KR102239538B1 - 임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 - Google Patents

임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 Download PDF

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KR102239538B1
KR102239538B1 KR1020170155286A KR20170155286A KR102239538B1 KR 102239538 B1 KR102239538 B1 KR 102239538B1 KR 1020170155286 A KR1020170155286 A KR 1020170155286A KR 20170155286 A KR20170155286 A KR 20170155286A KR 102239538 B1 KR102239538 B1 KR 102239538B1
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region
imprint material
imprint
substrate
light
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KR20180062360A (ko
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아키코 이이무라
다쿠로 야마자키
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170155286A 2016-11-30 2017-11-21 임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 Active KR102239538B1 (ko)

Applications Claiming Priority (2)

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JPJP-P-2016-233246 2016-11-30
JP2016233246A JP6824713B2 (ja) 2016-11-30 2016-11-30 インプリント方法、インプリント装置、型、および物品の製造方法

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KR20180062360A KR20180062360A (ko) 2018-06-08
KR102239538B1 true KR102239538B1 (ko) 2021-04-14

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JP (1) JP6824713B2 (enrdf_load_stackoverflow)
KR (1) KR102239538B1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102379451B1 (ko) * 2021-04-27 2022-03-28 창원대학교 산학협력단 대면적 패턴 제작용 몰드, 이의 제조 방법 및 이를 이용한 패턴 성형 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10976657B2 (en) * 2018-08-31 2021-04-13 Canon Kabushiki Kaisha System and method for illuminating edges of an imprint field with a gradient dosage
TWI771623B (zh) 2018-11-08 2022-07-21 日商佳能股份有限公司 壓印裝置和產品製造方法
JP2020096138A (ja) * 2018-12-14 2020-06-18 キヤノン株式会社 インプリント装置、情報処理装置及び物品の製造方法
JP7149870B2 (ja) * 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法
JP7179655B2 (ja) * 2019-03-14 2022-11-29 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
US11249397B2 (en) * 2019-11-22 2022-02-15 Canon Kabushiki Kaisha Method of forming a cured layer by controlling drop spreading
JP7466375B2 (ja) * 2020-05-19 2024-04-12 キヤノン株式会社 インプリント方法、インプリント装置及び物品の製造方法
JP7710313B2 (ja) * 2021-05-27 2025-07-18 キヤノン株式会社 モールド、インプリント装置、および物品の製造方法

Citations (7)

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JP2003295428A (ja) 2001-03-29 2003-10-15 Dainippon Printing Co Ltd パターン形成体の製造方法およびそれに用いるフォトマスク
JP2008100378A (ja) * 2006-10-17 2008-05-01 Dainippon Printing Co Ltd パターン形成体の製造方法
JP2009260293A (ja) 2008-03-18 2009-11-05 Canon Inc ナノインプリント方法及びナノインプリントに用いられるモールド
JP2013069918A (ja) 2011-09-22 2013-04-18 Toshiba Corp インプリント方法およびインプリント装置
JP2013161866A (ja) 2012-02-02 2013-08-19 Toshiba Corp インプリント方法およびテンプレート
JP2014027016A (ja) 2012-07-24 2014-02-06 Canon Inc インプリント装置、および、物品製造方法
JP2014160754A (ja) 2013-02-20 2014-09-04 Dainippon Printing Co Ltd インプリントモールド、インプリント方法及び半導体装置の製造方法

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US5705299A (en) * 1992-12-16 1998-01-06 Texas Instruments Incorporated Large die photolithography
JP2006162754A (ja) * 2004-12-03 2006-06-22 Dainippon Printing Co Ltd パターン形成体およびその製造方法
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
KR20080105524A (ko) * 2007-05-31 2008-12-04 삼성전자주식회사 마스크 몰드 및 그 제작방법과 제작된 마스크 몰드를이용한 대면적 미세패턴 성형방법
JP4963718B2 (ja) * 2009-10-23 2012-06-27 キヤノン株式会社 インプリント方法及びインプリント装置、それを用いた物品の製造方法
CN102782580B (zh) * 2010-02-26 2015-04-22 株式会社尼康 图案形成方法
KR101623695B1 (ko) * 2011-11-04 2016-05-23 가부시키가이샤 니콘 기판 처리 장치, 및 기판 처리 방법
JP6351412B2 (ja) * 2014-07-15 2018-07-04 キヤノン株式会社 インプリント装置及び方法、物品の製造方法、並びにプログラム
JP2016183251A (ja) * 2015-03-26 2016-10-20 Jnc株式会社 光硬化性組成物およびその用途

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003295428A (ja) 2001-03-29 2003-10-15 Dainippon Printing Co Ltd パターン形成体の製造方法およびそれに用いるフォトマスク
JP2008100378A (ja) * 2006-10-17 2008-05-01 Dainippon Printing Co Ltd パターン形成体の製造方法
JP2009260293A (ja) 2008-03-18 2009-11-05 Canon Inc ナノインプリント方法及びナノインプリントに用いられるモールド
JP2013069918A (ja) 2011-09-22 2013-04-18 Toshiba Corp インプリント方法およびインプリント装置
JP2013161866A (ja) 2012-02-02 2013-08-19 Toshiba Corp インプリント方法およびテンプレート
JP2014027016A (ja) 2012-07-24 2014-02-06 Canon Inc インプリント装置、および、物品製造方法
JP2014160754A (ja) 2013-02-20 2014-09-04 Dainippon Printing Co Ltd インプリントモールド、インプリント方法及び半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102379451B1 (ko) * 2021-04-27 2022-03-28 창원대학교 산학협력단 대면적 패턴 제작용 몰드, 이의 제조 방법 및 이를 이용한 패턴 성형 방법

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KR20180062360A (ko) 2018-06-08
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