KR102245056B1 - 전면 발광형 반도체 발광 장치 - Google Patents

전면 발광형 반도체 발광 장치 Download PDF

Info

Publication number
KR102245056B1
KR102245056B1 KR1020157032326A KR20157032326A KR102245056B1 KR 102245056 B1 KR102245056 B1 KR 102245056B1 KR 1020157032326 A KR1020157032326 A KR 1020157032326A KR 20157032326 A KR20157032326 A KR 20157032326A KR 102245056 B1 KR102245056 B1 KR 102245056B1
Authority
KR
South Korea
Prior art keywords
layer
leds
reflective
led
wavelength converting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157032326A
Other languages
English (en)
Korean (ko)
Other versions
KR20150142033A (ko
Inventor
브렌단 주드 모란
마크 안드레 드 삼버
그리고리 바신
노베르투스 안토니우스 마리아 스위거스
마크 멜빈 버터워스
케네스 밤폴라
클라리세 마주이르
Original Assignee
루미리즈 홀딩 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 루미리즈 홀딩 비.브이. filed Critical 루미리즈 홀딩 비.브이.
Publication of KR20150142033A publication Critical patent/KR20150142033A/ko
Application granted granted Critical
Publication of KR102245056B1 publication Critical patent/KR102245056B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H01L33/20
    • H01L33/0095
    • H01L33/46
    • H01L33/50
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/862Resonant cavity structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H01L2924/12041
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020157032326A 2013-04-11 2014-03-31 전면 발광형 반도체 발광 장치 Active KR102245056B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361810833P 2013-04-11 2013-04-11
US61/810,833 2013-04-11
US201361900466P 2013-11-06 2013-11-06
US61/900,466 2013-11-06
PCT/IB2014/060310 WO2014167455A2 (en) 2013-04-11 2014-03-31 Top emitting semiconductor light emitting device

Publications (2)

Publication Number Publication Date
KR20150142033A KR20150142033A (ko) 2015-12-21
KR102245056B1 true KR102245056B1 (ko) 2021-04-27

Family

ID=51690078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157032326A Active KR102245056B1 (ko) 2013-04-11 2014-03-31 전면 발광형 반도체 발광 장치

Country Status (7)

Country Link
US (1) US9871167B2 (https=)
EP (1) EP2984685B1 (https=)
JP (2) JP6680670B2 (https=)
KR (1) KR102245056B1 (https=)
CN (3) CN105378950A (https=)
TW (1) TWI659551B (https=)
WO (1) WO2014167455A2 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105493301A (zh) * 2013-07-08 2016-04-13 皇家飞利浦有限公司 波长转换的半导体发光器件
CN113658943A (zh) * 2013-12-13 2021-11-16 晶元光电股份有限公司 发光装置及其制作方法
DE102014101492A1 (de) * 2014-02-06 2015-08-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US20160225962A1 (en) * 2015-01-30 2016-08-04 Empire Technology Development Llc Nanoparticle gradient refractive index encapsulants for semi-conductor diodes
CN107258014B (zh) * 2015-02-18 2021-04-13 亮锐控股有限公司 具有多个堆叠的发光设备的设备
DE102015107593A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Leuchtmittel
KR102641716B1 (ko) * 2015-08-03 2024-02-29 루미리즈 홀딩 비.브이. 반사성 측면 코팅을 가지는 반도체 발광 디바이스
US9753277B2 (en) 2015-08-11 2017-09-05 Delta Electronics, Inc. Wavelength conversion device
JP6327220B2 (ja) * 2015-08-31 2018-05-23 日亜化学工業株式会社 発光装置
WO2017052800A1 (en) * 2015-09-25 2017-03-30 Koninklijke Philips N.V. Surface emitter with light-emitting area equal to the led top surface and its fabrication
TWI587543B (zh) * 2015-12-15 2017-06-11 李乃義 發光二極體封裝結構及其製造方法
KR102700918B1 (ko) * 2015-12-29 2024-09-02 루미리즈 홀딩 비.브이. 측면 반사기들 및 인광체를 갖는 플립 칩 led
JP6974324B2 (ja) 2015-12-29 2021-12-01 ルミレッズ ホールディング ベーフェー 側面反射器と蛍光体とを備えるフリップチップled
FR3056014B1 (fr) * 2016-09-15 2020-05-29 Valeo Vision Procede pour creer une isolation optique entre des pixels d'une matrice de sources lumineuses semi-conductrices
FR3061358B1 (fr) * 2016-12-27 2021-06-11 Aledia Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine
JP6699580B2 (ja) 2017-02-09 2020-05-27 日亜化学工業株式会社 発光装置
JP6662322B2 (ja) 2017-02-09 2020-03-11 日亜化学工業株式会社 発光装置
US10546985B2 (en) * 2017-03-28 2020-01-28 Nanosys, Inc. Method for increasing the light output of microLED devices using quantum dots
US10224358B2 (en) * 2017-05-09 2019-03-05 Lumileds Llc Light emitting device with reflective sidewall
JP6699634B2 (ja) * 2017-07-28 2020-05-27 日亜化学工業株式会社 発光装置の製造方法
US10854794B2 (en) * 2017-12-20 2020-12-01 Lumileds Llc Monolithic LED array structure
US11355548B2 (en) * 2017-12-20 2022-06-07 Lumileds Llc Monolithic segmented LED array architecture
US20190198564A1 (en) * 2017-12-20 2019-06-27 Lumileds Llc Monolithic segmented led array architecture with islanded epitaxial growth
US11296262B2 (en) * 2017-12-21 2022-04-05 Lumileds Llc Monolithic segmented LED array architecture with reduced area phosphor emission surface
US10879431B2 (en) 2017-12-22 2020-12-29 Lumileds Llc Wavelength converting layer patterning for LED arrays
KR102536844B1 (ko) * 2018-10-15 2023-05-30 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
US11201267B2 (en) 2018-12-21 2021-12-14 Lumileds Llc Photoresist patterning process supporting two step phosphor-deposition to form an LED matrix array
US20240213401A1 (en) * 2022-12-21 2024-06-27 Creeled, Inc. Textured lumiphore layer to improve light extraction for light-emitting diode chips and related methods
CN118899327A (zh) * 2023-05-05 2024-11-05 北京字跳网络技术有限公司 Micro/Nano LED装置及其制备方法
CN117558851A (zh) * 2024-01-05 2024-02-13 晶能光电股份有限公司 发光装置及其制备方法、发光阵列结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066193A (ja) * 2009-09-17 2011-03-31 Rohm Co Ltd 光学装置および光学装置の製造方法

