TWI833301B - Curable resin composition and electronic component device - Google Patents
Curable resin composition and electronic component device Download PDFInfo
- Publication number
- TWI833301B TWI833301B TW111128042A TW111128042A TWI833301B TW I833301 B TWI833301 B TW I833301B TW 111128042 A TW111128042 A TW 111128042A TW 111128042 A TW111128042 A TW 111128042A TW I833301 B TWI833301 B TW I833301B
- Authority
- TW
- Taiwan
- Prior art keywords
- curable resin
- resin composition
- package
- electronic component
- mass
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 123
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 51
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims description 47
- 229920000647 polyepoxide Polymers 0.000 claims description 47
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 239000004848 polyfunctional curative Substances 0.000 claims description 17
- 239000003566 sealing material Substances 0.000 claims description 14
- 230000005260 alpha ray Effects 0.000 claims description 5
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- -1 aliphatic aldehyde compound Chemical class 0.000 description 29
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 26
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 25
- 239000005011 phenolic resin Substances 0.000 description 22
- 150000002989 phenols Chemical class 0.000 description 18
- 239000002245 particle Substances 0.000 description 17
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 15
- 239000007822 coupling agent Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- 239000007983 Tris buffer Substances 0.000 description 9
- 239000003086 colorant Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 8
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000011049 filling Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 229940005561 1,4-benzoquinone Drugs 0.000 description 5
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229960001755 resorcinol Drugs 0.000 description 3
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- FQJZPYXGPYJJIH-UHFFFAOYSA-N 1-bromonaphthalen-2-ol Chemical compound C1=CC=CC2=C(Br)C(O)=CC=C21 FQJZPYXGPYJJIH-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- SJZAUIVYZWPNAS-UHFFFAOYSA-N 2-methoxy-1,4-dimethylbenzene Chemical group COC1=CC(C)=CC=C1C SJZAUIVYZWPNAS-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- MNOJRWOWILAHAV-UHFFFAOYSA-N 3-bromophenol Chemical compound OC1=CC=CC(Br)=C1 MNOJRWOWILAHAV-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- FXTKWBZFNQHAAO-UHFFFAOYSA-N 3-iodophenol Chemical compound OC1=CC=CC(I)=C1 FXTKWBZFNQHAAO-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- XESUCEJPGYWGSK-UHFFFAOYSA-N 4-(2-bromophenyl)phenol Chemical group C1=CC(O)=CC=C1C1=CC=CC=C1Br XESUCEJPGYWGSK-UHFFFAOYSA-N 0.000 description 1
- JFHCTWRTLAKWJF-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1CC2OC2CC1CC1(C(=O)O)CC2OC2CC1 JFHCTWRTLAKWJF-UHFFFAOYSA-N 0.000 description 1
- ZLVFYUORUHNMBO-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol Chemical compound CC1=CC(Br)=CC(C)=C1O ZLVFYUORUHNMBO-UHFFFAOYSA-N 0.000 description 1
- SSQQUEKFNSJLKX-UHFFFAOYSA-N 4-bromo-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(Br)=CC(C(C)(C)C)=C1O SSQQUEKFNSJLKX-UHFFFAOYSA-N 0.000 description 1
- IWJGMJHAIUBWKT-UHFFFAOYSA-N 4-bromo-2-methylphenol Chemical compound CC1=CC(Br)=CC=C1O IWJGMJHAIUBWKT-UHFFFAOYSA-N 0.000 description 1
- WMUWDPLTTLJNPE-UHFFFAOYSA-N 4-bromo-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Br WMUWDPLTTLJNPE-UHFFFAOYSA-N 0.000 description 1
- GPOQODYGMUTOQL-UHFFFAOYSA-N 4-bromo-3-methylphenol Chemical compound CC1=CC(O)=CC=C1Br GPOQODYGMUTOQL-UHFFFAOYSA-N 0.000 description 1
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- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
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- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- YLDFTMJPQJXGSS-UHFFFAOYSA-N 6-bromo-2-naphthol Chemical compound C1=C(Br)C=CC2=CC(O)=CC=C21 YLDFTMJPQJXGSS-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical class N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
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- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
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- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- AMJUWROQAOGQPZ-UHFFFAOYSA-N [O].CC(=O)OO Chemical compound [O].CC(=O)OO AMJUWROQAOGQPZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
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- 125000000217 alkyl group Chemical group 0.000 description 1
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- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- ARRNBPCNZJXHRJ-UHFFFAOYSA-M hydron;tetrabutylazanium;phosphate Chemical compound OP(O)([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC ARRNBPCNZJXHRJ-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5397—Phosphine oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
本發明是有關於一種硬化性樹脂組成物、電子零件裝置及電子零件裝置的製造方法。The present invention relates to a curable resin composition, an electronic component device, and a manufacturing method of the electronic component device.
