TWI604548B - Vibration apparatus for test handler - Google Patents

Description

Vibration device for testing the processor

The invention relates to a vibration device for a test processor.

In order to test electronic devices, in particular semiconductor devices, a tester and a test processor are required, wherein the tester is used to test electronic components that are electrically connected thereto, and the test processor serves as a means for electrically connecting the electronic device to the tester.

The test handler includes a test tray on which are loaded a plurality of semiconductor devices in the form of a matrix and all of the semiconductor devices are simultaneously transferred.

After the semiconductor device is loaded onto a test tray (also referred to as a "carrier board"), the semiconductor device is electrically connected to the test socket of the tester. Therefore, the distance between the semiconductor devices loaded on the test tray must correspond to the distance between the test sockets of the tester.

At the same time, the semiconductor device to be tested by the test processor is loaded on the user tray before being supplied to the test processor. The intended purpose of the user tray is to load and store the semiconductor device. Therefore, in order to increase the loading capacity of the user tray, the distance between the semiconductor devices loaded on the user tray may be smaller than the distance between the semiconductor devices loaded on the test tray.

The test handler is provided with a pick and place device that transfers the semiconductor device to be tested from the user tray to the test tray or transfers the semiconductor device that has been tested on the test tray to the user tray. In addition, since the distance between the semiconductor devices mounted on the user tray is different from the distance between the semiconductor devices mounted on the test tray, the test handler must be provided to transfer the semiconductor between the user tray and the test tray. The structure of the device can adjust the distance between the semiconductor devices.

1 is a schematic plan view showing the structure of a test handler according to a conventional art.

Referring to FIG. 1, a test handler TH according to the conventional art includes a test tray TT, The pick and place device LH, the pair of sorting stations STa and STb, the sorting and placing device SH, and the unloading pick and place device UH.

The test tray TT circulates in a circulation path C which starts at the loading position LP and extends through the test position TP and the unloading position UP to the loading position LP.

A loading and placing device LH (also referred to as a loader) is used to load the semiconductor device that has been loaded on the user tray CT1 to the carrier board CB disposed at the loading position LP. In order to increase the processing speed, a plurality of loading pick and place devices LH may be provided. In the drawings, it is shown that two loading pick and place devices LH are provided.

Each of the sorting stations STa and STb can perform a reciprocating operation with respect to the forward-backward direction (the Y-axis direction, the other is the same as described above), and load a plurality of semiconductor devices thereon in a matrix form.

A sort picking and placing device SH, called a sorter, transfers the semiconductor device to the sorting stations STa and STb, which has been loaded on the test tray TT at the unloading position UP and has been tested. The sorting pick and place device SH is generally configured to be movable only in the X-axis direction such that it can reduce the weight to improve its mobility or can prevent interference with the operation of the unloading pick-and-place device UH. In order to achieve the above object more effectively, the sorting stations STa and STb may be configured to perform a step reciprocating operation with respect to the forward-backward direction.

The unloading pick and place device UH is also referred to as an unloader and is used to transfer the semiconductor devices already loaded on the sorting stations STa and STb to the empty user tray CT2 (or referred to as the reference numeral "CT" of FIG. 2). ) and load them onto the user tray CT2.

The conventional technique having the above structure has the following problems.

Typically, a plurality of containers are arranged and disposed on the user tray CT2 to load or place a plurality of semiconductor devices on the user tray CT2, respectively. When the semiconductor device is loaded onto the user tray CT2, the container detachment phenomenon may be caused. Specifically, the term "pocket leave phenomenon" refers to a phenomenon in which some semiconductor devices are placed when the semiconductor devices that have been tested are placed in respective containers of the user tray CT2 on the layout board. It is placed adjacent to the partition of the container rather than being positioned entirely at the correct position of the container of the user tray CT2.

The user tray CT2 on which the semiconductor device has been completely loaded is transferred to the unloading stacker (user tray memory provided in the test handler) and stored in a stack in the stacker. If a new user tray is stacked on a user tray that already has a container detachment, the semiconductor device that is not in the correct position may be destroyed or placed under the semiconductor device The terminal of the part (in the case of BGA type, ball type) may be damaged.

In addition, the user tray may not be successfully leveled on top of the other. In this case, when the stacked user trays are transported outside the unloading stacker, the user tray may not be properly transported, and thus the semiconductor device is likely to be lost from the user tray.

[Prior Art Literature]

[Patent Literature]

(Patent Document 1) Korean Patent Registration No. 10-0706330 (Registration Date: April 4, 2007)

(Patent Document 2) Korean Utility Model Registration No. 20-0445512 (Registration Date: July 29, 2009)

Accordingly, it is an object of the present invention to provide a vibration device for a test processor that includes a device such as a vibration motor component that is capable of applying vibration to a layout plate such that vibration can be transmitted to the placement plate. The user tray, ie, the semiconductor device that is not properly positioned on the user tray, can be moved to a predetermined position and thus positioned.

According to an embodiment of the present invention, there is provided a vibration device for a test processor, comprising: a layout plate supported by a user tray on which a semiconductor device is disposed; and a plurality of vibration motor components disposed under the layout plate In the mounting recess in the surface, the vibrating motor component is used to generate vibration, and the semiconductor device is positioned at a predetermined position on the user tray by vibration transmitted to the user tray through the routing plate.

The layout plate may include an outer coupling recess formed around the mounting recess to the periphery of the lower surface of the layout board. The laying plate may include: a component mounting rib disposed in the mounting recess, and an inner coupling recess in the component mounting rib.

Each of the vibration motor components may include: wings coupled to the respective outer coupling recesses and inner coupling recesses respectively; a motor bracket integrally provided with the wings, the motor bracket provides a motor mounting space; and the motor is mounted on the motor In space; and an eccentric block, coupled to the rotating shaft of the motor.

The vibration motor elements may be disposed at positions spaced apart from each other along the longitudinal axis of the layout plate in the first and second regions formed on both sides of the component mounting rib. The vibrating motor elements may be oriented in the longitudinal direction of the laying plate and arranged to deviate from each other with respect to the lateral direction of the laying plate Set.

The vibration may be generated while the laying plate is fastened in place by pressing the laying plate to the laying table having the opening, wherein the user tray is provided in the opening.

Vibration can be generated while the layout board is being transferred.

The vibration device may further include: an image capturing device for capturing an image of the semiconductor device disposed on the user tray; and a vibration control circuit unit for determining whether the semiconductor device is positioned at the predetermined position using the image, The vibration control circuit unit operates the vibration motor component when the semiconductor is not in the predetermined position.

According to another embodiment of the present invention, there is provided a vibration device for a test processor, comprising: a layout plate for supporting a user tray on which a semiconductor device is disposed, the layout plate having at least one through hole; and a vibration motor component Provided in the through hole and coupled to a lower surface of a peripheral portion of the layout plate for defining the through hole therein, the vibration motor element is for generating vibration; and the vibration member is received in the layout plate, the vibration member The surface and the lower surface are in contact with the user tray and the vibration motor component, respectively, such that vibration generated from the vibration motor component is transmitted to the user tray through the vibration member, wherein the vibration member is thinner than the layout plate, and the area ratio of the upper surface of the vibration member The area of the through hole is larger, and the semiconductor device is positioned at a predetermined position by vibration.

