KR102289103B1 - Opening apparatus for electronic device handler - Google Patents

Abstract

The present invention relates to an opening device for an electronic component handler.
The opening device for an electronic component handler according to the present invention has an opener capable of opening the loading module of the carrier frame by having a first opening bar and a second opening bar that can be narrowed or spread apart from each other, or an electronic component with a low height It has a support plate and an adjustment member that supports the lower end of the picking device and helps the unloading operation of the picking device.
According to the present invention, the versatility of the opening device is expanded, so that recycling of resources, prevention of waste of resources, reduction of replacement cost, and improvement of operation rate are effective.

Description

OPENING APPARATUS FOR ELECTRONIC DEVICE HANDLER

To a handler for handling electronic components, and more particularly to an opening device for opening a carrier frame capable of loading electronic components.

Module IC (also called 'Module IC') is an independent circuit by fixing a plurality of ICs and other elements to one or both sides of a board. This is expensive.

Therefore, strict performance tests must be performed after the product is finished and before shipment.

In order to test such a module IC, a handler capable of electrically connecting the module IC to the tester in addition to the tester is required.

The handler loads and loads the module IC onto the carrier frame by the pickup device in the loading section, and then transfers the carrier frame loaded with the module IC to the test chamber by the transport device to test the module ICs loaded on the carrier frame. The carrier frame, which has been tested and loaded with module ICs, is transferred to the sorting unit by another transfer device, and then a series of unloading operations are performed while classifying the module ICs according to the test results.

In order to unload the module IC from the carrier frame in the above series of processes, the carrier frame must be opened by a separate opening device. Therefore, the handler must be configured with an opening device for opening the carrier frame.

Korean Patent Application Laid-Open Nos. 10-2011-0136312 and 10-2014-0072847 disclose technologies related to the aforementioned opening devices (hereinafter referred to as 'prior art technologies').

The prior art has a structure in which the guide rod of the adjustment plate is inserted into the guide groove of the pressing member in the carrier frame (referred to as 'carrier board' in the prior art) when the adjustment plate is raised, while pushing the pressing member to one side to open the carrier frame have

However, the above prior art can be appropriately applied when all the specifications of the electronic components to be tested are the same.

First, when an electronic component having a width different from that of the previously tested electronic component is to be tested, the position of the guide rod must be changed, so the adjustment plate provided with the guide rod must be replaced. For this reason, there is no recyclability of resources, and ultimately, the production cost increases, and the waste of manpower and a decrease in the operation rate due to the input of replacement time are accompanied.

Second, when an electronic component having a different height from the previously tested electronic component needs to be tested, there is practically no other solution. In particular, if the height of the electronic component to be loaded on the carrier frame is lower than the height of the socket, it is difficult to replace the carrier frame or at least the socket.

The object of the present invention has the following objects.

First, it provides a technology for an opening device that can be applied to electronic components of various widths.

Second, it provides a technology for an opening device that can be applied to electronic components of various heights.

An opening device for an electronic component handler according to a first aspect of the present invention includes: a lifting frame capable of ascending or descending toward a carrier frame capable of loading electronic components; an elevating source for elevating the elevating frame; an opener installed on the elevating frame and opening the carrier frame to unload electronic components from the carrier frame; and a first opening bar and a second opening bar for opening the loading modules comprising the first loading member and the second loading member provided in pairs on the carrier frame; and a power source installed on the elevating frame to provide power to widen the gap between the first open bar and the second open bar; Including, wherein the first opening bar has a first step for hanging the first loading members at once when the lifting frame is raised, the second opening bar is the second loading members when the lifting frame is raised When the power source operates by having a second step that hangs at once, the gap between the first open bar and the second open bar is widened, and in conjunction with this, the distance between the first loading members and the second loading members is widened, and ultimately the loading module are open

The power source is preferably provided with a motor capable of variously changing the distance between the first open bar and the second open bar so that the carrier frame can load electronic components of different sizes with different widths.

The opening device may include: a support plate for supporting electronic components mounted on the carrier frame when the elevating frame is raised toward the carrier frame; and an adjustment member for adjusting the height of the support plate so that the support plate can support the lower ends of electronic components having different heights. may further include.

