TWI699319B - Opening apparatus for electronic device handler - Google Patents

Abstract

The invention relates to an opening device for an electronic component sorting machine. The opening device for an electronic component sorting machine according to the present invention may have: an opening machine having a first opening rod and a second opening rod whose distance between each other can be narrowed or widened, so that the loading module of the carrier frame can be opened ; Or the support plate and the adjustment source support the lower end of the electronic component with a lower height, thereby explaining the unloading operation of the pickup device. According to the present invention, the versatility of the opening device becomes high, and there is an effect that the recycling of resources can be expected, the prevention of waste of resources, the reduction of replacement costs, and the improvement of the operation rate.

Description

Opening device for electronic component sorting machine

The invention relates to a sorting machine for processing electronic components, in particular to an opening device for opening a carrier frame capable of loading electronic components.

Module IC (Module IC, or Module RAM) is a component that fixes multiple ICs and other components on one side or two sides of the substrate to form an independent circuit. It is an important electronic component required for the operation of electronic devices. , And expensive.

Therefore, strict performance testing must be carried out after the product is manufactured before shipment.

In order to test the module IC, a sorting machine capable of electrically connecting the module IC to the test machine is needed.

The sorting machine executes a series of actions as follows: after loading the module IC to the carrier frame by the picking device and loading it, the carrier frame loaded with the module IC is transferred to the test chamber by the transfer device to support the loading Test the module IC of the carrier frame, and use another transfer device to transfer the tested carrier frame of the loaded module IC to the sorting section, and then sort and unload the module IC according to the test result (Unloading).

In the above-mentioned series of procedures, in order to unload the module IC from the carrier frame, an independent opening device must be used to open the carrier frame. Therefore, the sorting machine must be constructed with an opening device for opening the carrier frame.

Korean Patent Publication Nos. 10-2011-0136312 and 10-2014-0072847 mention technologies related to the above-mentioned open devices (hereinafter referred to as "prior art").

The prior art has the following structure: when the adjustment plate is raised, the guide rod of the adjustment plate is inserted into the guide groove of the pressing member located in the carrier frame (named "carrier plate" in the prior art), and the pressing member is pushed To one side, so that the carrier frame is open.

However, the above-mentioned prior art can be appropriately adopted when the specifications of the electronic components to be tested are all the same, but as described below, its versatility is low, and therefore, there is a problem that the manufacturing cost becomes high eventually.

First, when it is necessary to test an electronic component having a different width from the electronic component tested in the past, the position of the guide rod needs to be changed, and therefore, the adjustment plate equipped with the guide rod must be replaced. Therefore, it does not have the recyclability of resources, which ultimately leads to an increase in manufacturing costs, and the investment in replacement time will lead to a waste of manpower and a drop in operation rate.

Second, when it is necessary to test an electronic component having a height different from the electronic component tested in the past, there is essentially no other solution. In particular, if the height of the electronic components to be loaded into the carrier frame is lower than the height of the socket, there is a difficulty in replacing the carrier frame or at least the socket.

The present invention has the following objects.

The present invention provides a technology related to an opening device that can be applied to electronic components of various widths.

The present invention provides a technology related to an open device that can be applied to electronic components of various heights.

The opening device for an electronic component sorting machine according to the first aspect of the present invention includes: an elevating frame capable of ascending or descending in the opposite direction toward the carrier frame on which electronic components can be loaded; an elevating source to raise and lower the elevating frame; and an opening machine, It is provided in the lifting frame, and the carrier frame is opened to be able to unload electronic components from the carrier frame, wherein the opening machine includes: a first opening rod and a second opening rod for opening the first load equipped in a pair in the carrier frame A loading module composed of a component and a second loading component; and a power source, which is provided in the lifting frame and used to provide power to widen the distance between the first open rod and the second open rod, the The first opening rod has a first locking end that locks the first loading member once when the lifting frame is raised, and the second opening rod has a first locking end that locks the second loading member once when the lifting frame is raised. The second locking end that is locked to the ground, so that if the power source runs, the distance between the first open rod and the second open rod is widened, and the first loading part and the second loading part The gap between them is widened, and the loading module is finally opened.

Preferably, the power source is constituted by a motor capable of variously changing the distance between the first open rod and the second open rod, so that the carrier frame can be loaded with electronic components of various specifications with different widths.

The opening device may further include: a support plate that supports the electronic components loaded on the carrier frame when the lifting frame rises toward the carrier frame; and an adjustment source that adjusts the height of the support plate so that the support plate can Supports the lower end of electronic components of various specifications with different heights.