The vibration motor component may include: a pair of fastening blocks coupled to the layout plate; a holder for connecting the fastening blocks to each other; and a motor housing supported on the fastener and coupled to the lower surface of the vibration member; the motor And coupled to a motor coupling hole formed in the motor housing; and a vibration block coupled to the rotating shaft of the motor.

According to still another embodiment of the present invention, there is provided a vibration device for a test processor, comprising: a layout plate for supporting a user tray on which a semiconductor device is disposed, the layout plate having one or more through holes; a rod for defining a through hole or disposed between the through holes, the connecting rod being integrally provided with the laying plate and being thinner than the laying plate; and a vibration motor element coupled to the lower surface of the connecting rod, the vibration motor element being used for generating Vibration, vibration is transmitted to the user tray via the connecting rod, so that the semiconductor device enters the predetermined position.

According to still another embodiment of the present invention, there is provided a vibration device for a test processor, comprising: a layout plate for supporting a user tray on which a semiconductor device is disposed, the layout plate having at least one through hole; and a vibration motor component Provided in the through hole, the vibration motor element is used to generate vibration; and a pair of vibrating bars are disposed in the through hole and spaced apart from each other and oriented to be parallel to each other in a direction corresponding to the longitudinal direction of the laying plate, the vibrating bar is separate Connected to the vibration motor component, in the vibrating bar Each is thinner than the layout plate, and vibration is transmitted to the user tray via the vibrating bar, causing the semiconductor device to enter a predetermined position.

According to still another embodiment of the present invention, there is provided a vibration device for a test processor, comprising: a transport unloading unit for supporting a user tray on which a semiconductor device is disposed, and a transport unloading unit transferring the user tray to the transfer mold a bracket; fastened to the surface of the base, the transport unloading unit is mounted on the surface of the base; a vibrating motor component connected to one side of the bracket, a vibrating motor component for generating vibration; and a pair of rails disposed at the transport unloading unit And spaced apart from each other and oriented parallel to each other in a direction in which the conveying unloading unit extends, the rails are individually coupled to the vibration motor element, and the vibration is transmitted to the user tray via the rails, causing the semiconductor device to enter a predetermined position.

The vibration motor component may include: an extension portion disposed at an upper end of the bracket and coupled to the bracket by a bolt; a motor housing integrally provided with the extension portion, the motor housing having an opposite side of the upper surface of the motor housing a rail base portion such that the rail is coupled to the corresponding rail base portion; a motor coupled to the motor coupling hole of the motor housing; and a vibration block coupled to the rotating shaft of the motor.

Each of the rails may include: a sliding member having a coupling hole through which the sliding member is coupled to the corresponding rail base portion through a bolt; and a wedge member formed at both ends of the sliding member.

The sliding member may also have a sliding member that protrudes upward from opposite side edges of the upper surface of the sliding member, respectively, such that friction between the sliding member and the lower surface of the user tray is reduced.

The vibration device may further include: an image capturing device for capturing an image of the semiconductor device disposed on the user tray; and a vibration control circuit unit for determining whether the semiconductor device is positioned at a predetermined position using the image, The vibration control circuit unit operates the vibration motor component when the semiconductor is not in the predetermined position.

10‧‧‧Unloading transfer module

100‧‧‧Vibration device

11‧‧‧ lifting equipment

110‧‧‧Track end

120‧‧‧Vertical rail

123‧‧‧LM Guide

130‧‧‧Mobile board

131‧‧‧ board support

141‧‧‧ Slider

142‧‧‧ Guide rod

143, 144‧‧‧ linkage block

150‧‧‧ cable rack

151, 152‧‧‧ fasteners

160‧‧‧ Layout board

161‧‧‧Tray guide pin

162‧‧‧Installation recess

163‧‧‧External joint recess

164‧‧‧Internal coupling recess

165‧‧‧Component mounting ribs

169‧‧‧ board guide pin

170‧‧‧Vibration motor components

171, 172‧‧‧ wing

173‧‧‧Motor bracket

174‧‧‧Motor Installation Controls

175‧‧‧Motor

176‧‧‧Eccentric block

180‧‧‧Second shock absorbing damper

181‧‧‧Support bracket

183‧‧‧First shock absorber

190‧‧‧Image capture equipment

191‧‧‧ hanger

195‧‧‧Vibration Control Circuit Unit

CT‧‧‧Tray

RL1‧‧‧ first centerline

RL2‧‧‧ second midline

50‧‧‧Set up

51‧‧‧ openings

52‧‧‧ pinhole

200‧‧‧Vibration device

12‧‧‧Vertical rail

13‧‧‧ board support

14‧‧‧Mobile board

15‧‧‧ lifting device

16‧‧‧LM Guide

17‧‧‧ cable rack

18‧‧‧ Shock Absorber

200'‧‧‧Modified vibration device

210‧‧‧Vibration components

211‧‧‧Bend

212‧‧‧Bolt holes

220‧‧‧ Layout board

221‧‧‧ stepped recess

222‧‧‧ Position recess

223‧‧‧through hole

230‧‧‧Vibration motor components

231, 232‧‧‧ fastening blocks

233‧‧‧ Holder

234‧‧‧Bolt holes

235‧‧‧Motor housing

236‧‧‧Motor coupling hole

237‧‧‧Motor

238‧‧‧vibration block

300‧‧‧Vibration device

320‧‧‧ Layout board

323, 324‧‧‧through holes

325‧‧‧ Connecting rod

330‧‧‧Vibration motor components

331‧‧‧Motor housing

332‧‧‧Motor coupling hole

333‧‧‧Motor

334‧‧‧vibration block

400‧‧‧Vibration device

420‧‧‧ Layout board

423‧‧‧through hole

430‧‧‧Vibration motor components

431‧‧‧U-shaped support rod

432‧‧‧Motor housing

433‧‧‧Motor coupling hole

434‧‧‧Motor

435‧‧‧vibration block

436‧‧‧ shoulder

440‧‧‧Vibrator

441‧‧‧

442‧‧‧ middle part

443‧‧‧Extension

500‧‧‧Vibration device

510‧‧‧ bracket

530‧‧‧Vibration motor components

531‧‧‧Extension

532‧‧‧ Track base parts

533‧‧‧Motor housing

534‧‧‧Motor coupling hole

535‧‧‧Motor

536‧‧‧vibration block

540‧‧‧ Track

541‧‧‧Sliding parts

541a‧‧‧Slide parts

542‧‧‧Wedges

543‧‧‧Sliding parts

STa‧‧‧Classification table

20‧‧‧Conveying and unloading unit

21‧‧‧ conveyor belt

22‧‧‧Transport gear

23‧‧‧Rotary axis

24‧‧‧ pulley

25‧‧‧ drive belt

29‧‧‧Support frame

1 is a plan view showing a configuration of a test handler according to a conventional technique; FIG. 2 is a perspective view showing a vibration device for a test handler according to a first embodiment of the present invention; and FIG. 3 is a vibration of FIG. An exploded perspective view of the device; FIG. 4 is a view showing the connection structure between the layout plate and each of the vibration motor components of FIG. FIG. 5 is a front view showing a layout relationship between a layout board and a user tray and a layout board to illustrate a test state; and FIG. 6 is a view showing a test processor for a test processor according to a second embodiment of the present invention. 3 is a cross-sectional view taken along line AA of FIG. 6; FIG. 8 is a perspective view showing the bottom side of the vibrating device of FIG. 6; and FIG. 9 is a modified bottom view showing the vibrating device of FIG. FIG. 10 is a perspective view showing a vibration device for a test processor according to a third embodiment of the present invention; FIG. 11 is a cross-sectional view taken along line BB of FIG. 10; A perspective view of a vibration device for testing a processor of a fourth embodiment of the invention; FIG. 13 is a perspective view showing the vibration device of FIG. 12 viewed from another direction; and FIG. 14 is a view showing a fifth embodiment according to the present invention. Fig. 15 is a front view of the vibration device of Fig. 14; Fig. 16 is a perspective view showing a modification of the track of Fig. 14; Fig. 17 is a photograph instead of the drawing, Before the vibration device of Figure 14 vibrates The state of the user tray and the semiconductor device; Fig. 18 is a photograph instead of the drawing, showing the state of the user tray and the semiconductor device after the vibration device of Fig. 17 vibrates.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that they can be easily implemented by those skilled in the art.

