WO2009041445A1 - 嫌気硬化性組成物 - Google Patents

嫌気硬化性組成物 Download PDF

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Publication number
WO2009041445A1
WO2009041445A1 PCT/JP2008/067206 JP2008067206W WO2009041445A1 WO 2009041445 A1 WO2009041445 A1 WO 2009041445A1 JP 2008067206 W JP2008067206 W JP 2008067206W WO 2009041445 A1 WO2009041445 A1 WO 2009041445A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
parts
anaerobically curable
curable composition
component
Prior art date
Application number
PCT/JP2008/067206
Other languages
English (en)
French (fr)
Inventor
Mitsuhiro Kaneta
Original Assignee
Three Bond Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Co., Ltd. filed Critical Three Bond Co., Ltd.
Priority to CN2008801087170A priority Critical patent/CN101809041B/zh
Priority to JP2009534333A priority patent/JP5428860B2/ja
Publication of WO2009041445A1 publication Critical patent/WO2009041445A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/062—Copolymers with monomers not covered by C09D133/06
    • C09D133/066—Copolymers with monomers not covered by C09D133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

　本発明は保存安定性と接着性に優れた、導電性を有する嫌気硬化性接着剤に関するものである。本発明は、（ａ）分子中に少なくとも１つ以上のラジカル重合性官能基を有する化合物、（ｂ）有機過酸化物、（ｃ）ｏ－ベンゾイックスルフィミド、（ｄ）イオン液体化合物：（ａ）成分１００重量部に対し１～４０重量部、（ｅ）導電性粉末：（ａ）成分１００重量部に対し０．１～１０重量部、からなることを特徴とする嫌気硬化性組成物を提供する。
PCT/JP2008/067206 2007-09-25 2008-09-24 嫌気硬化性組成物 WO2009041445A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801087170A CN101809041B (zh) 2007-09-25 2008-09-24 厌氧固化性组合物
JP2009534333A JP5428860B2 (ja) 2007-09-25 2008-09-24 嫌気硬化性組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-247763 2007-09-25
JP2007247763 2007-09-25

Publications (1)

Publication Number Publication Date
WO2009041445A1 true WO2009041445A1 (ja) 2009-04-02

Family

ID=40511328

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067206 WO2009041445A1 (ja) 2007-09-25 2008-09-24 嫌気硬化性組成物

Country Status (3)

Country Link
JP (1) JP5428860B2 (ja)
CN (1) CN101809041B (ja)
WO (1) WO2009041445A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102559069A (zh) * 2010-12-16 2012-07-11 湖北回天胶业股份有限公司 一种高触变抗冻融预涂型厌氧胶及其制备方法
JP2012525417A (ja) * 2009-05-01 2012-10-22 ヘンケル コーポレイション 嫌気硬化性組成物用の硬化促進剤
JP2016035044A (ja) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 導電性接着剤および電子部品
WO2020050169A1 (ja) * 2018-09-03 2020-03-12 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102334672B1 (ko) * 2014-06-03 2021-12-06 다이요 잉키 세이조 가부시키가이샤 경화성 조성물 및 전자 부품
US10174886B2 (en) * 2015-07-31 2019-01-08 Sharp Kabushiki Kaisha Wavelength conversion member and light emitting device
CN108779190B (zh) * 2016-03-10 2024-02-09 三键有限公司 厌氧固化性树脂组合物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11323261A (ja) * 1998-05-11 1999-11-26 Three Bond Co Ltd ハードディスクドライブの磁気ヘッドの製造用接着剤組成物
JP2003313206A (ja) * 2002-04-22 2003-11-06 Three Bond Co Ltd 嫌気硬化性組成物
JP2005220317A (ja) * 2004-02-09 2005-08-18 Tokai Rubber Ind Ltd 電子写真機器用導電性組成物およびその製法、ならびにそれを用いた電子写真機器用導電性部材
JP2005298661A (ja) * 2004-04-12 2005-10-27 Shin Etsu Chem Co Ltd 室温硬化型導電性シリコーンゴム組成物
JP2006335995A (ja) * 2005-06-06 2006-12-14 Hitachi Maxell Ltd インクジェット用導電性インク、導電性パターンおよび導電体
JP2007045900A (ja) * 2005-08-09 2007-02-22 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100398568C (zh) * 2003-07-25 2008-07-02 株式会社三键 厌氧固化性组合物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11323261A (ja) * 1998-05-11 1999-11-26 Three Bond Co Ltd ハードディスクドライブの磁気ヘッドの製造用接着剤組成物
JP2003313206A (ja) * 2002-04-22 2003-11-06 Three Bond Co Ltd 嫌気硬化性組成物
JP2005220317A (ja) * 2004-02-09 2005-08-18 Tokai Rubber Ind Ltd 電子写真機器用導電性組成物およびその製法、ならびにそれを用いた電子写真機器用導電性部材
JP2005298661A (ja) * 2004-04-12 2005-10-27 Shin Etsu Chem Co Ltd 室温硬化型導電性シリコーンゴム組成物
JP2006335995A (ja) * 2005-06-06 2006-12-14 Hitachi Maxell Ltd インクジェット用導電性インク、導電性パターンおよび導電体
JP2007045900A (ja) * 2005-08-09 2007-02-22 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012525417A (ja) * 2009-05-01 2012-10-22 ヘンケル コーポレイション 嫌気硬化性組成物用の硬化促進剤
CN102559069A (zh) * 2010-12-16 2012-07-11 湖北回天胶业股份有限公司 一种高触变抗冻融预涂型厌氧胶及其制备方法
CN102559069B (zh) * 2010-12-16 2014-03-12 湖北回天胶业股份有限公司 一种高触变抗冻融预涂型厌氧胶及其制备方法
JP2016035044A (ja) * 2014-06-03 2016-03-17 太陽インキ製造株式会社 導電性接着剤および電子部品
WO2020050169A1 (ja) * 2018-09-03 2020-03-12 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体

Also Published As

Publication number Publication date
JPWO2009041445A1 (ja) 2011-01-27
JP5428860B2 (ja) 2014-02-26
CN101809041B (zh) 2012-11-28
CN101809041A (zh) 2010-08-18

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