KR102232134B1 - 전자 부품 또는 부품 그룹의 주조 방법 및 경화성 화합물 - Google Patents

전자 부품 또는 부품 그룹의 주조 방법 및 경화성 화합물 Download PDF

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KR102232134B1
KR102232134B1 KR1020197000791A KR20197000791A KR102232134B1 KR 102232134 B1 KR102232134 B1 KR 102232134B1 KR 1020197000791 A KR1020197000791 A KR 1020197000791A KR 20197000791 A KR20197000791 A KR 20197000791A KR 102232134 B1 KR102232134 B1 KR 102232134B1
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component
crosslinking
compound
casting
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KR20190030684A (ko
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아르노 레일
위르겐 비저
잔 슈펭글러
로랜드 클라인
알렉산드라 크레이켄바움
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로베르트 보쉬 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H01L23/293—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/132—Phenols containing keto groups, e.g. benzophenones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H01L21/56—
    • H01L23/3135—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
KR1020197000791A 2016-07-11 2017-07-10 전자 부품 또는 부품 그룹의 주조 방법 및 경화성 화합물 Active KR102232134B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102016112655.1 2016-07-11
DE102016112655 2016-07-11
DE102017202956.0A DE102017202956A1 (de) 2016-07-11 2017-02-23 Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen
DE102017202956.0 2017-02-23
PCT/EP2017/067210 WO2018011116A1 (de) 2016-07-11 2017-07-10 Verfahren und aushärtbare masse zum vergiessen elektronischer bauteile oder bauteilgruppen

Publications (2)

Publication Number Publication Date
KR20190030684A KR20190030684A (ko) 2019-03-22
KR102232134B1 true KR102232134B1 (ko) 2021-03-25

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Country Status (9)

Country Link
US (1) US10896860B2 (https=)
EP (1) EP3482416B1 (https=)
JP (1) JP6743269B2 (https=)
KR (1) KR102232134B1 (https=)
CN (1) CN109478539B (https=)
DE (1) DE102017202956A1 (https=)
HU (1) HUE051444T2 (https=)
PT (1) PT3482416T (https=)
WO (1) WO2018011116A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017202956A1 (de) * 2016-07-11 2018-01-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen
DE102018121067A1 (de) 2018-08-29 2020-03-05 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Härtbare Zweikomponentenmasse
CN110648979B (zh) * 2019-09-29 2021-09-17 清华大学 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法
DE102020209476A1 (de) 2020-07-28 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Vergießen elektronischer, optischer und/oder optoelektronischer Bauteile

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034550A (ja) 2008-07-02 2010-02-12 Panasonic Corp ２層防湿コート電子部品実装構造体およびその製造方法

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
EP0453149B1 (en) * 1990-04-20 1995-03-15 Sola International Holdings Limited Casting composition
JPH05160177A (ja) 1991-12-04 1993-06-25 Murata Mfg Co Ltd 電子部品の被覆形成方法
JP2777500B2 (ja) * 1992-03-24 1998-07-16 株式会社日立製作所 半導体装置の保護層の形成方法
JPH08125071A (ja) 1994-10-25 1996-05-17 Fuji Electric Co Ltd 半導体装置
JPH0951009A (ja) 1995-08-07 1997-02-18 Dainippon Printing Co Ltd Ｉｃモジュールの樹脂封止方法、ｉｃモジュール及びｉｃカード
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE19950538B4 (de) 1999-10-20 2008-05-29 Denso Corp., Kariya Halbleiterdrucksensorvorrichtung mit Schutzelementen
JP2001223305A (ja) 2000-02-10 2001-08-17 Matsushita Electric Ind Co Ltd 樹脂封止半導体装置
DE102008032330A1 (de) 2008-07-09 2010-01-14 Akro Plastic Gmbh Verfahren zur Herstellung von montagefertigen, kunststoffumspritzten Elektronikbauteilen bzw. Elektronikbaugruppen
DE102010010598A1 (de) 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual härtende Masse und deren Verwendung
EP2573129B1 (en) * 2010-05-18 2016-08-17 JNC Corporation Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
DE102017202956A1 (de) * 2016-07-11 2018-01-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034550A (ja) 2008-07-02 2010-02-12 Panasonic Corp ２層防湿コート電子部品実装構造体およびその製造方法

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Publication number Publication date
WO2018011116A1 (de) 2018-01-18
US20190304861A1 (en) 2019-10-03
HUE051444T2 (hu) 2021-03-01
KR20190030684A (ko) 2019-03-22
EP3482416A1 (de) 2019-05-15
JP6743269B2 (ja) 2020-08-19
PT3482416T (pt) 2020-05-28
CN109478539A (zh) 2019-03-15
JP2019520713A (ja) 2019-07-18
CN109478539B (zh) 2022-08-23
DE102017202956A1 (de) 2018-01-11
US10896860B2 (en) 2021-01-19
EP3482416B1 (de) 2020-04-22

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