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6229160B1 (en) * 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
WO2002041362A2 (en) 2000-11-17 2002-05-23 Emcore Corporation Laser separated die with tapered sidewalls for improved light extraction
US6417019B1 (en) * 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
EP1803164B1 (en) * 2004-10-13 2011-12-14 Panasonic Corporation Luminescent light source, method for manufacturing the same, and light-emitting apparatus
US7964884B2 (en) 2004-10-22 2011-06-21 Seoul Opto Device Co., Ltd. GaN compound semiconductor light emitting element and method of manufacturing the same
DE102004053116A1 (de) * 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
US20080191609A1 (en) * 2005-04-19 2008-08-14 Koninklijke Philips Electronics N.V. Illumination System Comprising a Red-Emitting Ceramic Luminescence Converter
JP2007266343A (ja) 2006-03-29 2007-10-11 Toyoda Gosei Co Ltd 発光装置
CN101127379A (zh) 2006-08-16 2008-02-20 苏忠杰 高提取效率发光装置
JP4650378B2 (ja) * 2006-08-31 2011-03-16 日亜化学工業株式会社 発光装置の製造方法
US7789531B2 (en) * 2006-10-02 2010-09-07 Illumitex, Inc. LED system and method
US20090275157A1 (en) * 2006-10-02 2009-11-05 Illumitex, Inc. Optical device shaping
KR101271225B1 (ko) 2006-10-31 2013-06-03 삼성디스플레이 주식회사 발광 다이오드 칩 및 발광 다이오드 광원 모듈의 제조 방법
JP4655029B2 (ja) * 2006-11-20 2011-03-23 パナソニック株式会社 発光装置および半導体発光素子の製造方法
JP2008187030A (ja) * 2007-01-30 2008-08-14 Stanley Electric Co Ltd 発光装置
JP2008205229A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 半導体発光素子、半導体発光装置および製造方法
TWI350012B (en) * 2007-05-04 2011-10-01 Lite On Technology Corp White light emitting diode and base thereof
US20090140279A1 (en) * 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
KR100944008B1 (ko) * 2007-12-17 2010-02-24 삼성전기주식회사 백색 발광소자 및 그 제조방법
US8878219B2 (en) * 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US7923746B2 (en) * 2008-03-12 2011-04-12 Industrial Technology Research Institute Light emitting diode package structure and method for fabricating the same
US8236582B2 (en) 2008-07-24 2012-08-07 Philips Lumileds Lighting Company, Llc Controlling edge emission in package-free LED die
US20100279437A1 (en) * 2009-05-01 2010-11-04 Koninklijke Philips Electronics N.V. Controlling edge emission in package-free led die
KR101639793B1 (ko) * 2008-09-25 2016-07-15 코닌클리케 필립스 엔.브이. 코팅된 발광 장치 및 그 코팅 방법
CN101551068A (zh) * 2009-04-30 2009-10-07 旭丽电子(广州)有限公司 一种发光二极管装置及其封装方法
US8440500B2 (en) * 2009-05-20 2013-05-14 Interlight Optotech Corporation Light emitting device
JP2011171327A (ja) * 2010-02-16 2011-09-01 Toshiba Corp 発光素子およびその製造方法、並びに発光装置
JP2012039013A (ja) * 2010-08-10 2012-02-23 Citizen Electronics Co Ltd 発光装置の製造方法
JP2012079776A (ja) * 2010-09-30 2012-04-19 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
JP2012084622A (ja) * 2010-10-08 2012-04-26 Citizen Holdings Co Ltd 半導体発光素子の製造方法
JP5508244B2 (ja) * 2010-11-15 2014-05-28 シチズンホールディングス株式会社 半導体発光装置の製造方法
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
JP5962102B2 (ja) * 2011-03-24 2016-08-03 日亜化学工業株式会社 発光装置及びその製造方法
JP5670249B2 (ja) * 2011-04-14 2015-02-18 日東電工株式会社 発光素子転写シートの製造方法、発光装置の製造方法、発光素子転写シートおよび発光装置
JP5840377B2 (ja) 2011-04-14 2016-01-06 日東電工株式会社 反射樹脂シートおよび発光ダイオード装置の製造方法
JP5745319B2 (ja) * 2011-04-14 2015-07-08 日東電工株式会社 蛍光反射シート、および、発光ダイオード装置の製造方法
KR20140022019A (ko) * 2011-04-20 2014-02-21 가부시키가이샤 에루므 발광장치 및 그 제조방법
JP5619680B2 (ja) * 2011-06-03 2014-11-05 シチズンホールディングス株式会社 半導体発光素子の製造方法
JP2013016588A (ja) * 2011-07-01 2013-01-24 Citizen Electronics Co Ltd Led発光装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066193A (ja) * 2009-09-17 2011-03-31 Rohm Co Ltd 光学装置および光学装置の製造方法