An opening device for an electronic component handler according to a second aspect of the present invention includes: an elevating frame capable of advancing toward a carrier frame capable of loading an electronic component or retreating in the opposite direction; an elevating source for elevating the elevating frame; an opener installed on the elevating frame and opening the carrier frame to unload electronic components from the carrier frame; a support plate for supporting electronic components mounted on the carrier frame when the elevating frame is raised toward the carrier frame; and an adjustment member for adjusting the height of the support plate so that the electronic component can be raised. includes

According to the present invention, it is possible to handle electronic parts of various widths and heights without replacing parts, so that versatility is increased, so there is an effect that recycling of resources, prevention of waste of resources, reduction of replacement cost, and improvement of operation rate can be achieved.

1 is a perspective view of a carrier frame paired with an opening device according to the present invention.
Figure 2 is a perspective view of the loading module applied to the carrier frame of Figure 1;
3 is a perspective view of an opening device for an electronic component handler according to the present invention.
FIG. 4 is an excerpted perspective view of an opener applied to the opening device of FIG. 3 .
5 is an excerpted perspective view of a support plate and an adjustment source applied to the opening device of FIG. 3 .
6 and 7 are reference views for explaining the operation of loading electronic components into the loading module.
8 is a reference view for explaining a state immediately before the opening of the loading module when handling a high electronic component.
9 is a reference diagram for explaining a state immediately before the opening of the loading module when handling electronic components with a low height.
FIG. 10 is a reference view for explaining a state in which the loading module is further opened in FIG. 9 .
11 is a reference view for explaining the operation of the support plate and the adjustment source.

A preferred embodiment according to the present invention will be described with reference to the accompanying drawings, but for the sake of brevity of the description, descriptions of overlapping or substantially the same components are omitted or compressed as much as possible.

<Description of the carrier frame>

Prior to the description of the opening device for an electronic component handler (hereinafter abbreviated as 'opening device') according to the present invention, a carrier frame on which electronic components are loaded will be described.

1 is a perspective view of a carrier frame (CF) paired with an opening device according to the present invention.

The carrier frame CF may be opened by an opening device to unload the electronic component ED, or may be closed to hold the loaded electronic component.

The carrier frame CF is provided with a plurality of loading modules LM for loading the electronic components ED as shown in detail in FIG. 2 . The opening and closing of the loading module (LM) ultimately means the opening and closing of the carrier frame (CF).

Each loading module (LM) has a first loading member (L1) and a second loading member (L2), the first loading member (L1) grips one side (left side in the drawing) of the electronic component (ED), The second loading member L2 holds the other side (the right side in the drawing) of the electronic component ED. That is, when the gap between the first loading member (L1) and the second loading member (L2) is widened by the opening device, the loading module (LM) is opened, and the first loading member (L1) and the second loading member (L2) When the gap between them is narrowed, the loading module LM is closed and both sides of the electronic component ED are gripped. Here, the first loading member (L1) and the second loading member (L2) to enable the opening by the opening device (L2) is formed with a locking jaw (J) that can be caught by the opening bars to be described later, the loading module (LM) is closed For this, the first loading member (L1) and the second loading member (L2) are elastically supported in a direction in which the distance between each other is narrowed by the spring (S).

<Description of the opening device>

3 is a perspective view of an opening device for an electronic component handler 100 (hereinafter abbreviated as 'opening device') according to the present invention.

The opening device 100 includes a lift frame 110 , a lift source 120 , an opener 130 , a support plate 140 , and an adjustment source 150 .

The elevating frame 110 is provided so as to ascend or descend in the opposite direction toward the carrier frame CF.

The elevating source 120 may be provided as a cylinder, and elevates the elevating frame 110 .

The opener 130 is installed in the elevating frame 110 , and opens the carrier frame CF to unload the electronic component ED from the carrier frame CF. For this purpose, as shown in the excerpt of FIG. 4 , the opener 130 includes a first open bar 131 , a second open bar 132 , a gap adjustment belt 133 and a power source 134 .

The first open bar 131 and the second open bar 132 are provided to face each other, and are coupled to the gap adjustment belt 133 to move in opposite directions, so that when the power source 134 operates, the guide rail ( The distance between them is widened or narrowed while moving under the guidance of GL). Here, the first opening bar 131 is provided with a first stepping end 131a for hanging the locking jaws J of the first loading members L1 at once, and the second opening bar 132 is the second loading member ( A second step (132a) for hanging the locking jaws (J) of the L2) is provided at once.

The gap adjustment belt 133 transmits the driving force of the power source 134 to the first open bar 131 and the second open bar 132 by rotating the drive pulley DP and the driven pulley PP as a rotation return point in a forward and reverse direction. do.

