KR102265641B1 - 전기적 접촉자 및 프로브 카드 - Google Patents

전기적 접촉자 및 프로브 카드 Download PDF

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Publication number
KR102265641B1
KR102265641B1 KR1020200020772A KR20200020772A KR102265641B1 KR 102265641 B1 KR102265641 B1 KR 102265641B1 KR 1020200020772 A KR1020200020772 A KR 1020200020772A KR 20200020772 A KR20200020772 A KR 20200020772A KR 102265641 B1 KR102265641 B1 KR 102265641B1
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KR
South Korea
Prior art keywords
contact
electrical
substrate
probe
electrode
Prior art date
Application number
KR1020200020772A
Other languages
English (en)
Korean (ko)
Other versions
KR20200115103A (ko
Inventor
쇼고 미즈타니
Original Assignee
가부시키가이샤 니혼 마이크로닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 니혼 마이크로닉스 filed Critical 가부시키가이샤 니혼 마이크로닉스
Publication of KR20200115103A publication Critical patent/KR20200115103A/ko
Application granted granted Critical
Publication of KR102265641B1 publication Critical patent/KR102265641B1/ko

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06744Microprobes, i.e. having dimensions as IC details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020200020772A 2019-03-29 2020-02-20 전기적 접촉자 및 프로브 카드 KR102265641B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019065829A JP7393873B2 (ja) 2019-03-29 2019-03-29 電気的接触子及びプローブカード
JPJP-P-2019-065829 2019-03-29

Publications (2)

Publication Number Publication Date
KR20200115103A KR20200115103A (ko) 2020-10-07
KR102265641B1 true KR102265641B1 (ko) 2021-06-16

Family

ID=72673146

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200020772A KR102265641B1 (ko) 2019-03-29 2020-02-20 전기적 접촉자 및 프로브 카드

Country Status (4)

Country Link
JP (1) JP7393873B2 (ja)
KR (1) KR102265641B1 (ja)
CN (1) CN111751584B (ja)
TW (1) TWI743670B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102409029B1 (ko) * 2022-04-12 2022-06-14 이시훈 프로브 핀

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000005B1 (ko) 2007-01-22 2010-12-09 가부시키가이샤 니혼 마이크로닉스 프로브 및 이를 이용한 전기적 접속장치
JP2016170159A (ja) 2014-07-29 2016-09-23 日置電機株式会社 プローブユニットおよびプローブユニット製造方法

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Publication number Priority date Publication date Assignee Title
JP3675989B2 (ja) * 1995-11-17 2005-07-27 株式会社テセック 電子部品用コネクタ
JP3307823B2 (ja) * 1996-02-23 2002-07-24 松下電器産業株式会社 電子部品検査用接触体の製造方法
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
JP2006132982A (ja) * 2004-11-02 2006-05-25 Tokyo Electron Ltd プローブ
US8253430B2 (en) * 2005-04-22 2012-08-28 Hewlett-Packard Development Company Circuit board testing using a probe
KR20060124562A (ko) * 2005-05-31 2006-12-05 가부시키가이샤 니혼 마이크로닉스 통전시험용 프로브
US7629807B2 (en) * 2005-08-09 2009-12-08 Kabushiki Kaisha Nihon Micronics Electrical test probe
JP2008203036A (ja) * 2007-02-19 2008-09-04 Micronics Japan Co Ltd 電気的接続装置
KR101369406B1 (ko) * 2008-01-21 2014-03-04 (주) 미코에스앤피 탐침 구조물 및 이를 갖는 전기적 검사 장치
KR100876077B1 (ko) * 2008-04-14 2008-12-26 이억기 초소형 프로브 구조체
JP2011117761A (ja) * 2009-12-01 2011-06-16 Japan Electronic Materials Corp プローブカードおよびプローブカードの製造方法
JP5968158B2 (ja) * 2012-08-10 2016-08-10 株式会社日本マイクロニクス コンタクトプローブ及びプローブカード
JP2015032285A (ja) * 2013-08-07 2015-02-16 三菱鉛筆株式会社 タッチパネルに用いられるスタイラスペン
JP2016148566A (ja) * 2015-02-12 2016-08-18 日本電子材料株式会社 プローブカード
JP2018028494A (ja) * 2016-08-19 2018-02-22 株式会社日本マイクロニクス 電気的接続装置及びプローブ支持体
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
CN107243543A (zh) * 2017-06-30 2017-10-13 昆山杰顺通精密组件有限公司 弹性探针的制造方法
CN109330038B (zh) * 2018-12-24 2021-05-11 常州市派腾电子技术服务有限公司 雾化器及电子烟

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000005B1 (ko) 2007-01-22 2010-12-09 가부시키가이샤 니혼 마이크로닉스 프로브 및 이를 이용한 전기적 접속장치
JP2016170159A (ja) 2014-07-29 2016-09-23 日置電機株式会社 プローブユニットおよびプローブユニット製造方法

Also Published As

Publication number Publication date
CN111751584B (zh) 2024-02-09
JP2020165773A (ja) 2020-10-08
KR20200115103A (ko) 2020-10-07
JP7393873B2 (ja) 2023-12-07
TWI743670B (zh) 2021-10-21
CN111751584A (zh) 2020-10-09
TW202104906A (zh) 2021-02-01

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