In the embodiment of the invention described below, each of the first to fourth embodiments may be a vibration device (hereinafter referred to as "vibration device") for testing the processor, the vibration device having a plate structure and It is installed in a transfer module (hereinafter referred to as "transfer module") of a test processor that can be operated up or down. The fifth embodiment may be a vibration device installed in a transfer module having a level belt transfer device.

Furthermore, the following embodiments share the technical idea of providing at least one vibration motor element and by using the vibration motor element to cause the user tray to move and position the semiconductor device that has been placed on the user tray and at the wrong position At the scheduled location.

Hereinafter, the technical features of the present invention will be described with reference to these embodiments. If a detailed description of a function or configuration is unnecessarily obscured in the specification, the detailed description will be omitted.

First Embodiment, FIG. 2 is a perspective view showing a processor vibration device 100 according to a first embodiment of the present invention. FIG. 3 is an exploded perspective view of the vibration device 100 of FIG. 2.

The vibration device 100 of Figures 2 and 3 can be part of a transfer module 10 disposed in a test processor.

Referring to Figures 2 and 3, the vibratory device 100 is used with a user tray CT placed thereon and coupled to a lifting device 11 of an unloading transfer module 10, such as a test processor.

The lifting device 11 of the transfer module 10 is disposed below the opening of the laying table (not shown) and moves the vibrating device 100 upward or downward. The lifting device 11 includes a track end 110, a vertical rail 120, a plate support 131, and a moving plate 130. With regard to the coupling between the components, in the present embodiment, for example, the rail end portion 110 and the vertical rail 120 may be detachably coupled to each other by a bolt connection. At the same time, the vibration device 100 includes a routing plate 160 and a vibration motor element 170.

The track end 110 is a channel member having a "U" shaped cross section that is coupled to the lower end of the vertical rail 120. One end of the rail end portion 110 is coupled to the lower surface of the lower end of the vertical rail 120 by a bolt. The other end of the track end 110 has a free end structure that does not contact the surface of the vertical rail 120. With this configuration of the rail end portion 110, the LM guide 123 disposed between the vertical rail 120 and the moving plate 130 can function as a resilient stopper to prevent the moving plate 130 from being vertically up, for example, due to malfunction of the lifting device 11. The lower end of the guide rail 120 is detached downward.

The vertical rail 120 serves as a guide to enable the laying plate 160 to move vertically.

The plate support 131 is coupled to the lower surface of the end of the layout plate 160 by a coupling bolt. The plate support 131 has a body that is inclined at the bottom to reduce its weight, thereby providing a stable support base for the laying plate 160.

The term "bottom inclined body" means that the bottom of the plate support 131 is inclined downward and to the right such that the end of the plate support 131 adjacent to the vertical rail 120 is called the free end than the plate support 131. And the other end opposite to the vertical rail 120 is thicker.

The upper surface of the plate support 131 is in contact with the lower surface of the end of the layout plate 160 and has A plurality of bolt holes enable the plate support 131 to be coupled to the routing plate 160 by bolts.

The moving plate 130 is vertically coupled to the plate support 131 by bolts. The LM guide 123 is interposed between the moving plate 130 and the vertical rail 120. That is, the front surface of the LM guide 123 is coupled to the rear surface of the moving plate 130. The LM guide 123 includes a coupling member provided with a ball roller. The coupling member of the LM guide 123 is slidably disposed above the rail unit, and the rail unit is disposed on the front surface of the vertical rail 120.

Also, with the LM guide 123, the moving plate 130 can be slidably coupled to the vertical rail 120 in the same manner as a typical LM guide coupling structure.

The lifting device 11 further includes a ball screw shaft block, a linear motor, a slider, or the like that moves the movable body (for example, the slider 141) in the axial direction.

Specifically, the lifting device 11 includes a guide bar 142, coupling blocks 143 and 144 respectively coupled to both ends of the guide bar 142, and a slider 141 slidably disposed on the guide bar 142.

The coupling blocks 143 and 144 are respectively fixed to the side surfaces of the upper end and the lower end of the vertical rail 120 by bolts. The guide rod 142 is disposed between the coupling blocks 143 and 144 and is disposed parallel to and spaced apart from the vertical rail 120 by a predetermined distance.

A slider 141 called a movable body is coupled to a rear surface of the moving plate 130 by a bolt at a position spaced apart from a side surface of the vertical rail 120.

The vibration motor element 170 is mounted in a mounting recess 162 formed in a lower surface of the routing plate 160. The vibration motor element 170 is used to generate a vibration force to prevent the container from escaping.

The layout plate 160 includes a plurality of conical tray guide pins 161 (see FIG. 2) and a plurality of conical plate guide pins 169 protruding from the upper surface of the layout plate 160 at positions corresponding to the periphery of the user tray CT.

Referring to FIG. 3, the layout plate 160 has a plurality of outer coupling recesses 163 formed around the mounting recess 162 in the periphery of the lower surface of the routing plate 160.

Further, the laying plate 160 includes a plurality of component mounting ribs 165 which are disposed in the mounting recess 162 along the longitudinal center axis of the routing plate 160 at positions spaced apart from each other. Each of the component mounting ribs 165 has an inner coupling recess 164. Here, the component mounting rib 165 of the routing board 160 is not an essential component. Further, the arrangement of the component mounting ribs 165 is not limited to the arrangement along the central axis.

The component mounting rib 165 and the routing plate 160 may be integrally formed or made of aluminum alloy, stainless steel, or the like.

In order to removably couple the vibration motor element 170 to the routing plate 160, bolt connection holes are respectively formed in the outer coupling recess 163 formed around the mounting recess 162 and the inner coupling recess 164 of the component mounting rib 165.

The values are selected or determined based on a plurality of test materials satisfying the following ranges (such as the thickness and width of the respective component mounting ribs 165, the distance between the component mounting ribs 165, etc.): the following vibration values can be obtained and the vibration force can be made It is reliably transmitted to the entire area of the layout board 160.

Each of the vibration motor elements 170 includes wings 171 and 172 and a motor bracket 173, wherein the wings 171 and 172 are coupled to respective outer coupling recesses 163 and respective inner coupling recesses 164, and the motor bracket 173 is integrally formed with the wings 171 and 172 and There is a motor mounting space 174 that houses the motor. The motor bracket 173 and the wings 171 and 172 are formed by bending a steel plate or injection molding.

