HUE051444T2 - Eljárás és kikeményíthetõ keverék elektronikai komponens vagy komponens csoport öntéséhez - Google Patents
Eljárás és kikeményíthetõ keverék elektronikai komponens vagy komponens csoport öntéséhezInfo
- Publication number
- HUE051444T2 HUE051444T2 HUE17742389A HUE17742389A HUE051444T2 HU E051444 T2 HUE051444 T2 HU E051444T2 HU E17742389 A HUE17742389 A HU E17742389A HU E17742389 A HUE17742389 A HU E17742389A HU E051444 T2 HUE051444 T2 HU E051444T2
- Authority
- HU
- Hungary
- Prior art keywords
- electronic components
- curable compound
- component groups
- casting electronic
- casting
- Prior art date
Links
- 238000005266 casting Methods 0.000 title 1
- 150000001875 compounds Chemical class 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/132—Phenols containing keto groups, e.g. benzophenones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5397—Phosphine oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016112655 | 2016-07-11 | ||
DE102017202956.0A DE102017202956A1 (de) | 2016-07-11 | 2017-02-23 | Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE051444T2 true HUE051444T2 (hu) | 2021-03-01 |
Family
ID=60676709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE17742389A HUE051444T2 (hu) | 2016-07-11 | 2017-07-10 | Eljárás és kikeményíthetõ keverék elektronikai komponens vagy komponens csoport öntéséhez |
Country Status (9)
Country | Link |
---|---|
US (1) | US10896860B2 (hu) |
EP (1) | EP3482416B1 (hu) |
JP (1) | JP6743269B2 (hu) |
KR (1) | KR102232134B1 (hu) |
CN (1) | CN109478539B (hu) |
DE (1) | DE102017202956A1 (hu) |
HU (1) | HUE051444T2 (hu) |
PT (1) | PT3482416T (hu) |
WO (1) | WO2018011116A1 (hu) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017202956A1 (de) * | 2016-07-11 | 2018-01-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen |
DE102018121067A1 (de) | 2018-08-29 | 2020-03-05 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Härtbare Zweikomponentenmasse |
CN110648979B (zh) * | 2019-09-29 | 2021-09-17 | 清华大学 | 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法 |
DE102020209476A1 (de) | 2020-07-28 | 2022-02-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Vergießen elektronischer, optischer und/oder optoelektronischer Bauteile |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0453149B1 (en) * | 1990-04-20 | 1995-03-15 | Sola International Holdings Limited | Casting composition |
JPH05160177A (ja) | 1991-12-04 | 1993-06-25 | Murata Mfg Co Ltd | 電子部品の被覆形成方法 |
JP2777500B2 (ja) * | 1992-03-24 | 1998-07-16 | 株式会社日立製作所 | 半導体装置の保護層の形成方法 |
JPH08125071A (ja) * | 1994-10-25 | 1996-05-17 | Fuji Electric Co Ltd | 半導体装置 |
JPH0951009A (ja) * | 1995-08-07 | 1997-02-18 | Dainippon Printing Co Ltd | Icモジュールの樹脂封止方法、icモジュール及びicカード |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE19950538B4 (de) | 1999-10-20 | 2008-05-29 | Denso Corp., Kariya | Halbleiterdrucksensorvorrichtung mit Schutzelementen |
JP2001223305A (ja) * | 2000-02-10 | 2001-08-17 | Matsushita Electric Ind Co Ltd | 樹脂封止半導体装置 |
US8344268B2 (en) * | 2008-07-02 | 2013-01-01 | Panasonic Corporation | Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same |
DE102008032330A1 (de) | 2008-07-09 | 2010-01-14 | Akro Plastic Gmbh | Verfahren zur Herstellung von montagefertigen, kunststoffumspritzten Elektronikbauteilen bzw. Elektronikbaugruppen |
DE102010010598A1 (de) | 2010-03-08 | 2011-09-08 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dual härtende Masse und deren Verwendung |
CN104744705B (zh) * | 2010-05-18 | 2017-09-08 | 捷恩智株式会社 | 液状有机硅化合物的制造方法、热硬化性树脂组成物及其使用 |
DE102017202956A1 (de) * | 2016-07-11 | 2018-01-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Verfahren und aushärtbare Masse zum Vergießen elektronischer Bauteile oder Bauteilgruppen |
-
2017
- 2017-02-23 DE DE102017202956.0A patent/DE102017202956A1/de not_active Ceased
- 2017-07-10 WO PCT/EP2017/067210 patent/WO2018011116A1/de unknown
- 2017-07-10 US US16/315,265 patent/US10896860B2/en active Active
- 2017-07-10 CN CN201780043303.3A patent/CN109478539B/zh active Active
- 2017-07-10 JP JP2019500845A patent/JP6743269B2/ja active Active
- 2017-07-10 PT PT177423894T patent/PT3482416T/pt unknown
- 2017-07-10 EP EP17742389.4A patent/EP3482416B1/de active Active
- 2017-07-10 HU HUE17742389A patent/HUE051444T2/hu unknown
- 2017-07-10 KR KR1020197000791A patent/KR102232134B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN109478539A (zh) | 2019-03-15 |
PT3482416T (pt) | 2020-05-28 |
JP6743269B2 (ja) | 2020-08-19 |
KR102232134B1 (ko) | 2021-03-25 |
JP2019520713A (ja) | 2019-07-18 |
US10896860B2 (en) | 2021-01-19 |
CN109478539B (zh) | 2022-08-23 |
DE102017202956A1 (de) | 2018-01-11 |
US20190304861A1 (en) | 2019-10-03 |
EP3482416B1 (de) | 2020-04-22 |
EP3482416A1 (de) | 2019-05-15 |
WO2018011116A1 (de) | 2018-01-18 |
KR20190030684A (ko) | 2019-03-22 |
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