KR100302517B1 - Carrier for module I.C handler - Google Patents

Abstract

The present invention relates to a carrier for a module IC handler for transferring between test processes while holding a plurality of module ICs, and a module produced by transferring a carrier containing a plurality of module ICs between processes. It allows the IC to perform performance tests at a certain temperature while maximizing the utilization of the equipment.

To this end, a rectangular frame-shaped body 12, a pair of support blocks 13 provided on both sides of the body, at least one guide bar 14 fixed between each of the support blocks, and each of the guide bars Consists of a plurality of holding members 15 for holding the opposite end surface of the module IC (1) to be inserted oppositely loaded, it is possible to perform a heat resistance test while simultaneously handling the plurality of module IC (1) between processes.

Description

Carrier for module IC handler

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier used for a module IC handler, and more particularly, to a carrier for a module IC handler for transferring between test processes while holding a plurality of module ICs. will be.

Generally, a module IC (hereinafter referred to as a "module IC") 1 is a circuit in which a plurality of ICs and components 2 are independently fixed by soldering and fixing a plurality of ICs and parts 2 to one or both sides of a substrate as shown in FIG. 1. It is mounted on the main board and has a function of expanding capacity.

Since the module IC 1 has higher added value than selling the finished ICs individually, the IC is developed and sold as a main product by the IC manufacturer.

Since the module IC (1) assembled and manufactured through the manufacturing process is expensive, the reliability of the product is also very important. Therefore, only the product determined as good quality is shipped through strict quality inspection, and the module IC determined as defective is corrected or discarded entirely. Dispose of

Conventionally, a device has been developed for automatically loading a completed module IC 1 into a test socket, performing a test, and then automatically classifying it according to a test result and unloading it into a custom tray (not shown). There was no.

Therefore, in order to test the completed module IC, the operator had to manually take out one module IC from the tray, load it into the test socket, test it for a set time, and classify the module IC into the customer tray according to the test result. Work efficiency was reduced by testing IC.

In addition, boredom caused by simple labor caused a decrease in productivity.

Therefore, a handler for automatically testing a module IC has been developed by the applicant and has been applied for a number of patents and utility models.

2 and 3 is a schematic view showing a module IC handler developed by the applicant and filed in the patent 98-1519, the configuration is as follows.

As shown in Fig. 2, when the known pick-up means 3 transfer to the tray side to hold one module IC 1 contained in the tray, the fingers 4 holding both ends of the module IC are maximized to both sides. It is kept open.

In this state, when the pickup means 3 moves to the tray side and the fingers 4 on both sides are positioned on the upper side of the module IC 1 and then descend, the finger cylinder 5 is driven to open the fingers 4 on both sides. ) Is held inward, thereby holding the module IC 1 in the tray.

After holding the module IC 1 in the tray as described above, the pickup means 3 moves to the test site where the test socket 6 is located as shown in FIG. Position (1) and transfer it to the tray side to hold the new module IC.

After the module IC 1 to be tested is completely loaded in the plurality of test sockets 6 installed on the test site side by the above-described operation, the main cylinder 7 and the forking cylinder 8 are sequentially driven to push the pusher 9 Since the pusher descends, the upper surface of the module IC 1 mounted on the test socket 6 is pushed down so that the pattern 1a of the module IC 1 is connected to the terminals of the test socket 6. The electrical connection allows the performance testing of the module IC.

On the other hand, after the test of the module IC 1 is completed, the takeout lever 11 is rotated by the drive of the takeout cylinder 10, and the module IC 1 inserted into the test socket 6 is removed. Another pickup means located on the unloading side holds the tested module IC 1 and unloads it into the customer tray according to the test result.

However, in the conventional handler, since the module IC 1 is transferred to the test socket 6 side by the pickup means, there are the following problems.

First, the module IC could only be tested at room temperature because the pick-up means held the module IC and loaded and unloaded it into the test socket, so that the pick-up means could not handle the module IC in a closed chamber.

Accordingly, the produced module IC 1 is tested at room temperature, and only the good product is shipped, whereas when the shipped module IC is mounted on the product and used in practice, the module IC 1 is driven at a high temperature by generating a lot of heat depending on the driving conditions. Because of the difference between the conditions and the actual use, the reliability of the shipped product is reduced.

Second, since the pickup means holds and transfers the module IC (1) contained in the tray and the module IC in the test socket, it is impossible to transfer the module IC during the test of the module IC, resulting in a long cycle time. It is not possible to test a large amount of module ICs within the same time.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem in the related art, and has an object to improve the reliability of a shipped product by performing a performance test on a produced module IC at a predetermined temperature.