Specifically, the wings 171 provided on one side of the motor bracket 173 are located within the inner coupling recess 164 of the respective mounting rib 165 and are coupled to the inner coupling recess 164 by bolts fixed to the respective bolt holes.

The wings 172 provided on the other side of the motor bracket 173 are located in the respective outer coupling recesses 163 formed around the mounting recesses 162, and are coupled to the outer coupling recesses 163 by bolts fixed to the respective bolt holes.

In addition, each of the vibration motor components 170 further includes a motor 175 that is mounted in a motor mounting control 174 of the motor bracket 173 and an eccentric block 176 that is coupled to a rotating shaft of the motor 175.

A stopper 177 is provided in the motor bracket 173 to restrict the movement of the motor 175 disposed in the motor mounting space 174.

4 is a perspective view showing a coupling structure between each of the vibration motor elements 170 and the layout plate 160 of FIG.

Referring to FIG. 4, the vibration motor elements 170 are disposed at positions spaced apart from each other along the longitudinal axis (Y-axis) of the layout plate 160 in the first and second regions formed on both sides of the component mounting rib 165.

Specifically, as shown in FIG. 4, the vibration motor element 170 is arranged to be aligned with each of the first center lines RL1 that are parallel to the longitudinal axis (Y-axis) of the routing plate 160.

The vibration motor element 170 is arranged to be deviated from the second center line RL2 based on each of the second center lines RL2 parallel to the lateral axis (X-axis) of the layout plate 160 (specifically, disposed on both sides of the second center line RL2) ). The length of the laying plate 160 along the longitudinal axis (Y axis) will be longer than the tangential plate 160 along the transverse axis (X The length of the axis).

That is, since the end faces of the eccentric blocks 176 of the respective motors 175 are parallel to the XZ plane, if the vibration motor elements 170 are arranged to be aligned with the second center line RL2, the vibrations generated by the rotation of the eccentric block 176 may collide or overlap each other. . In this case, the vibration generation efficiency is greatly reduced, or excessive vibration is generated, so that the possibility that the semiconductor device is located at a predetermined position is remarkably reduced.

Such an arrangement or arrangement characteristic of the vibration motor element 170 according to the present invention causes correct vibration characteristics (the vibration value ranges from 90 dB to 110 dB in the entire region of the layout plate 160), thereby increasing the deviation from the predetermined position of the corresponding container. The likelihood that certain semiconductor devices will be located at a predetermined location (in-position occupancy rate or in-position success rate). However, the arrangement of the vibration motor element 170 is not limited to the above embodiment. For example, a single row or three or more rows of vibrating motor elements 170 may be arranged with respect to the longitudinal direction of the routing plate 160. Other arrangements are possible in addition to the zigzag arrangement with respect to the lateral direction. Further, the vibration value applied to the entire area of the layout board 160 may be based on the layout board 160, the user tray CT placed on the layout board 160, and the electronic device (that is, the semiconductor device) loaded on the user tray CT. The shape and weight vary differently.

For the purposes of the present invention, various tests are performed after the user tray CT is placed on the routing board 160 and a plurality of semiconductor devices are placed on the user tray CT.

Here, a 24V DC motor is used as the motor 175 of each vibration motor component 170. Six motors 175 having the above-described arrangement characteristics are arranged and mounted on the lower surface of the laying plate 160, that is, the mounting recess 162. The motor 175 operates with an input operating voltage value selected from the range of 10V to 24V. The test results are shown in Table 1.

In the process of obtaining the result of Table 1, it is sent from the routing board 160 or measured in the acquisition table 1 In the course of the result, the vibration value transmitted or measured from the routing board 160 is in the range of 90 dB to 110 dB.

If the vibration value is less than 90 dB, the semiconductor device cannot move satisfactorily. If the vibration value is greater than 110 dB, the semiconductor device is excessively moved, and some semiconductor devices are shaken out of their containers. Therefore, the above vibration value is obviously a key value.

Specifically, when a motor capable of operating at a maximum of 24 V is used as each motor 175, the possibility that the semiconductor device enters its predetermined position can be varied according to the input value of the motor, and the optimum of the motor obtained from numerous tests The input value (operating voltage) is in the range of 10V to 24V. More preferably, when the operating voltage of the motor is 14V, the probability that the semiconductor device enters its predetermined position is maximized.

FIG. 5 is a front view showing the layout relationship between the layout board 160 and the user tray CT and the layout board 160 to explain the test state. Referring to Fig. 5, the above test is performed in a state where the layout board 160 is fixed so as not to be moved by the vibration or vibration force generated by the vibration motor element 170. When the vibration device according to the present invention is actually used, it also works after the layout plate 160 has moved to the maximum amount and has been fixed to the layout table 50 having the opening 51 for the user tray CT inserted on the layout plate 160. Thereby, the phenomenon that the semiconductor device jumps on the user tray CT due to the movement of the routing board 160 can be prevented.

In this embodiment, the plate guide pins 169 of the routing plate 160 are inserted into the corresponding pin holes 52 of the mounting table 50 such that the level (X-axis and Y-axis) movement of the routing plate 160 is restricted. Further, the laying plate 160 that is moved upward by the lifting force of the lifting device 11 is in close contact with the periphery of the laying table 150 defining the opening 51, so that the vertical (z-axis) movement of the laying plate 160 is restricted.

Referring again to FIG. 2, the cable holder 150 is mounted between the routing plate 160 and the vertical rail 120 and secured to the routing plate 160 and the vertical rail 120 by fasteners 151 and 152. Specifically, the fastener 152 coupled to one end of the cable rack 150 is bolted to the side surface of the corner of the layout board 160. A fastener 151 coupled to the other end of the cable rack 150 is bolted to the rear surface of the vertical rail 120.

The cable rack 150 is used to protect wires (not shown) for supplying power to the motor or cables (not shown) for controlling the operation of the motor.

Further, a first shock absorbing 183 protruding above the upper surface of the laying plate 160 is provided on the upper surface of the corner of the plate support 131.

The first shock absorbing 183 is used as a safety device for mitigating when the user tray CT on the laying plate 160 is brought into contact with the frame (not shown) of the test processor by inertial force when the laying plate 160 is lifted. The impact generated.

At the same time, the support bracket 181 protrudes from the side surface of the vertical rail 120. A second shock absorbing dam 180 facing the lower surface of the plate support 131 is mounted on the support bracket 181.

The second shock absorbing damper 180 is a safety device that prevents the downwardly moving routing plate 160 from moving excessively downward (for example, due to a malfunction).

Referring again to FIG. 4, the motor 175 of the vibration motor component 170 is electrically coupled to the vibration control circuit unit 195. The vibration control circuit unit 195 is provided in the form of a module for a main controller (not shown) for testing the processor and configured to perform a process of controlling the general operation and vibration of the motor 175.

Referring to FIG. 2, the image capturing device 190 is mounted at a position corresponding to the upper portion of the transfer module 10 by a hanger 191 located on a device frame (not shown) for testing the processor. The image capture device 190 captures an image of the upper surface of the user tray CT or the semiconductor device disposed on the user tray CT.

That is, the image capturing device 190 is used to capture an image to determine whether the semiconductor device is correctly placed in the container of the user tray CT or is incorrectly placed and transmits image information to the vibration control circuit unit 195.