The power source 134 provides power to widen the gap between the first open bar 131 and the second open bar 132 so that it can correspond to the widths of various electronic components ED having different widths. It is provided with a motor capable of adjusting the degree of the gap between the first open bar 131 and the second open bar 132 . Accordingly, the distance between the first open bar 131 and the second open bar 132 may be variously changed according to the rotation amount of the motor which is the power source 134 .

Next, with reference to the excerpt of FIG. 5 , the support plate 140 and the adjustment source 150 will be described.

The support plate 140 supports the electronic component ED mounted on the carrier frame CF. Gripping grooves 141 for holding the lower end of the electronic component ED as many as the number of the electronic component ED to be supported are formed in the support plate 140 .

The adjuster 150 adjusts the elevation height of the support plate 140 so that the support plate 140 can support the lower ends of electronic components (ED) having different heights from each other. The adjustment source 150 may be provided as a cylinder, but it is preferably provided with a motor so as to adjust the elevation height of the support plate 140 in order to help gripping or release of the electronic component ED by a picking device, which will be described later. .

Subsequently, the operation of the opening device 100 as described above will be described.

For reference, when the electronic component ED is loaded on the carrier frame CF, the picking device loads the electronic component ED onto the loading module LM. At this time, while the electronic components are loaded from the state of FIG. 6 to the state of FIG. 7 , the first loading member L1 and the second loading member constituting the loading module LM by the descending force of the picking device PA (L2) is spread in the direction of the arrow of FIG. 7 by the electronic component (ED) that is forcibly loaded while overcoming the elastic force of the spring (S), and when the loading of the electronic component (ED) is completed, the compressed spring (S) The loading module (LM) is closed while the elastic force is applied in a direction in which the gap between the first loading member (L1) and the second loading member (L2) is narrowed. Accordingly, an operation (loading operation) of the picking apparatus PA to load the electronic component ED on the carrier frame CF may be performed independently of the opening apparatus 100 .

1. Operation example 1 regarding unloading - when the height of the electronic component is high

As in FIGS. 6 and 7 , when the height of the electronic component ED is high, the picking device PA can hold the electronic component ED even when the electronic component ED is loaded in the loading module LM. Therefore, the operation of the support plate 140 and the adjustment source 150 is not required.

In this operation example, when the lifting plate 110 rises toward the carrier frame CF, as shown in FIG. 8 , the step end 131a of the first open bar 131 and the step end 132a of the second open bar 132 . ) is located at a height that can be caught on the engaging projection (J) of the first loading member (L1) and the second loading member (L2), respectively. And in the state of FIG. 8 , the opener 130 operates to widen the gap between the first open bar 131 and the second open bar 132 in the direction of the arrow, so that the loading modules LM are opened, and in this state, picking The device PA unloads the electronic components ED.

2. 2nd operation example related to unloading - when the height of the electronic component is low

When the height of the electronic component ED is low, the area to be gripped by the picking device PA is insufficient. Therefore, the operation of the support plate 140 and the adjustment source 150 is required.

Even in this operation example, when the lifting plate 110 rises toward the carrier frame CF, as shown in FIG. 9 , the step 131a of the first open bar 131 and the step end 132a of the second open bar 132 . ) is located at a height that can be caught on the engaging projection (J) of the first loading member (L1) and the second loading member (L2), respectively. And as the opening unit 130 operates to widen the gap between the first opening bar 131 and the second opening bar 132, the loading modules LM are opened as in FIG. 10, and in this state, as in FIG. Similarly, the adjustment source 150 operates to raise the support plate 140 . Accordingly, the picking device PA is in a state capable of gripping both upper ends of the electronic component ED, and in this state, the unloading operation is performed by the picking device PA.

For reference, in this example, only when the picking device PA unloads the electronic component ED from the carrier frame CF is considered. However, depending on implementation, it may be sufficiently considered that the opening device 100 is applied to the loading area for a loading operation of loading the electronic component ED into the carrier frame CF. For example, by providing the opening device 100 in the loading area, and after widening the gap between the first loading member L1 and the second loading member L2 by the opening device 100, the electronic component ED is loaded. which can be considered preferable. At this time, the electronic component ED has a downward flow while the positions of the guide rails formed in the vertical direction in the first loading member L1 and the second loading member L2 are used as guide rails. Here, the lower end of each of the loading members L1 and L2 is configured to support the lower end of the outer side of the lower edge of the electronic component ED. Of course, when the loading of the electronic component ED is made, the gripping of the electronic component ED is released from the picking device PA, so that when the electronic component ED falls, the support plate 140 rises in advance to a certain position. After receiving the electronic component ED in advance, the support plate 140 is lowered so that the electronic component ED can be stably loaded onto the loading module LM.

