KR102238854B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

Info

Publication number
KR102238854B1
KR102238854B1 KR1020140122846A KR20140122846A KR102238854B1 KR 102238854 B1 KR102238854 B1 KR 102238854B1 KR 1020140122846 A KR1020140122846 A KR 1020140122846A KR 20140122846 A KR20140122846 A KR 20140122846A KR 102238854 B1 KR102238854 B1 KR 102238854B1
Authority
KR
South Korea
Prior art keywords
group
resin composition
substituent
component
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140122846A
Other languages
English (en)
Korean (ko)
Other versions
KR20150032485A (ko
Inventor
마사토시 와타나베
요시오 니시무라
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20150032485A publication Critical patent/KR20150032485A/ko
Application granted granted Critical
Publication of KR102238854B1 publication Critical patent/KR102238854B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020140122846A 2013-09-18 2014-09-16 수지 조성물 Active KR102238854B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物
JPJP-P-2013-193389 2013-09-18

Publications (2)

Publication Number Publication Date
KR20150032485A KR20150032485A (ko) 2015-03-26
KR102238854B1 true KR102238854B1 (ko) 2021-04-12

Family

ID=52816962

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140122846A Active KR102238854B1 (ko) 2013-09-18 2014-09-16 수지 조성물

Country Status (4)

Country Link
JP (1) JP5915610B2 (https=)
KR (1) KR102238854B1 (https=)
CN (1) CN104448700B (https=)
TW (1) TWI635129B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6558055B2 (ja) * 2015-04-30 2019-08-14 味の素株式会社 樹脂組成物
JP6950732B2 (ja) * 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
JP6610928B2 (ja) * 2015-08-13 2019-11-27 味の素株式会社 熱硬化性樹脂組成物
JP6750202B2 (ja) * 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP6787210B2 (ja) * 2017-03-23 2020-11-18 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置
WO2020059434A1 (ja) * 2018-09-21 2020-03-26 サンアプロ株式会社 エポキシ樹脂組成物
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN109608828B (zh) * 2018-12-20 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109810467B (zh) * 2019-01-25 2021-12-28 苏州生益科技有限公司 一种热固性树脂组合物及应用其制备的半固化片和层压板
JP2020143245A (ja) * 2019-03-08 2020-09-10 太陽ホールディングス株式会社 熱硬化性エポキシ樹脂組成物
KR102584266B1 (ko) * 2019-05-10 2023-10-05 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물, 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지
JP2023067521A (ja) * 2021-11-01 2023-05-16 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900003809A (ko) * 1988-08-11 1990-03-27 안시환 전자 올겐의 데몬 발생 장치 및 방법
JP3343443B2 (ja) * 1994-07-04 2002-11-11 松下電器産業株式会社 樹脂組成物およびプリプレグ
KR101211604B1 (ko) * 2006-10-31 2012-12-12 주식회사 엘지화학 표면 개질 아민계 경화제, 이를 이용한 마스킹형 경화제 및일액형 에폭시 수지 조성물
JP2008189824A (ja) * 2007-02-06 2008-08-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
US20110189432A1 (en) * 2008-07-29 2011-08-04 Sekisui Chemical Co., Ltd. Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
US20110217512A1 (en) * 2008-09-01 2011-09-08 Sekisui Chemical Co., Ltd. Laminated body and method for producing laminated body
JP5550875B2 (ja) * 2009-09-25 2014-07-16 パナソニック株式会社 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5340203B2 (ja) 2010-02-26 2013-11-13 積水化学工業株式会社 成形体
KR101301688B1 (ko) 2011-09-08 2013-08-29 (주) 에듀트리즈 원격 교육 시스템 및 그 관리 방법

Also Published As

Publication number Publication date
JP5915610B2 (ja) 2016-05-11
TW201527399A (zh) 2015-07-16
JP2015059170A (ja) 2015-03-30
TWI635129B (zh) 2018-09-11
CN104448700B (zh) 2019-01-22
CN104448700A (zh) 2015-03-25
KR20150032485A (ko) 2015-03-26

Similar Documents

Publication Publication Date Title
KR102238854B1 (ko) 수지 조성물
KR102499459B1 (ko) 수지 조성물
KR102376003B1 (ko) 수지 조성물
KR102600199B1 (ko) 수지 조성물
KR102656740B1 (ko) 지지체 부착 수지 시트
KR102535432B1 (ko) 수지 조성물
TWI610606B (zh) 零件內建配線基板之製造方法及半導體裝置
JP6950732B2 (ja) 樹脂組成物
KR102179621B1 (ko) 부품 내장 배선 기판의 제조 방법, 및 반도체 장치
KR20190033060A (ko) 열경화성 수지 조성물, 층간 절연용 수지 필름, 복합 필름, 프린트 배선판 및 그의 제조 방법
CN108148349B (zh) 树脂组合物
JP2017059779A (ja) プリント配線板の製造方法
TW201738311A (zh) 樹脂薄片
JP7537146B2 (ja) 樹脂組成物
TW201718688A (zh) 樹脂組成物
TWI707611B (zh) 附支撐體之樹脂薄片，及使用其之零件內置電路板之製造方法
JP6711762B2 (ja) 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板
TWI697521B (zh) 樹脂組成物
US20170313043A1 (en) Curable epoxy composition and film, laminated film, prepreg, laminate, cured article, and composite article obtained using same
JP2022063109A (ja) 樹脂組成物、硬化物、シート状積層材料、樹脂シート、プリント配線板及び半導体装置
TW201542058A (zh) 配線板之製造方法
JP2016210852A (ja) 樹脂組成物
JP2021091912A (ja) 樹脂組成物
US20170313809A1 (en) Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 6