The vibration control circuit unit 195 is electronically configured to perform an image analysis (eg, image interpretation) function and a motor vibration control function.

The vibration control circuit unit 195 inputs a motor input value to the motor 175 (refer to FIG. 4) at each preset timing in response to a preset motor operation algorithm (that is, a motor vibration control function), and causes rotation coupled to the motor 175. The eccentric block 176 of the shaft rotates to generate vibration from the vibration motor element 170.

When the image analysis function is used, when it is determined that a separate vibration other than the vibration of the preset timing is required, the vibration control circuit unit 195 also inputs a motor input value to the motor 175, thereby causing the eccentricity of the rotation shaft coupled to the motor 175. Block 176 rotates to generate vibrations from the vibration motor component 170. In other words, the vibration control circuit unit 195 reads the image captured by the image capturing device 190, and if there is a semiconductor device that is not disposed at a predetermined position on the user tray CT, the vibration control circuit unit 195 applies vibration to the layout board 160. Force to generate vibration.

Hereinafter, the operation of the first embodiment will be explained.

The transfer module 10 performs the typical operation of transferring the unloaded semiconductor device to the stacker.

During this operation, the vibration control circuit unit 195 inputs the motor input value to the motor 175 at a preset timing so that there is no user tray CT that is not correctly placed on the layout board 160. A semiconductor device in a container. In this embodiment, when unloading, the motor input value is input to the motor 175 after the routing plate 160 is pressed and fixed to the routing table 50.

Each motor 175 rotates an eccentric block 176 coupled to the axis of rotation of the motor 175 in response to the motor input value. Therefore, vibration is generated from the vibration motor element 170.

The vibration or vibration force generated from the vibration motor element 170 is transmitted to the user tray CT via the routing plate 160.

Based on the measured values, the vibration or vibration force in two seconds ranges from 90 dB to 110 dB.

Subsequently, the semiconductor device incorrectly placed in the container of the user tray CT correctly enters the container.

Further, based on the image analysis function, the vibration control circuit unit 195 can selectively operate or interrupt any one of the six motors 175 or individually adjust the motor input values (eg, voltage values) input to the respective six motors 175. The size is such that the vibrating motor element 170 is capable of generating different amplitudes of vibrational forces.

Although the vibration device according to the present invention has been shown to be used when the semiconductor device is unloaded, the present invention is not limited thereto. For example, the vibration device 100 according to the first embodiment can also be used when a semiconductor device is loaded. In other words, vibrations can be applied to the user tray to place the semiconductor device on the user tray on the loading panel in the correct position. As with the first embodiment, the same technical idea can be applied to the following second to fourth embodiments.

Further, in the above description, although the layout board 160 is illustrated as being fixed at a certain position when vibration is applied to the user tray CT, the present invention is not limited thereto. For example, the present invention can be configured to apply vibration to the user tray CT as the deployment panel 160 moves up or down. Also, if the present invention is configured to apply vibration while the routing board 160 is moving, it is advantageous in that the overall time taken to test the semiconductor device is reduced. This technical idea can be applied not only to the first embodiment but also to the second to fourth embodiments.

The second embodiment is different from the first embodiment described above, and the vibration device according to each of the second to fourth embodiments to be described below includes only one or two motors. In this case, the number of motors that must be controlled is reduced, thus contributing to the maintenance of the vibration device and reducing the weight of the device. Further, in the second to fourth embodiments, the weight of the device can be reduced by forming a through hole on the layout board or by applying the vibration to the user tray using only the bracket, the vibration motor element, and the guide rail without using the layout plate. .

6 is a view showing a vibration for a test processor according to a second embodiment of the present invention. A perspective view of the moving device. Fig. 7 is a cross-sectional view taken along line A-A of Fig. 6. Fig. 8 is a perspective view showing a bottom side of the vibration device of Fig. 6.

The vibration device 200 of Figures 6 through 8 is part of a transfer module 10 disposed in a test handler.

Referring to Figure 6, the vibratory device 200 is used with a user tray CT placed thereon and coupled to a lifting device 11 of an unloading transfer module 10, such as a test processor.

The lifting device 11 of the transfer module 10 is a device that is disposed below the opening of the laying table (not shown) and moves the vibration device 200 up or down. The lifting device 11 comprises a vertical rail 12, a plate support 13, a moving plate 14, a lifting device 15, a LM guide 16, a cable holder 17 and a shock absorbing damper 18, wherein the vertical rail 12 serves to enable the vibration device 200 to be vertical A straight moving guide, the plate support 13 is fastened to the lower surface of one end of the vibrating device 200, the moving plate 14 is coupled to the plate support 13 and slidably coupled to the vertical rail 12, and the lifting device 15 provides a force to lift the movement The plate 14, the LM guide 16 is mounted between the vertical rail 12 and the moving plate 14, and the shock absorbing damper 18 is disposed adjacent to the lower end of the vertical rail 12. The structure of the elements of the lifting device 11 is the same as that of the elements of the lifting device in the first embodiment, and thus a detailed description thereof will be omitted.

At the same time, the controller of the transfer module 10 controls not only the operation of the lifting vibration device 200 but also the motor operating voltage (ie, the motor input value) of the motor input to the vibration motor component 230 disposed below the lower surface of the vibration device 200. The operation of the motor is controlled such that the output vibration value corresponding to the motor input value is generated within a preset range. For example, based on the actual test of returning the semiconductor devices to their correct initial positions in the container, the vibration value, the vibration direction, and the like of the vibration device 200 are determined to be values that can maximize the seating rate of the semiconductor device. For example, the motor input value (ie, the motor operating voltage) of the motor input to the vibration device 200 may be a value selected from the range of 10V to 24V such that the vibration value generated from the planar vibration member 210 of the vibration device 200 can be at 90 dB to 110 dB. In the range. If the motor operating voltage is less than 10V, the output vibration value is too low to return the semiconductor devices to their correct initial position in the container, that is, they cannot be properly placed in the container. If the motor operating voltage is greater than 24V, the semiconductor device may be shaken out of the container. Therefore, the above operating voltage is considered to be a critical value.

The vibration device 200 is a device on which a user tray CT for a semiconductor device is placed.

6 to 8, the vibration device 200 includes a vibration member 210, a layout plate 220, and a vibration motor element 230, wherein the vibration member 210 generates vibration to be transmitted to the semiconductor device, cloth The plate 220 is provided separately from the vibration member 210 and serves as a support plate or a support frame of the vibration member 210, and the vibration motor element 230 generates vibration.

Referring to Fig. 6, the vibrating member 210 has a plate shape and is in surface contact with the lower surface of the user tray CT or supports the user tray CT thereon.

The vibration member 210 having a plate shape includes a curved portion 211 protruding from a corner or an edge portion of the vibration member 210 along the XY plane of the vibration member 210, thereby being capable of providing an optimum vibration force and capable of reliably maintaining the vibration member 210 and the layout plate Interlock between 220.

The layout plate 220 has a stepped recess 221 having a curved shape corresponding to the peripheral shape of the vibrating member 210, and a seating recess 221, and the curved portion 211 of the vibrating member 210 is along the thickness direction of the vibrating member 210 (Z The axial directions are respectively located in the in-place recesses 222.