The opening device for an electronic component sorting machine according to the second aspect of the present invention includes: an elevating frame capable of advancing toward or retreating in the opposite direction toward the carrier frame on which electronic components can be loaded; an elevating source for raising and lowering the elevating frame; and an opening machine, Is provided in the lifting frame, and the carrier frame is opened so that electronic components can be unloaded from the carrier frame; a support plate, when the lifting frame rises toward the carrier frame, supports the electronic components loaded on the carrier frame; and an adjustment source, Adjust the height of the support plate to enable the electronic component to rise.

According to the present invention, since electronic components with various widths and heights are handled without the need for component replacement, versatility is provided, and correspondingly, it is possible to expect resource reuse, prevent resource waste, reduce replacement costs, and improve operation. Rate effect.

The preferred embodiments according to the present invention will be described with reference to the accompanying drawings. Here, for the sake of brevity of the description, the description of the repeated or substantially the same configuration is omitted or condensed as much as possible.

＜ Instructions for the carrier frame ＞

Before describing the opening device for an electronic component sorting machine according to the present invention (hereinafter, simply referred to as “opening device”), a carrier frame on which electronic components are mounted will be described.

Fig. 1 is a perspective view of a carrier frame paired with an opening device according to the present invention.

The carrier frame CF may be opened by the opening device to be able to unload the electronic part ED, or may be closed to be able to hold the loaded electronic part.

As shown in detail in FIG. 2, the carrier frame CF is equipped with a plurality of loading modules LM for loading electronic components ED. The opening and closing of this loading module LM ultimately means the opening and closing of the carrier frame CF.

Each loading module LM has a first loading part L1 and a second loading part L2, and the first loading part L1 grips one side of the electronic part ED (the left side in the drawing), and the second loading part L2 grips the electronic part ED On the other side (right side in the picture). That is, if the distance between the first loading part L1 and the second loading part L2 is opened due to the opening device, the loading module LM will be opened, and if the distance between the first loading part L1 and the second loading part L2 If it is reduced, the loading module LM will be closed, so that both sides of the electronic component ED are grasped. Here, the first loading part L1 and the second loading part L2 are formed with a locking table J that can be locked to an opening rod described later so that the opening can be realized by an opening device, and in order to close the loading module LM, the first loading The part L1 and the second loading part L2 are elastically supported by the spring S in a direction in which the distance between each other is narrowed.

＜ Instructions for open devices ＞

3 is a perspective view of an opening device (hereinafter, simply referred to as "opening device") 100 for an electronic component sorting machine according to the present invention.

The opening device 100 includes a lifting frame 110, a lifting source 120, an opening machine 130, a supporting plate 140 and an adjustment source 150.

The elevating frame 110 is equipped to be able to ascend toward the carrier frame CF or to descend conversely.

The lifting source 120 may be constituted by an air cylinder, and the lifting frame 110 is raised and lowered.

The opening machine 130 is provided in the lifting frame 110 and opens the carrier frame CF so as to be able to unload the electronic component ED from the carrier frame CF. To this end, as shown in the partial view of FIG. 4, the opening machine 130 includes a first opening rod 131, a second opening rod 132, a spacing adjustment belt 133 and a power source 134.

The first open rod 131 and the second open rod 132 are arranged to face each other, and are combined with the spacing adjustment belt 133 to be able to move in opposite directions to each other, and further, when the power source 134 is running, they are guided by the guide rail GL to each other. The space between the two will widen or narrow. Here, the first opening rod 131 has a first locking end 131a for locking the locking table J of the first loading member L1 at once, and the second opening rod 132 has a first locking end 131a for locking the second loading member L2. The second locking end 132a locked by the locking table J at a time.

The pitch adjustment belt 133 rotates forward and backward by using the driving pulley DP and the passive pulley PP as a turning point (Turning point), thereby transmitting the driving force of the power source 134 to the first opening rod 131 and the second opening rod 132.

The power source 134 provides power for increasing the distance between the first open rod 131 and the second open rod 132, and is equipped to correspond to the width of various electronic components ED of different specifications with different widths. A motor that adjusts the degree of opening between the open rod 131 and the second open rod 132. Therefore, according to the rotation amount of the motor as the power source 134, the distance between the first open rod 131 and the second open rod 132 can be variously changed.

Next, the support plate 140 and the adjustment source 150 will be described with reference to the partial view of FIG. 5.

The support plate 140 supports the electronic component ED mounted on the carrier frame CF. A gripping groove 141 for gripping the lower end of the electronic component ED corresponding to the number of electronic components ED to be supported is formed in the supporting plate 140.

