
JP2003313206A (ja) * | 2002-04-22 | 2003-11-06 | Three Bond Co Ltd | 嫌気硬化性組成物 |
JP2005220317A (ja) * | 2004-02-09 | 2005-08-18 | Tokai Rubber Ind Ltd | 電子写真機器用導電性組成物およびその製法、ならびにそれを用いた電子写真機器用導電性部材 |
JP2005298661A (ja) * | 2004-04-12 | 2005-10-27 | Shin Etsu Chem Co Ltd | 室温硬化型導電性シリコーンゴム組成物 |
JP2006335995A (ja) * | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
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CN100398568C (zh) * | 2003-07-25 | 2008-07-02 | 株式会社三键 | 厌氧固化性组合物 |
JP4967276B2 (ja) * | 2005-08-09 | 2012-07-04 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
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- 2008-09-24 WO PCT/JP2008/067206 patent/WO2009041445A1/ja active Application Filing
- 2008-09-24 JP JP2009534333A patent/JP5428860B2/ja active Active
- 2008-09-24 CN CN2008801087170A patent/CN101809041B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11323261A (ja) * | 1998-05-11 | 1999-11-26 | Three Bond Co Ltd | ハードディスクドライブの磁気ヘッドの製造用接着剤組成物 |
JP2003313206A (ja) * | 2002-04-22 | 2003-11-06 | Three Bond Co Ltd | 嫌気硬化性組成物 |
JP2005220317A (ja) * | 2004-02-09 | 2005-08-18 | Tokai Rubber Ind Ltd | 電子写真機器用導電性組成物およびその製法、ならびにそれを用いた電子写真機器用導電性部材 |
JP2005298661A (ja) * | 2004-04-12 | 2005-10-27 | Shin Etsu Chem Co Ltd | 室温硬化型導電性シリコーンゴム組成物 |
JP2006335995A (ja) * | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
Also Published As
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WO2009041445A1 (ja) | 2009-04-02 |
JPWO2009041445A1 (ja) | 2011-01-27 |
CN101809041B (zh) | 2012-11-28 |
CN101809041A (zh) | 2010-08-18 |
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