SG11202002844QA - Curable resin composition, electronic component device, and production method for electronic component device - Google Patents
Curable resin composition, electronic component device, and production method for electronic component deviceInfo
- Publication number
- SG11202002844QA SG11202002844QA SG11202002844QA SG11202002844QA SG11202002844QA SG 11202002844Q A SG11202002844Q A SG 11202002844QA SG 11202002844Q A SG11202002844Q A SG 11202002844QA SG 11202002844Q A SG11202002844Q A SG 11202002844QA SG 11202002844Q A SG11202002844Q A SG 11202002844QA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic component
- component device
- resin composition
- production method
- curable resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5397—Phosphine oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017194180A JP6953971B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
JP2017194182A JP6953973B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
JP2017194181A JP6953972B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
PCT/JP2018/036742 WO2019069870A1 (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202002844QA true SG11202002844QA (en) | 2020-04-29 |
Family
ID=65995069
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202110711TA SG10202110711TA (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
SG11202002844QA SG11202002844QA (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202110711TA SG10202110711TA (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102628332B1 (en) |
SG (2) | SG10202110711TA (en) |
TW (2) | TWI833301B (en) |
WO (1) | WO2019069870A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021153691A1 (en) * | 2020-01-30 | 2021-08-05 | ||
JPWO2021241521A1 (en) * | 2020-05-26 | 2021-12-02 | ||
WO2021241513A1 (en) * | 2020-05-26 | 2021-12-02 | 昭和電工マテリアルズ株式会社 | Compound, molded object, and cured object |
KR20230015941A (en) * | 2020-05-26 | 2023-01-31 | 쇼와덴코머티리얼즈가부시끼가이샤 | Compounds, moldings and cured products |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004115583A (en) * | 2002-09-24 | 2004-04-15 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP4432381B2 (en) | 2003-07-09 | 2010-03-17 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
JP2006131653A (en) * | 2004-11-02 | 2006-05-25 | Air Water Chemical Inc | Flame-retardant for epoxy resin and epoxy resin composition obtained using the same |
JP2006193619A (en) * | 2005-01-13 | 2006-07-27 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
JP5400267B2 (en) * | 2005-12-13 | 2014-01-29 | 日立化成株式会社 | Epoxy resin composition for sealing and electronic component device |
JP2013237855A (en) * | 2005-12-13 | 2013-11-28 | Hitachi Chemical Co Ltd | Epoxy resin composition for encapsulation and electronic component device |
JP6018967B2 (en) * | 2013-04-26 | 2016-11-02 | 日東電工株式会社 | Method for manufacturing thermosetting sealing resin sheet and electronic component package |
JP2017031371A (en) * | 2015-08-05 | 2017-02-09 | 京セラ株式会社 | Resin composition for encapsulating semiconductor and semiconductor device |
-
2018
- 2018-10-01 KR KR1020207009440A patent/KR102628332B1/en active IP Right Grant
- 2018-10-01 SG SG10202110711TA patent/SG10202110711TA/en unknown
- 2018-10-01 SG SG11202002844QA patent/SG11202002844QA/en unknown
- 2018-10-01 WO PCT/JP2018/036742 patent/WO2019069870A1/en active Application Filing
- 2018-10-03 TW TW111128042A patent/TWI833301B/en active
- 2018-10-03 TW TW107134865A patent/TWI774852B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20200055730A (en) | 2020-05-21 |
SG10202110711TA (en) | 2021-11-29 |
TWI833301B (en) | 2024-02-21 |
KR102628332B1 (en) | 2024-01-23 |
TW202244178A (en) | 2022-11-16 |
TWI774852B (en) | 2022-08-21 |
WO2019069870A1 (en) | 2019-04-11 |
TW201922911A (en) | 2019-06-16 |
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