Also Published As

Publication number Publication date
JP6680670B2 (ja) 2020-04-15
JP2016518713A (ja) 2016-06-23
KR20150142033A (ko) 2015-12-21
EP2984685B1 (en) 2018-12-19
JP6933691B2 (ja) 2021-09-08
TWI659551B (zh) 2019-05-11
WO2014167455A3 (en) 2015-01-08
CN111628062A (zh) 2020-09-04
WO2014167455A2 (en) 2014-10-16
TW201501366A (zh) 2015-01-01
US9871167B2 (en) 2018-01-16
CN111613708B (zh) 2024-09-20
CN105378950A (zh) 2016-03-02
CN111613708A (zh) 2020-09-01
EP2984685A2 (en) 2016-02-17
JP2019192946A (ja) 2019-10-31
US20160240735A1 (en) 2016-08-18

Similar Documents

Publication Publication Date Title
JP6933691B2 (ja) トップエミッション型半導体発光デバイス
JP7136834B2 (ja) 小型光源を有する波長変換発光デバイス
JP6419077B2 (ja) 波長変換発光デバイス
KR102237304B1 (ko) 반사기 및 광학 요소를 갖는 발광 디바이스
KR102467614B1 (ko) 패키지화된 파장 변환형 발광 디바이스
US20160322540A1 (en) Wavelength converted semiconductor light emitting device
KR102504008B1 (ko) 다수의 적층된 발광 디바이스를 갖는 디바이스

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20151111

Patent event code: PA01051R01D

Comment text: International Patent Application

AMND Amendment
PG1501 Laying open of application
N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20180214

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190329

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200423

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20201029

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200423

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20201029

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20200623

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20190329

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20151113

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20210128

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20201229

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20201029

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20200623

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20190329

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20151113

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20210421

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20210421

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240409

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20250408

Start annual number: 5

End annual number: 5