The adjustment source 150 adjusts the lifting height of the support plate 140 so that the support plate 140 can support the lower ends of electronic components ED of various specifications with different heights. The adjustment source 150 may be equipped with an air cylinder, but is preferably equipped with a motor to be able to adjust the lifting height of the support plate 140 to facilitate the grasping or release of the electronic component ED by the pickup device described later.

Next, the operation of the opening device 100 as described above will be described.

For reference, when loading the electronic component ED to the carrier frame CF, the pickup device loads the electronic component ED to the loading module LM. At this time, the electronic components are loaded from the state of FIG. 6 to the state of FIG. 7, so that the first loading part L1 and the second loading part L2 constituting the loading module LM will be overcome by the descending force of the pickup device PA. The electronic component ED forcibly loaded by the elastic force of the spring S expands in the direction of the arrow in FIG. 7, and when the loading of the electronic component ED is completed, the compressed spring S is applied to the first loading part L1 and the second loading part. Elastic force is applied in the direction in which the spacing between L2 becomes narrow, so that the loading module LM is closed. Therefore, the action (loading action) of the pickup device PA loading the electronic component ED to the carrier frame CF can be realized independently of the opening device 100.

1. Regarding the first operation example of unloading-the case where the height of the electronic component is high

As shown in FIGS. 6 and 7, when the height of the electronic component ED is high, even in the state where the electronic component ED is loaded on the loading module LM, the pickup device PA can grasp the electronic component ED, so operation is not required The support plate 140 and the adjustment source 150.

In this operating example, if the lifting frame 110 rises toward the carrier frame CF, as shown in FIG. 8, the locking end 131a of the first opening rod 131 is located at a height that can be snapped to the locking table J of the first loading part L1 , The locking end 132a of the second opening rod 132 is located at the height of the locking table J that can be connected to the second loading part L2. And, in the state of FIG. 8, the opening machine 130 is operated, so that the gap between the first opening rod 131 and the second opening rod 132 The distance between φ is widened and the loading module LM is opened. In this state, the pickup device PA unloads the electronic component ED.

2. Regarding the second operation example of unloading-the case where the height of the electronic components is low

When the height of the electronic component ED is low, the area gripped by the pickup device PA is insufficient. Therefore, the support plate 140 and the adjustment source 150 are required to be operated.

In this operation example, if the lifting frame 110 rises toward the carrier frame CF, as shown in FIG. 9, the locking end 131a of the first opening rod 131 is located at a height that can be snapped to the locking table J of the first loading part L1 , The locking end 132a of the second opening rod 132 is located at the height of the locking table J that can be connected to the second loading part L2. In addition, the opening machine 130 operates to widen the distance between the first opening rod 131 and the second opening rod 132, so that as shown in FIG. 10, the loading module LM is opened. In this state, as shown in FIG. The adjustment source 150 is operated as shown to raise the support plate 140. Accordingly, the pickup device PA becomes a state in which the upper end of the electronic component ED can be gripped, and in this state, the unloading operation by the pickup device PA is realized.

For reference, in this example, only the case where the pickup device PA unloads the electronic component ED from the carrier frame CF is considered. However, according to the embodiment, in order to perform the loading operation of loading the electronic component ED on the carrier frame CF, it is also possible to fully consider applying an opening device in the loading area. For example, it may be preferable to provide an opening device 100 in the loading area, and to widen the distance between the first loading part L1 and the second loading part L2 through the opening device 100, and then to load the electronic component ED. At this time, the electronic component ED has a flow in which the guide groove portions formed in the vertical direction of the first loading member L1 and the second loading member L2 are aligned and descended as guide rails. Here, the lower ends of the respective mounting parts L1 and L2 are configured to be able to support the lower end of the housing side in the lower corner of the electronic component ED. Of course, the following method can also be preferably considered: when the electronic component ED is loaded, when the electronic component ED is dropped due to the grip of the electronic component ED by the pickup device PA, the support plate 140 rises in advance to be at a predetermined position The electronic component ED is caught in advance, and then the support plate 140 is lowered, so that the electronic component ED can be stably loaded on the loading module LM.

For reference, the state shown in FIG. 11 may also exist during loading. In this case, if the pickup device PA releases the grip of the electronic component ED, the electronic component ED will fall freely. At this time, the loading component The pitch between L1 and L2 is slightly widened, so that the mounting components L1 and L2 have a pitch that can guide the downward movement of the electronic component ED. The reason is that if the distance between the loading parts L1 and L2 is too wide, the loading parts L1 and L2 cannot guide the lowering of the electronic part ED, so the electronic part ED may be separated from other positions, or may fall down and fall. The impact may also be too large. Therefore, it is preferable that the guide grooves formed on the faces of the loading parts L1 and L2 that face each other can guide the descending movement of the electronic part ED, thereby achieving stable loading of the electronic part ED and minimizing the descending impact. Of course, it can be fully understood from FIGS. 9 to 11 that the above-mentioned degree of widening the distance between the loading parts L1 and L2 is also applicable during unloading.