It is another object of the present invention to maximize the operation rate of expensive equipment by allowing the pickup means only to load and unload the module IC contained in the tray to the carrier and to transfer the carrier containing the plurality of module ICs between the test processes. It is to make it possible.

According to an aspect of the present invention for achieving the above object, a rectangular frame-shaped body, a pair of support blocks provided on both sides of the main body, at least one guide bar fixed between each of the support blocks, each of the guide bar There is provided a carrier for a module ice handler, comprising a plurality of holding members for holding opposite ends of a module IC that are oppositely inserted and loaded.

1 is a perspective view showing a general module IC

2 and 3 is a schematic diagram showing a conventional module IC handler,

2 is a state in which the module IC pickup means holds the module IC and loads it into the test socket of the test site.

3 is a state in which the module IC loaded in the test socket is inserted into the test socket

4 is a perspective view showing a carrier of the present invention;

5 is an exploded perspective view showing a holding member of the present invention

6 is an assembled longitudinal cross-sectional view of FIG.

7 is a schematic view showing a gap adjusting means of the present invention

8A and 8B are cross-sectional views taken along a line A-A of FIG. 4 for explaining the operation of the present invention.

8A is a state in which the pressing piece is raised and rotated by the rise of the pusher

Figure 8b is a state in which the pressing piece holding the module IC inserted into the insertion groove of the housing by the lowering of the pusher

Explanation of symbols for main parts of the drawings

12: main body 13: support block

14: guide bar 15: holding member

17: link 19, 24: elastic member

21 housing 22 lifting member

23: push 25: the stopper

Hereinafter, the present invention will be described in more detail with reference to FIGS. 4 to 8 as an embodiment.

Figure 4 is a perspective view showing a carrier of the present invention and Figure 5 is an exploded perspective view showing a holding member of the present invention Figure 7 is a schematic view showing a gap adjusting means of the present invention, the present invention is on both sides of the main body 12 of the rectangular frame form Two pairs of support blocks 13 are provided, and at least one guide bar 14 is fixed between each support block, and holding both ends of the loaded module IC 1 on each guide bar. A plurality of holding members 15 are fitted to face each other.

In the case where the cross-section of the guide bar 14 into which the plurality of holding members 15 is fitted is a polygon, one guide bar may be provided between the support blocks 13, but the cross-section of the guide bar 14 is circular. In the case of a sealing rod, it is preferable to provide two pieces at the upper and lower portions so that the holding member 15 is not rotated from the guide bar.

In the present invention, the interval adjusting means for adjusting the interval of the holding member 15 is further provided according to the loading and unloading position of the module IC (1).

This means that the pitch of the insertion groove of the tray containing the module IC 1 to be tested and the pitch of the test socket (not shown) installed in the test site of the handler (not shown) are 15 mm, while the tested module IC 1 is The insertion groove pitch of the unloading tray to be contained is 11 mm so that the pitches of the pickup means installed at the loading position and the unloading position are different so that the loading and unloading operation of the module IC 1 can be performed according to the position of the carrier. For sake.

As shown in FIG. 7, the gap adjusting means includes a plurality of holding members 15 having a pair of protrusions 16 formed on upper and lower surfaces of the rear surface, and long holes 17a formed at both ends thereof so that the plurality of holding members are interlocked with each other. A plurality of links 17 coupled in an X-shape so as to be diagonally inserted into the holding members 15 and the protrusions of adjacent holding members, respectively, the hinge shafts 18 and the holding members 15 of the links. When the external force is not applied to the plurality of holding members is connected between the projections 16 of the) is composed of an elastic member 19 to push outwards to each other to maximize the interval of each holding member.

Although the torsion spring is applied to the elastic member 19 in one embodiment of the present invention, other similar types of elastic members may be applied.

In addition, a plurality of fastening holes 12a are formed in the main body 12, and insertion holes 13a are formed in the support block 13, and according to the longitudinal width L of the module IC 1 to be tested. The position of the support block 13 is changed, and then the support block 13 is fixed to the fixing screw 20 through the fastening hole 12a.

That is, when the longitudinal width of the module IC 1 to be tested is short, the interval of the support block 13 is narrowly adjusted. On the contrary, when the longitudinal width of the module IC is long, the distance of the support block is widened. Regardless of the length of the IC, one carrier can be used to handle module ICs of various lengths.