Referring to Figures 7 and 8, the routing plate 220 supports a user tray CT thereon, receives the vibrating member 210 therein, and has a through hole 223. The through hole 223 has a rounded rectangular shape and is formed in the middle of the layout plate 220. The through hole 223 serves to reduce the weight of the layout board 220 and serves as a space in which the vibration motor element 230 is mounted. The number of the through holes 223 and the shape thereof may be freely changed within a range in which the strength of the layout plate 220 is maintained as long as it can provide a space required to be coupled between the vibration member 210 and the vibration motor element 230 and the vibration motor element 230 is required to be mounted. Space.

In this embodiment, the vibration member 210 has a shape in which the vibration member 210 is thinner than the layout plate 220 and larger than the through hole 223 to reduce the weight of the device and increase the vibration force transmission efficiency.

The vibration motor element 230 is disposed in the through hole 223 and coupled to the lower surface of the vibration member 210 and the lower surface of the peripheral portion of the layout plate 220 defining the through hole 223.

Specifically, each of the vibration motor elements 230 includes a pair of fastening blocks 231 and 232 that are coupled to a lower surface of a peripheral portion of the routing plate 220 that defines the through hole 223. The fastening blocks 231 and 232 are disposed below the lower surface of the layout plate 220 by any of the following methods: the fastening blocks 231 and 232 are integrally formed with the lower surface of the layout plate 220, and will be fastened by a holder to be described below. Blocks 231 and 232 are fabricated with the lower surface of the routing plate 220, and the fastening blocks 231 and 232 are separately fabricated and bolted to the routing plate 220.

Each of the vibration motor elements 230 further includes a holder 233 that connects the fastening blocks 231 and 232 to each other. The holder 233 can be manufactured separately. In this case, both ends of the holder 233 are connected to the fasteners 231 and 232, respectively. Alternatively, the holder 233 may be manufactured such that its both ends are integrally connected to the respective fastening blocks 231 and 232.

The holder 233 is a rod-shaped support structure and has at least one bolt hole 234 through which the motor housing 235 is coupled to the holder 233.

That is, the bolt is fixed in the motor housing 235 and the holder 233 through the bolt hole 234, so that the motor housing 235 can be supported by the holder 233.

As the motor housing 235 that is in contact with both sides of the holder 233, the upper surface thereof is coupled to the lower surface of the vibration member 210.

The motor housing 235 and the vibration member 210 are also coupled to each other by bolts. For example, referring to FIG. 6, in order to couple the motor housing 235 to the vibration member 210, at least one bolt hole 212 is formed in the vibration member 210, and a coupling hole (not shown) corresponding to the bolt hole 212 is formed in the motor In the upper surface of the housing 235.

Further, the motor housing 235 has a motor coupling hole 236 to detachably couple the motor 237 to the motor housing 235.

The motor 237 is inserted into the motor coupling hole 236 of the motor housing 235. The motor housing of the motor 237 is fastened to the motor coupling hole 236 by fastening means (eg, clamps, bolts, etc., not shown).

The motor 237 has a rotating shaft that protrudes beyond the motor coupling hole 236 of the motor housing 235. The vibration block 238 is coupled to the rotating shaft of the motor 237 such that the rotating shaft is offset from the center of the vibration block.

When the vibration block 238 that is off the center of the rotation shaft is rotated by rotating the rotation shaft of the motor 237, the vibration motor element 230 generates vibration.

The two vibration motor elements 230 may be installed in pairs in the space defined in the through holes 223 and located at positions spaced apart from each other. In this case, since only two motors 237 are used, it is possible to help control the motor. The vibration generated from each of the vibration motor elements 230 is transmitted to the user tray CT via the vibration member 210. Thus, semiconductor devices that are already on the edge of the container (i.e., containers that have partially deviated from the user tray CT) are able to enter their predetermined position in the container by vibrations transmitted to the user tray CT.

With the test results of the vibration device 100 of the first embodiment, it should be understood that although the seating rate may be according to various conditions such as the size of the semiconductor device, the direction in which the semiconductor device deviates from the predetermined position of the container (for example, the Y-axis direction), the motor input value. (Motor operating voltage) changes, etc., but it is sufficient to be applied to the actual test processor.

For example, as shown in Tables 2 to 4, although the ratio of the semiconductor device DEVICE to the predetermined position of the container (i.e., the deviation rate) may vary slightly depending on the measurement position, if the semiconductor device is The average deviation rate of the DEVICE is 10%, 25%, and 45%, and the occupancy rates are 100%, 62.5%, and 25.0%, respectively.

Since the values of Tables 2 to 4 may vary depending on the size, vibration direction, and vibration amplitude of the semiconductor device DEVICE, they are not limited to the values in Tables 2 to 4.

Fig. 9 is a perspective view showing the bottom side of the modified vibration device 200' according to the vibration device 200 of Fig. 6.

Referring to Fig. 9, the general structure of the vibrating device 200' is almost the same as that of the vibrating device 200 of Figs. However, the vibrating device 200' is characterized in that it has only one vibrating motor element 230 having a motor 237.

As for the numerical values in Table 5, since the seating ratio may also vary depending on the size, vibration direction, and vibration amplitude of the semiconductor device DEVICE, they are not limited to the values in Table 5. It should be understood that even when only one motor 237 is used, the quality of the vibrating apparatus is sufficient for use in a test processor.

The third embodiment is different from the technical idea of a vibration motor component including a wiring board having two through holes and a lower surface of the connecting rod provided to separate the two through holes from each other, according to a third embodiment to be described below. The technical idea of the vibration device of the mode is the same as that of the second embodiment. Therefore, in FIGS. 6 through 9, the same or similar reference numerals are used to refer to the same components, and further description of these components is considered unnecessary.

Fig. 10 is a perspective view showing a vibration device for a test handler according to a third embodiment of the present invention. Figure 11 is a cross-sectional view taken along line B-B of Figure 10 .

Referring to Figures 10 and 11, the vibrating device 300 can be mounted on the transfer module 10 shown in Figures 1, 2 or 6.

The vibrating device 300 includes a routing plate 320 that supports the user tray CT and has a figure-of-eight frame having two through holes 323 and 324.

Unlike the second embodiment, the layout plate 320 itself functions as a vibration plate to transmit vibration to the user tray CT without having a separate vibration member.

Further, the vibration device 300 includes a vibration motor element 330 coupled to the lower surface of the connecting rod 325, and the connecting rod 325 is integrally formed with the routing plate 320 to separate the two through holes 323 and 324. The connecting rod 325 can be integrally coupled to the laying plate 320 by various methods such as bolting, welding, etc. Alternatively, the connecting rod 325 can be integrally formed with the laying plate 320 by the process of cutting the laying plate 320.

The number and shape of the through holes can be freely changed as long as the strength of the laying plate 320 can be maintained.

The thickness of the connecting rod 325 is less than the thickness of the routing plate 320 to effectively transmit vibration to the user tray CT.

The vibration motor component 330 includes a motor housing 331, a motor 333, and a vibration block 334 coupled to a middle portion of a lower surface of the connecting rod 325, and the motor 333 is disposed in a motor coupling hole 332 of the motor housing 331, The vibration block 334 is coupled to the rotating shaft of the motor 333.

The vibration generated from the single vibration motor element 330 is transmitted to the user tray CT via the routing plate 320 and the connecting rod 325.