For reference, there may be a state as shown in FIG. 11 even during loading, and at this time, when the picking device PA releases the grip of the electronic component ED, the electronic component ED freely falls, and the loading members L1 and L2 ) by slightly widening the gap between the loading members (L1, L2) to have a gap sufficient to guide the downward movement of the electronic component (ED). Because if the spacing between the loading members (L1, L2) is too wide, the loading members (L1, L2) cannot guide the descent of the electronic component (ED), so the electronic component (ED) may fall off or fall. Also, the impact of the fall may be too strong. Therefore, it is desirable to minimize the impact on stable loading and dropping of the electronic component ED by allowing the guide grooves formed on the opposite surfaces of the loading members L1 and L2 to guide the descending movement of the electronic component ED. do. Of course, it can be seen from FIGS. 9 to 11 that the degree of widening the gap between the loading members L1 and L2 is the same even during unloading.

In this example, the electronic components ED are mounted in two rows on the carrier frame CF, but even in the case in which the electronic components ED are loaded in one row or three or more rows on the carrier frame CF. It can be fully understood that the present invention can be appropriately applied.

In addition, in the background art, although the module IC is described as an example, the present invention can be sufficiently applied as long as it is a handler for handling electronic components (ED) in the form of a substrate in addition to the module IC.

As described above, the detailed description of the present invention has been made by embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with preferred examples of the present invention, the present invention is limited to the above embodiments only. It should not be construed as being limited, and the scope of the present invention should be understood as the following claims and their equivalents.

100: opening device for electronic component handler
110: elevating frame
120: elevator
130: opener
131: first open bar 132: second open bar
131a: first step 132a: second step
134: power source
140: support plate
150: coordinator

Claims (4)

an elevating frame capable of ascending or conversely descending toward a carrier frame capable of loading electronic components;
an elevating source for elevating the elevating frame;
an opener installed on the elevating frame and opening the carrier frame to unload electronic components from the carrier frame; and
The opener,
a first opening bar and a second opening bar for opening the loading modules comprising the first loading member and the second loading member provided in pairs on the carrier frame; and
a power source installed in the lifting frame to provide power to widen the gap between the first open bar and the second open bar, and to adjust the degree of the gap between the first open bar and the second open bar; includes,
The first opening bar has a first step for hanging the first loading members at once when the lifting frame is raised, and the second opening bar is a second opening for hanging the second loading members at once when the lifting frame is raised. The power source by having a step end, wherein the first step end of the first open bar and the second step end of the second open bar are positioned at a height that can be caught by the locking jaws of the first loading member and the second loading member When this operation is performed, the gap between the first open bar and the second open bar is widened and the gap between the first loading members and the second loading members is widened in conjunction with this, so that the loading modules are ultimately opened.
Opening device for electronic component handlers. According to claim 1,
The power source includes a gap adjusting belt that transmits the driving force of the power source to the first open bar and the second open bar by rotating forward and reverse using a driving pulley and a driven pulley as a rotation return point,
The first open bar and the second open bar are coupled to the gap adjusting belt to face each other
Opening device for electronic component handlers. According to claim 1,
a support plate for supporting electronic components mounted on the carrier frame when the elevating frame is raised toward the carrier frame; and
an adjustment member for adjusting the height of the support plate so that the support plate can support the lower ends of electronic components having different heights; further comprising
Opening device for electronic component handlers. an elevating frame capable of advancing toward a carrier frame capable of loading electronic components or retracting in the opposite direction;
an elevating source for elevating the elevating frame;
an opener installed on the elevating frame and opening the carrier frame to unload electronic components from the carrier frame;
a support plate capable of supporting electronic components mounted on the carrier frame when the elevating frame is raised toward the carrier frame, and having gripping grooves for gripping the lower end of the electronic component; and
an adjustment member that elevates the support plate so that the support plate can grip the lower end of the electronic component, and helps the picking device to grip or release the electronic component by adjusting the elevation height of the support plate; including,
A plurality of loading modules for loading electronic components are provided on the carrier frame, and the loading modules are provided in pairs with a first loading member holding one side of the electronic component and a second loading module holding the other side of the electronic component. having a loading member
Opening device for electronic component handlers.

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