KR102237507B1 - 기판 처리 장치 및 노즐 세정 방법 - Google Patents

기판 처리 장치 및 노즐 세정 방법 Download PDF

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Publication number
KR102237507B1
KR102237507B1 KR1020140065736A KR20140065736A KR102237507B1 KR 102237507 B1 KR102237507 B1 KR 102237507B1 KR 1020140065736 A KR1020140065736 A KR 1020140065736A KR 20140065736 A KR20140065736 A KR 20140065736A KR 102237507 B1 KR102237507 B1 KR 102237507B1
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South Korea
Prior art keywords
nozzle
cleaning
tank
liquid
overflow
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Korean (ko)
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KR20140141514A (ko
Inventor
요시히로 가이
요시노리 이케다
가즈요시 시노하라
데츠야 오다
사토루 다나카
유키 요시다
메이토쿠 아이바라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20140141514A publication Critical patent/KR20140141514A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140065736A 2013-05-31 2014-05-30 기판 처리 장치 및 노즐 세정 방법 Active KR102237507B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013115904 2013-05-31
JPJP-P-2013-115904 2013-05-31
JP2013247813A JP6077437B2 (ja) 2013-05-31 2013-11-29 基板処理装置およびノズル洗浄方法
JPJP-P-2013-247813 2013-11-29

Publications (2)

Publication Number Publication Date
KR20140141514A KR20140141514A (ko) 2014-12-10
KR102237507B1 true KR102237507B1 (ko) 2021-04-06

Family

ID=51983736

Family Applications (1)

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KR1020140065736A Active KR102237507B1 (ko) 2013-05-31 2014-05-30 기판 처리 장치 및 노즐 세정 방법

Country Status (4)

Country Link
US (1) US9764345B2 (https=)
JP (1) JP6077437B2 (https=)
KR (1) KR102237507B1 (https=)
TW (1) TWI569348B (https=)

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AU7933398A (en) * 1998-06-25 2000-01-10 Hamamatsu Photonics K.K. Photocathode
JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6527716B2 (ja) * 2015-02-27 2019-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
JP6534578B2 (ja) * 2015-08-03 2019-06-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6407829B2 (ja) * 2015-09-30 2018-10-17 東京エレクトロン株式会社 基板液処理装置、基板液処理方法
JP6494536B2 (ja) * 2016-01-12 2019-04-03 東京エレクトロン株式会社 基板処理装置および基板処理装置の洗浄方法
KR101710859B1 (ko) * 2016-06-16 2017-03-02 주식회사 위드텍 웨이퍼 표면의 이온성 오염물 측정 장치 및 방법
CN106449481A (zh) * 2016-10-24 2017-02-22 上海华力微电子有限公司 改善单片清洗机的喷嘴工艺的方法、喷嘴清洗装置
JP6914050B2 (ja) * 2017-02-15 2021-08-04 東京エレクトロン株式会社 基板処理装置
KR102186069B1 (ko) * 2018-05-11 2020-12-07 세메스 주식회사 기판 처리 장치 및 방법
CN112718690A (zh) * 2020-12-31 2021-04-30 上海至纯洁净系统科技股份有限公司 一种自动化晶圆夹手喷淋分离的清洗槽设备
KR102635382B1 (ko) * 2020-12-31 2024-02-14 세메스 주식회사 기판 처리 장치 및 방법
KR102483378B1 (ko) * 2021-03-31 2022-12-30 엘에스이 주식회사 포켓형 노즐 세척장치
KR102629496B1 (ko) * 2021-12-24 2024-01-29 세메스 주식회사 홈 포트 및 기판 처리 장치
CN115101449B (zh) * 2022-07-06 2025-12-02 至微半导体(上海)有限公司 一种用于晶圆表面清洗的装置
CN120727608A (zh) * 2024-03-29 2025-09-30 北京北方华创微电子装备有限公司 用于半导体工艺设备的喷淋结构及半导体工艺设备

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JP2005205329A (ja) * 2004-01-23 2005-08-04 Tokyo Electron Ltd 塗布装置
JP2010062352A (ja) 2008-09-04 2010-03-18 Tokyo Electron Ltd 液処理におけるノズル洗浄、処理液乾燥防止方法及びその装置

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JP3511106B2 (ja) * 1999-04-07 2004-03-29 東京応化工業株式会社 スリットノズルの洗浄装置
JP3824054B2 (ja) * 2000-03-24 2006-09-20 東京エレクトロン株式会社 塗布処理方法および塗布処理装置
KR100396829B1 (ko) * 2000-11-10 2003-09-02 (주)케이.씨.텍 브러시 세정 장치의 브러시 세척 기구
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JP2005262172A (ja) * 2004-03-22 2005-09-29 Toyota Motor Corp 洗浄方法及び洗浄装置
JP4526288B2 (ja) * 2004-03-25 2010-08-18 東京応化工業株式会社 スリットノズル先端の調整装置及び調整方法
KR100700181B1 (ko) * 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법
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KR20080112541A (ko) * 2007-06-21 2008-12-26 삼성전자주식회사 프린트헤드 세척장치 및 이를 갖는 잉크젯 화상형성장치
KR100941075B1 (ko) * 2007-12-27 2010-02-09 세메스 주식회사 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 및 방법
TWM354844U (en) * 2008-09-19 2009-04-11 Advanced Wireless Semiconductor Company Equipment for cleaning photoresist nozzle
JP2010225832A (ja) * 2009-03-24 2010-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR20110008539A (ko) * 2009-07-20 2011-01-27 세메스 주식회사 노즐 세정 장치 및 이를 포함하는 약액 도포 장치
TWI566311B (zh) * 2011-06-27 2017-01-11 聯華電子股份有限公司 半導體機台與其操作方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172223A (ja) 2002-11-18 2004-06-17 Tokyo Electron Ltd 絶縁膜形成装置
JP2005205329A (ja) * 2004-01-23 2005-08-04 Tokyo Electron Ltd 塗布装置
JP2010062352A (ja) 2008-09-04 2010-03-18 Tokyo Electron Ltd 液処理におけるノズル洗浄、処理液乾燥防止方法及びその装置

Also Published As

Publication number Publication date
JP6077437B2 (ja) 2017-02-08
KR20140141514A (ko) 2014-12-10
TWI569348B (zh) 2017-02-01
US9764345B2 (en) 2017-09-19
JP2015006652A (ja) 2015-01-15
TW201519348A (zh) 2015-05-16
US20140352730A1 (en) 2014-12-04

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