Further, since the vibration device 300 for the test processor according to the third embodiment does not have a separate vibration member, the weight of the vibration device 300 can be reduced as compared with the vibration device of the second embodiment. Furthermore, the use of only a single vibration motor component 330 can help control the motor.

Referring to Tables 6 and 7, in the vibration device 300, although the seating rate of the semiconductor device is smaller than the seating rate of the second embodiment, it is still sufficient for application to an actual test handler.

The fourth embodiment is different from the case of the second or third embodiment in that the layout plate has a single through hole and a rod type vibration motor element is disposed at a central position of the through hole. . Therefore, in FIGS. 6 through 11, the same or similar reference numerals are used to refer to the same components, and further description of these components will be omitted.

FIG. 12 is a view showing a vibration for a test processor according to a fourth embodiment of the present invention. A perspective view of the moving device 400. Fig. 13 is a perspective view showing the vibration device 400 of Fig. 12 as seen from another direction.

Referring to Figures 12 or 13, the vibratory device 400 can be mounted on the transfer module 10 as shown in Figures 1, 2 or 6.

The vibration device 400 is used to transmit vibrations to the user tray CT located thereon such that the semiconductor device of the user tray CT can be in the correct position in the container of the user tray CT.

The vibration device 400 includes a routing plate 420 and a vibration motor element 430 that supports the user tray CT and includes a frame having a rectangular ring shape having a single through hole 423 to which the vibration motor element 430 is coupled and disposed The inside of the through hole 423.

The laying plate 420 includes a vibrating bar 440 which has a smaller weight than the vibrating member of the second embodiment. Further, the routing plate 420 has a through hole 423 such that the weight of the vibration device 400 is reduced. Because a single motor 434 is used, it can help control the motor.

The vibration device 400 includes a pair of vibrating bars 440 which are devices for transmitting vibrations sufficiently to the user tray CT. The vibrating bars 440 are disposed inside the through holes 423 and at positions spaced apart from each other and are oriented to be parallel to each other in a direction corresponding to the longitudinal direction of the routing plate 420. The vibrating bar 440 is separately coupled to the vibrating motor element 430.

Each of the vibrating bars 440 has a shape of a thin rod or a belt. The thickness of each of the vibrating bars 440 is smaller than the thickness of the routing plate 420.

Further, each of the vibrating bars 440 may be configured such that the intermediate portion 442 and its both ends 441 are thicker than the extending portion 443 connecting the intermediate portion 442 to the both ends 441, so that the vibration force can be more efficiently transmitted to the user tray CT.

Bolt holes are formed in the intermediate portion 442 of each of the vibrating bars 440 such that the vibrating bars 440 can be coupled to the vibrating motor element 430.

The vibration motor element 430 includes a U-shaped support rod 431, a motor housing 432, a motor 434, and a vibration block 435 that connects the inner side surfaces of the periphery of the layout plate 420 defining the through hole 423 therein to each other. The machine housing 432 is coupled to the upper surface of the intermediate portion of the support rod 431, the motor 434 is disposed in the motor coupling hole 433 of the motor housing 432, and the vibration block 435 is coupled to the rotating shaft of the motor 434.

The vibration motor component 430 also includes opposing shoulders 436 that are stepped down from the motor housing 432 and have bolt holes in each of the shoulders 436 such that the respective vibrating bars 440 can be coupled thereto by bolts.

In the fourth embodiment, the through hole 423 is compared with the through hole of the foregoing embodiment. It is wider, so the weight of the layout board 423 can be reduced. In addition, since only a single motor 434 is used, it can be helpful to control the motor.

In this embodiment, the vibration generated from the single vibration motor element 430 can be transmitted to the user tray CT through the vibrating bar 440.

8 and 9, the vibration device 400 according to this embodiment is also characterized in that not only the control of the motor but also the weight and manufacturing cost of the device can be reduced.

The fifth embodiment, the vibration device according to the fifth embodiment is different from the first to fourth embodiments in that only the mounting position is shown, and the principle of generating vibration is the same as any of the first to fourth embodiments. . Therefore, in FIGS. 2 through 13, the same or similar reference numerals are used to refer to the same components, and further description of these components will be omitted.

FIG. 14 is a perspective view showing a vibration device 500 for a test processor according to a fifth embodiment of the present invention. Figure 15 is a front elevational view of the vibration device 500 of Figure 14 . Fig. 16 is a perspective view showing a modified version of the rail shown in Fig. 15.

The structure of the test handler provided with the vibration device 500 according to this embodiment may be different from that of the test processors of the first to fourth embodiments. The test handler according to this embodiment may have neither a layout board nor a sorting station. Referring to FIG. 14 or 15, in the test handler according to the embodiment, as an alternative to the sorting station Sta shown in FIG. 1, the transport unloading unit 20 is set. At the position of the sorting station Sta. The vibration device 500 according to this embodiment is disposed in the conveyance and unloading unit 20 and mounted on the surface of the base on which the conveyance and unloading unit 20 is disposed.

The transport unloading unit 20 is for transferring the user tray CT toward the transfer module 10 shown in FIG.

The conveying and unloading unit 20 includes a pair of conveyor belts 21, a plurality of conveying gears 22, a rotating shaft 23, a pulley 24, and a driving belt 25, which are coupled to the respective conveyor belts 21 to operate the conveyor belt in accordance with the conveyor. The conveyor belt is operated in the same manner, the rotary shaft 23 is coupled to the conveying gear 22 to simultaneously rotate the conveying gear 22 and rotatably supported by the support frame 29, the pulley 24 is disposed on the rotating shaft 23, and the driving belt 25 is wound around the pulley 24 The pulley 24 is provided with a rotational force. The conveyance and unloading unit 20 extends in the direction in which the user tray CT is transferred.

Two conveyor belts 21 are disposed within the support frame 29, the support frames being disposed parallel to each other and spaced apart from each other.

The vibration device 500 according to this embodiment is for supplying vibration to the user tray CT placed on the conveyance and unloading unit 20. In this case, in order to prevent excessive vibration from being applied to the semiconductor device placed on the user tray CT, the user tray CT can be fixed while the vibration is applied to the user tray CT.

The vibration device 500 includes a bracket 510, a vibration motor element 530, and a pair of rails 540 fixed to the surface of the base, a transport unloading unit 20 mounted on the surface of the base, and a vibration motor element 530 coupled to one end of the bracket 510, A pair of rails 540 are disposed in the conveyance and unloading unit 20 and spaced apart from each other and oriented to be parallel to each other in a direction in which the conveyance and unloading unit 20 extends. The track 540 is coupled to the vibration motor element 530.

When the user tray CT is stopped at the predetermined position, the rail 540 transmits the vibration to the user tray CT. Further, when the user tray CT is transferred by the conveyance unloading unit 20, the lower surface of the user tray CT slides on the rail 540. In these respects, the track 540 is different from the vibrating bar of the fourth embodiment. A wedge member 542 is provided at both ends of each of the rails 540, so that when the user tray CT is transferred, it is possible to prevent both ends of the rail 540 from blocking the periphery of the user tray CT.

Each vibrating bar or each track 540 is coupled to the vibrating motor element of the fourth embodiment or the vibrating motor element 530 of the fifth embodiment in the form of a cantilever and is used to transmit vibration to the user tray CT. According to the fact that the container detachment phenomenon can be reduced by the above functions, the track 540 can be considered to have the same technical idea as the technical idea of the vibrating bar.