In addition, the holding member 15 fitted to the guide bar 14 and holding both ends of the module IC 1 is inserted into which the end of the module IC 1 is fitted on one side as shown in FIGS. 5 and 6. A housing 21 having a groove 21a and a seating surface 21b, an elevating member 22 provided to be movable up and down on the housing, and an upper surface of the elevating member rotatably installed about a shaft 27. A pressing piece 23 for pressing the upper surface of the module IC 1, an elastic member 24 installed on the outer circumferential surface of the lifting member and restoring the lifting member provided with the pressing piece when no external force is applied to the lifting member; It is comprised by the stopper 25 provided in the upper side of the housing 21, and restraining the raise of the pressing piece 23, and rotating.

Accordingly, even if the height T of the module IC 1 to be handled is different, the pressing piece 23 is elastically installed by the elastic member 24 so as to be able to move horizontally in the horizontal movement section S. Module ICs higher than the minimum height can be handled without component replacement.

And the guide groove (21c) is formed on the inner surface of the housing 21, both sides of the pressing piece 23 is formed with a projection piece (23b) to be fitted to the guide groove when the lifting member 22 of the lifting motion The pressing piece 23 is inserted into the guide groove 21c in the horizontal movement section S to move horizontally. At the point out of the horizontal movement section, the rear end portion is pressed by the stopper 25 to rotate.

As described above, a support groove 23c is formed on the bottom surface of the pressing piece 23 that holds the module IC 1 fitted to the insertion groove 21a while rotating as described above.

This is to maintain the held state stably when transferring the module IC 1 held in the holding member 15 between processes.

Referring to the operation of the present invention configured as described above is as follows.

First, in a state in which no external force is applied to the plurality of holding members 15 fitted to the guide bar 14 as shown in FIG. 7, the plurality of holding members 15 are separated by 15 mm from the torsion spring, which is an elastic member 19. Will be maintained.

In addition, as shown in FIG. 4, in the state where no external force is applied to the elevating members 22 installed in the housings 21, the elevating member 22 is positioned at the bottom dead center by the restoring force of the elastic member 24. The pressing piece 23 rotatably installed on the member is located in the horizontal movement section.

In this state, after the carrier reaches the loading position of the module IC 1, a plurality of pushers 26 (equal to the same number and positions of the holding members) installed on the lower side of the carrier are raised and installed in the respective housings 21. The elevating member 22 is pushed upwards at the same time.

Accordingly, the elevating member 22 is elevated while compressing the elastic member 24, so that the pressing piece 23 rotatably installed on the elevating member is vertically raised in the horizontal movement section. Since the protruding piece 23b formed at 23 is fitted in the guide groove 21c formed in the housing 21, the pressing piece is raised horizontally stably.

As described above, when the lifting member 23 is lifted even when the pressing piece 23 is out of the horizontal movement section and the rear end touches the stopper 25 due to the continuous rising of the lifting member 22, the pressing piece 23 is not raised horizontally. 8A, the insertion groove 21a formed in the housing 21 is opened because the shaft 27 is rotated about the shaft 27.

After each of the pressing pieces 23 installed opposite to the main body 12 rotate in opposite directions and the insertion groove 21a is opened, the loading side pickup means is spaced 15 mm apart in a tray (not shown). The plurality of module ICs contained therein are held and transferred to the upper portion of the carrier. At this time, the plurality of module ICs 1 held by the pickup means are transferred to the upper portion of the insertion groove 21a formed in the housing 21. After that, the transfer of the pickup means is stopped.

Then, when the pick-up means is lowered by a separate driving means, the module IC 1 held in the pick-up means is repositioned by the inclined surface 21d formed in the housing 21, and then both ends are inserted into each insertion groove ( It is inserted into the inside of 21a) so that the bottom face touches the seating surface 21b.

After the module IC 1 held by the pickup means is placed in the insertion groove 21a of the housing 21 by this operation, the holding state of the module IC is released, and then the pickup means holds the new module IC contained in the tray. In order to move to the loading side tray side to hold the module IC, the operation of repeatedly loading the module IC between the housing 21, the module IC is not contained.

After the module IC 1 is completely loaded between the holding members 15 of the carrier in a repeated operation, the pusher 24 that raises the elevating member 22 is lowered.

When the pusher 24 is lowered, the elevating member 22 is lowered by the restoring force of the elastic member 19 that is compressed, and thus the pressing piece 23 coupled to the elevating member by the shaft 27 is pulled downward. As a result, the pressing piece 23, which was rotated by the rear end of the stopper 25, is rotated in a horizontal state to push down the upper surface of the module IC 1 as shown in FIG. 8B while descending along the horizontal movement section S. FIG. do.

After the plurality of module ICs 1 to be tested in the carrier are all loaded and held by the holding member 15 in the above-described operation, the carrier is transferred into a sealed chamber (not shown) by the transfer means. The module IC is then heated to a temperature (approximately 70 to 90 ° C) suitable for the test conditions, and then transferred to the test site for a heat resistance test.