In addition, in this example, there is a structure in which the electronic components ED are loaded on the carrier frame CF in two rows, but it is fully understood that when the electronic components ED are loaded on the carrier frame CF in one row or in three or more rows In this case, the present invention can be similarly applied.

In addition, although the module IC has been described as an example in the background art, in the present invention, in addition to the module IC, it can be sufficiently applied to other sorting machines capable of processing electronic components ED in the form of a substrate.

As mentioned above, the specific description of the present invention has been given based on the embodiments described with reference to the drawings. However, the above-mentioned embodiments only describe the preferred embodiments of the present invention as an example. Therefore, the present invention should not be It is understood that it is limited to the above-mentioned embodiments, and the scope of rights of the present invention should be understood as the scope of the patent application and the scope equivalent thereto.

100‧‧‧Opening device for electronic component sorting machine 110‧‧‧Lifting frame 120‧‧‧Lifting source 130‧‧‧Opening machine 131‧‧‧First opening rod 132‧‧‧Second opening rod 131a‧‧‧ The first locking end 132a‧‧‧the second locking end

134: Power Source

140: support plate

150: adjust source

ED: electronic components

CF: Carrier Frame

L1: First loading part

L2: Second loading part

LM: Load module

Fig. 1 is a perspective view of a carrier frame paired with an opening device according to the present invention. Fig. 2 is a perspective view of a loading module applied to the carrier frame of Fig. 1. Fig. 3 is a perspective view of an opening device for an electronic component sorting machine according to the present invention. Fig. 4 is a partial perspective view of an opening machine applied to the opening device of Fig. 3. Fig. 5 is a partial perspective view of a supporting plate and an adjustment source applied to the opening device of Fig. 3. 6 and 7 are reference diagrams for explaining the operation of loading electronic components into the loading module. FIG. 8 is a reference diagram for explaining a state before the opening of the loading module when processing electronic components with a high height. FIG. 9 is a reference diagram for explaining a state before the opening of the loading module when electronic components with a low height are processed. Fig. 10 is a reference diagram for explaining a state where the loading module after Fig. 9 is opened. Fig. 11 is a reference diagram for explaining the operation of the support plate and the adjustment source.

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100‧‧‧Open device for electronic component sorting machine

110‧‧‧Lifting frame

120‧‧‧Lifting source

130‧‧‧Open machine

140‧‧‧Support plate

150‧‧‧Adjustment source

Claims (4)

An opening device for an electronic component sorting machine, which includes: a lifting frame capable of ascending or descending in the opposite direction toward a carrier frame capable of loading electronic components; a lifting source to raise and lower the lifting frame; and an opening machine arranged on the lifting Frame, open the carrier frame to be able to unload electronic parts from the carrier frame, wherein the opening machine includes: a first opening rod and a second opening rod for opening the first loading part and the second loading part equipped in a pair in the carrier frame A loading module composed of components; and a power source, which is provided in the lifting frame and used to provide power to widen the distance between the first open rod and the second open rod, the first open rod having The first locking end that locks the first loading member once when the lifting frame is raised, and the second opening rod has a first locking end that locks the second loading member once when the lifting frame is raised Two locking ends, so that if the power source operates, the distance between the first open rod and the second open rod becomes wider, and in conjunction with this, the distance between the first loading part and the second loading part is changed Wide, and finally open the loading module. Such as the opening device for the electronic component sorting machine of claim 1, The power source is constituted by a motor capable of varying the distance between the first open rod and the second open rod, so that the carrier frame can be loaded with electronic components of various specifications with different widths. The opening device for an electronic component sorting machine according to claim 1, which further includes: a support plate for supporting the electronic components loaded on the carrier frame when the lifting frame rises toward the carrier frame; and an adjustment source for adjusting the support plate The height of the support plate can support the lower ends of electronic components of various specifications with different heights. An opening device for an electronic component sorting machine, which includes: a lifting frame capable of advancing toward a carrier frame capable of loading electronic components or retreating in the opposite direction; a lifting source to raise and lower the lifting frame; and an opening machine arranged on the lifting A loading module with a pair of loading components on the open carrier frame so that electronic components can be unloaded from the carrier frame; a support plate, when the lifting frame rises toward the carrier frame, supports the electronic components loaded on the carrier frame And an adjustment source, adjusting the height of the support plate so that the electronic component can rise.

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