The vibration motor component 530 includes an extension portion 531, a motor housing 533, a motor 535, and The vibration block 536, the extension portion 531 is located at the upper end of the bracket 510 and is fastened to the upper end of the bracket 510 by bolts, and the motor housing 533 is integrally provided with the extension portion 531 and has rails on both sides of the upper surface of the motor housing 533. The base portion 532 is such that two rails 540 are coupled to the respective rail base portion 532, and the motor 535 is placed in a motor coupling hole 534 formed in the motor housing 533, and the vibration block 536 is coupled to the rotation shaft of the motor 535. .

Each of the rails 540 includes a sliding member 541 having a coupling hole and being bolted to a corresponding rail base member 532, and a wedge member 542 formed on both sides of the sliding member 541.

The user tray CT is transferred to the conveyance and unloading unit 20 by a conveyor (not shown). The lower surface of the user tray CT that has been transferred to the conveyance and unloading unit 20 is in close contact with the upper surface of the rail 540.

In this state, the vibration generated from the vibration motor element 530 is transferred to the user tray CT via the rail 540. Therefore, the semiconductor devices that have been placed at the edge of the container (i.e., the container that has partially deviated from the user tray CT) can enter their predetermined positions in the container by the vibration transmitted to the user tray CT.

15 and 16, the sliding member 541a has a sliding member 543 which protrudes upward from both side edges of the upper surface of the sliding member 541a to reduce friction between the sliding member 541a and the lower surface of the user tray CT, and The conveyor belt 21 of the conveyance and unloading unit 20 enables the user tray CT to be smoothly transferred.

The internal space between the two sliding members 543 can be formed by forming a recess in the upper surface of the sliding member 541a.

Referring to Figures 14 or 15, the vibration generated from a single vibrating motor element 530 can be transmitted to the user tray CT via two rails 540.

Fig. 17 is a photograph in place of the drawing, showing the state of the user tray CT and the semiconductor device before the vibration device 500 of Fig. 14 vibrates. Fig. 18 is a photograph instead of the drawing showing the state of the user tray CT and the semiconductor device after the vibration device 500 of Fig. 17 vibrates.

In the case of the user tray of Fig. 17, as indicated by the white dots, thirty-nine semiconductor devices are involved in the container detachment phenomenon. The user tray is placed on the conveyor belt of the stepped reciprocating device.

Here, the vibrating motor elements and tracks already described above will be placed under the user tray of Figure 17. The upper surface of the track is in contact with the lower surface of the user tray.

Referring to Figure 18, the vibration generated from the vibrating motor element has been transferred via the track After the user tray, only eleven of the thirty-nine semiconductor devices were not in the container. Of course, although the number of semiconductor devices deviated from the container may vary according to the above-mentioned conditions (for example, the semiconductor device holds, the direction in which the semiconductor device deviates from the predetermined position of the container, the deviation rate, the motor input value, etc.), The number is not limited to the above embodiment.

Also, referring to the comparative observations of Figs. 17 and 18, it should be understood that when the vibration device provided with the vibration motor element and the track is used for the test processor, it not only helps to control the motor but also reduces the weight of the device. And manufacturing costs.

A vibration device for a test processor according to an embodiment of the present invention determines an optimum value of an arrangement of the vibration motor elements, a number of vibration motor elements, an input value as a drive voltage, and a vibration amplitude from the test. Therefore, the semiconductor device can be placed more efficiently on the predetermined position of the container of the user tray by the vibration or vibration force applied to the semiconductor device.

That is, embodiments of the present invention are capable of correctly placing the semiconductor device in a corresponding container of the user tray, thereby preventing semiconductors when the user tray is placed on top of another user tray in the unloading stacker The device is damaged.

Further, in the embodiment of the present invention, when the user tray that has been placed on top of another user tray is transferred to the outside of the unloading stacker, since the user tray can be reliably and correctly transferred, There is a possibility that the semiconductor device is lost from the user tray.

According to some embodiments of the invention, the number of vibrating motor elements is minimized, thus helping to control the motor.

According to some embodiments of the present invention, it is possible to reduce the weight of the layout board while maintaining the quality of the operation of placing the semiconductor device at a predetermined position. That is to say, the operating efficiency can be maximized by the optimal configuration of the device.

According to one of the embodiments of the present invention, the routing plate having the through holes is manufactured separately from the planar vibration member. In this case, it is possible to prevent additional vibration generated from the fastening block of the laying board and the holder from being transmitted to the user tray. In other words, only the vibration generated from the vibrating member can be transmitted to the user tray so that the vibration force can be uniformly applied to the user tray.

While a pick and place apparatus in accordance with an embodiment of the present invention has been shown and described with respect to the preferred embodiments, it will be understood by those skilled in the art, without departing from the spirit and scope of the invention as defined by the appended claims Many changes and modifications can be made to the invention.

500‧‧‧Vibration device

510‧‧‧ bracket

530‧‧‧Vibration motor components

531‧‧‧Extension

532‧‧‧ Track base parts

533‧‧‧Motor housing

535‧‧‧Motor

536‧‧‧vibration block

540‧‧‧ Track

541‧‧‧Sliding parts

542‧‧‧Wedges

STa‧‧‧Classification table

20‧‧‧Conveying and unloading unit

21‧‧‧ conveyor belt

22‧‧‧Transport gear

23‧‧‧Rotary axis

24‧‧‧ pulley

25‧‧‧ drive belt

29‧‧‧Support frame

CT‧‧‧Tray

Claims (5)

A vibration device for testing a processor, comprising: a transport unloading unit for supporting a user tray on which a semiconductor device is disposed, the transport unloading unit transferring the user tray to a transfer module; Fastened to the surface of the base, the transport unloading unit is mounted on the surface of the base; a vibrating motor element connected to one side of the bracket, the vibrating motor element for generating vibration; and a pair of rails, In the conveying and unloading unit and spaced apart from each other and oriented parallel to each other in a direction in which the conveying and unloading unit extends, the rail is separately coupled to the vibration motor element; wherein the vibration is transmitted to the vibration via the rail The user tray is described such that the semiconductor device is positioned at a predetermined location. The vibration device of claim 1, further comprising: an image capturing device for capturing an image of the semiconductor device disposed on the user tray; and a vibration control circuit unit for using the image To determine whether the semiconductor device is positioned at a predetermined position, the vibration control circuit unit operates the vibration motor component when the semiconductor is not in a predetermined position. The vibration device of claim 1, wherein the vibration motor component comprises: an extension portion disposed at an upper end of the bracket and coupled to the bracket by a bolt; a motor housing integral with the extension portion Providing that the motor housing has a rail base portion on an opposite side of an upper surface of the motor housing such that the rail is coupled to a corresponding rail base portion; a motor coupled to the motor housing a motor coupling hole; and a vibration block coupled to the rotating shaft of the motor. The vibration device of claim 3, wherein each of the rails comprises: a sliding member having a coupling hole, the sliding member being coupled to the corresponding rail base portion through the coupling hole by a bolt; and a wedge shape Pieces are formed at both ends of the sliding member. The vibration device of claim 4, wherein the sliding member includes a sliding member that protrudes upward from opposite side edges of an upper surface of the sliding member, respectively, such that the sliding member and the user tray The friction between the lower surfaces is reduced.