It is to be understood that in the test site, when the module IC 1 loaded on the carrier is tested, contact can be made in a state where the carrier is positioned vertically or horizontally according to the installation direction of the test socket.

In this case, since a separate pusher (not shown) presses the module IC 1 contained in the main body 12 to the test socket side, the carrier moves to the test socket side by the pushing force of the pusher. The module IC plugged into the test socket is pulled out by a separate extraction lever mounted on the test socket, so that the module IC can be transferred to the next process (unloading process).

After the test is completed on the test site, the carrier is transported to the unloading position by the transfer means. ), Which will be described below.

After the carrier containing the tested module IC 1 is moved to the unloading position, the interval of the holding member 15, which has been maintained at 15 mm intervals as shown in FIG. 7, is spaced 11 mm apart as the unloading tray insertion groove on the unloading side. To be adjusted, a plurality of pickup means installed at an interval of 11 mm on the unloading side can simultaneously hold and unload a plurality of module ICs from the holding member.

To this end, when a separate pitch adjusting means holds each housing 21 from the upper side or the lower side and retracts it inward, a plurality of X-shaped holes having a long hole 17a fitted into the protrusions 14 of the holding member 15 are provided. Since the link 17 is folded to each other to compress the elastic member 19 caught between the projection 14 and the hinge shaft 18, the housing 21 is the pickup means installed on the unloading side of the module IC (1) It is narrowed down to 11mm intervals that can be held.

As such, when the distance between the module IC held in the holding member 15 is adjusted, a separate pusher is raised to push up the lifting member 22 as in the loading of the module IC, so that the pressing piece 23 connected to the lifting member The rear end is rotated by the stopper 25 to open the insertion groove 21a. The description thereof is the same as described above, and thus a detailed description thereof will be omitted.

Accordingly, the pickup means positioned on the unloading side holds the module IC 1 inserted into the insertion groove 21a of the housing 21 and sorts it into the unloading tray according to the test result to test the heat resistance of the module IC. Will be completed.

The carrier of the present invention for loading and transporting a plurality of module ICs 1 during the operation as described above is supported by the support block 13 in the main body 12 according to the longitudinal width L of the module IC to be tested. By controlling the spacing of the modules, one carrier can be used to handle various types of module ICs.

That is, the position of the support block is changed so that the pair of support blocks 13 maintain proper spacing in the fastening holes 12a formed on both sides of the main body 12 according to the longitudinal width L of the module IC to be tested. The fastening screw 20 may be fastened in a state.

As described above, the present invention has the following advantages since it is possible to handle several types of module ICs having different specifications by using one carrier.

First, since the module IC is loaded into the carrier by the pickup means from the outside of the chamber, the module IC loaded in the carrier is easily transferred to the inside of the chamber, heated to a set temperature, and then tested. Improved reliability

Secondly, while loading and unloading the module IC 1 in the carrier, the test site performs the test of the module IC loaded in the carrier, thereby maximizing the utilization rate of expensive equipment, and thus, The module IC can be tested.

Claims (6)

A rectangular frame-shaped body 12, two pairs of support blocks 13 provided on both sides of the body, at least one guide bar 14 fixed between the opposed support blocks, and each of the opposed guide bars. A harness 21 formed with an insertion groove and a seating surface so that the module IC can be inserted into one side and coupled to be movable, the elevating member 22 movably installed in the housing, and a hinge to the elevating member. Coupled to rotate the movement of the elevating member to open and close the insertion groove of the housing and press the inserted module IC to support the pressing piece 23 is installed in the housing to connect the pressing piece of the elevating member to rotate the pressing piece A carrier for a module IC handler, characterized by comprising a stopper (25). The method of claim 1, The projections 16 are formed in the respective housings, and the long holes 17a of the plurality of links 17 coupled in the X shape by the hinge shafts 18 are coupled to the projections, and between the hinge shafts and the projections of the links. The carrier for the module IC handler, characterized in that the elastic member 19 is installed so that the gap of each housing is maximized when no external force is applied to the housing. The method of claim 1, The carrier for a module IC handler, characterized in that a plurality of fastening holes (12a) is formed on the main body so as to adjust the installation interval of the support block. The method of claim 1, And an elastic member (24) for restoring the elevating member on the outer circumferential surface of the elevating member. The method of claim 1, The guide groove is formed on the inner surface of the housing, and the carrier for the module IC handler, characterized in that the protruding pieces are fitted to the guide groove on both sides of the pressing piece. The method of claim 1, A carrier for a module IC handler, characterized in that a support groove (23c) surrounding the upper surface of the module IC is formed on the bottom surface of the pressing piece.