KR102265641B1 - 전기적 접촉자 및 프로브 카드 - Google Patents
전기적 접촉자 및 프로브 카드 Download PDFInfo
- Publication number
- KR102265641B1 KR102265641B1 KR1020200020772A KR20200020772A KR102265641B1 KR 102265641 B1 KR102265641 B1 KR 102265641B1 KR 1020200020772 A KR1020200020772 A KR 1020200020772A KR 20200020772 A KR20200020772 A KR 20200020772A KR 102265641 B1 KR102265641 B1 KR 102265641B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- electrical
- substrate
- probe
- electrode
- Prior art date
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019065829A JP7393873B2 (ja) | 2019-03-29 | 2019-03-29 | 電気的接触子及びプローブカード |
JPJP-P-2019-065829 | 2019-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200115103A KR20200115103A (ko) | 2020-10-07 |
KR102265641B1 true KR102265641B1 (ko) | 2021-06-16 |
Family
ID=72673146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200020772A KR102265641B1 (ko) | 2019-03-29 | 2020-02-20 | 전기적 접촉자 및 프로브 카드 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7393873B2 (ja) |
KR (1) | KR102265641B1 (ja) |
CN (1) | CN111751584B (ja) |
TW (1) | TWI743670B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102409029B1 (ko) * | 2022-04-12 | 2022-06-14 | 이시훈 | 프로브 핀 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101000005B1 (ko) | 2007-01-22 | 2010-12-09 | 가부시키가이샤 니혼 마이크로닉스 | 프로브 및 이를 이용한 전기적 접속장치 |
JP2016170159A (ja) | 2014-07-29 | 2016-09-23 | 日置電機株式会社 | プローブユニットおよびプローブユニット製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3675989B2 (ja) * | 1995-11-17 | 2005-07-27 | 株式会社テセック | 電子部品用コネクタ |
JP3307823B2 (ja) * | 1996-02-23 | 2002-07-24 | 松下電器産業株式会社 | 電子部品検査用接触体の製造方法 |
US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
JP2006132982A (ja) * | 2004-11-02 | 2006-05-25 | Tokyo Electron Ltd | プローブ |
US8253430B2 (en) * | 2005-04-22 | 2012-08-28 | Hewlett-Packard Development Company | Circuit board testing using a probe |
KR20060124562A (ko) * | 2005-05-31 | 2006-12-05 | 가부시키가이샤 니혼 마이크로닉스 | 통전시험용 프로브 |
US7629807B2 (en) * | 2005-08-09 | 2009-12-08 | Kabushiki Kaisha Nihon Micronics | Electrical test probe |
JP2008203036A (ja) * | 2007-02-19 | 2008-09-04 | Micronics Japan Co Ltd | 電気的接続装置 |
KR101369406B1 (ko) * | 2008-01-21 | 2014-03-04 | (주) 미코에스앤피 | 탐침 구조물 및 이를 갖는 전기적 검사 장치 |
KR100876077B1 (ko) * | 2008-04-14 | 2008-12-26 | 이억기 | 초소형 프로브 구조체 |
JP2011117761A (ja) * | 2009-12-01 | 2011-06-16 | Japan Electronic Materials Corp | プローブカードおよびプローブカードの製造方法 |
JP5968158B2 (ja) * | 2012-08-10 | 2016-08-10 | 株式会社日本マイクロニクス | コンタクトプローブ及びプローブカード |
JP2015032285A (ja) * | 2013-08-07 | 2015-02-16 | 三菱鉛筆株式会社 | タッチパネルに用いられるスタイラスペン |
JP2016148566A (ja) * | 2015-02-12 | 2016-08-18 | 日本電子材料株式会社 | プローブカード |
JP2018028494A (ja) * | 2016-08-19 | 2018-02-22 | 株式会社日本マイクロニクス | 電気的接続装置及びプローブ支持体 |
JP2018179721A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN107243543A (zh) * | 2017-06-30 | 2017-10-13 | 昆山杰顺通精密组件有限公司 | 弹性探针的制造方法 |
CN109330038B (zh) * | 2018-12-24 | 2021-05-11 | 常州市派腾电子技术服务有限公司 | 雾化器及电子烟 |
-
2019
- 2019-03-29 JP JP2019065829A patent/JP7393873B2/ja active Active
-
2020
- 2020-02-05 TW TW109103447A patent/TWI743670B/zh active
- 2020-02-20 KR KR1020200020772A patent/KR102265641B1/ko active IP Right Grant
- 2020-03-25 CN CN202010216399.2A patent/CN111751584B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101000005B1 (ko) | 2007-01-22 | 2010-12-09 | 가부시키가이샤 니혼 마이크로닉스 | 프로브 및 이를 이용한 전기적 접속장치 |
JP2016170159A (ja) | 2014-07-29 | 2016-09-23 | 日置電機株式会社 | プローブユニットおよびプローブユニット製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111751584B (zh) | 2024-02-09 |
JP2020165773A (ja) | 2020-10-08 |
KR20200115103A (ko) | 2020-10-07 |
JP7393873B2 (ja) | 2023-12-07 |
TWI743670B (zh) | 2021-10-21 |
CN111751584A (zh) | 2020-10-09 |
TW202104906A (zh) | 2021-02-01 |
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