先前，利用包含環氧樹脂等硬化性樹脂的密封材對電晶體、積體電路（Integrated Circuit，IC）等元件進行密封而成的封裝（電子零件裝置）於電子機器中得到廣泛使用。Previously, packages (electronic component devices) in which components such as transistors and integrated circuits (ICs) were sealed with a sealing material containing a hardening resin such as epoxy resin were widely used in electronic equipment.
近年來，為了應對電子機器的小型化及輕量化，電子零件裝置的薄型化不斷發展。伴隨於此，容易產生由密封材與基板的熱膨脹係數之差而引起的電子零件裝置的翹曲。因此，就減少電子零件裝置的翹曲變形量的觀點而言，正對密封材的組成進行研究（例如，參照專利文獻1）。 [現有技術文獻] [專利文獻] In recent years, in order to cope with the miniaturization and weight reduction of electronic equipment, electronic component devices have been increasingly made thinner. Along with this, warpage of the electronic component device is likely to occur due to the difference in thermal expansion coefficient between the sealing material and the substrate. Therefore, from the viewpoint of reducing the amount of warpage deformation of the electronic component device, the composition of the sealing material is being studied (for example, see Patent Document 1). [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2005-29641號公報[Patent Document 1] Japanese Patent Application Publication No. 2005-29641
[發明所欲解決之課題] 於對應用處理器進行密封的封裝上配置有對記憶體晶片進行密封的封裝而成的所謂堆疊式封裝（Package on Package，PoP）型的電子零件裝置通常於在封裝間配置焊料球等接合構件的狀態下進行加熱，使接合構件熔融並將封裝間接合來製造。此時，下側的封裝與上側的封裝在接合時的溫度條件下分別表現出不同的翹曲行為，存在無法獲得充分的接合的情況。因此，有時期望不僅僅抑制封裝的翹曲，而是根據其中一封裝的翹曲狀態來控制另一封裝的翹曲狀態。 [Problem to be solved by the invention] A so-called Package on Package (PoP) type electronic component device, in which a package that seals a memory chip is placed on top of a package that seals an application processor, usually has bonding members such as solder balls between the packages. The package is manufactured by heating it in a state of melting the joining member and joining the packages. At this time, the lower package and the upper package each exhibit different warpage behaviors under the temperature conditions during bonding, and sufficient bonding may not be obtained. Therefore, it is sometimes desired not only to suppress the warpage of a package but to control the warp state of one package based on the warp state of the other package.
本發明鑒於所述情況，課題在於提供一種封裝的翹曲的控制性優異的硬化性樹脂組成物、以及使用其而獲得的電子零件裝置及電子零件裝置的製造方法。 [解決課題之手段] In view of the above-mentioned circumstances, an object of the present invention is to provide a curable resin composition excellent in controllability of package warpage, an electronic component device obtained using the curable resin composition, and a manufacturing method of the electronic component device. [Means to solve the problem]
用以解決所述課題的手段中包括以下的實施態樣。 ＜1＞一種硬化性樹脂組成物，其含有：硬化性樹脂成分、三苯基氧化膦、以及填充材，所述三苯基氧化膦的含有率為所述硬化性樹脂組成物的0.3質量%以上。 ＜2＞一種硬化性樹脂組成物，其含有：硬化性樹脂成分、三苯基氧化膦、以及填充材，所述三苯基氧化膦的含有率未滿所述硬化性樹脂組成物的0.3質量%。 ＜3＞一種硬化性樹脂組成物，其含有：硬化性樹脂成分、三苯基氧化膦、以及填充材，所述填充材包含白矽石。 ＜4＞如＜1＞至＜3＞中任一項所述的硬化性樹脂組成物，其中所述硬化性樹脂成分包含環氧樹脂與硬化劑。 ＜5＞如＜1＞至＜4＞中任一項所述的硬化性樹脂組成物，其為電子零件裝置的密封材。 ＜6＞如＜1＞至＜5＞中任一項所述的硬化性樹脂組成物，其為用於包括兩個以上封裝的電子零件裝置中的所述兩個以上封裝的至少一個的製作的密封材。 ＜7＞一種電子零件裝置，其包括包含如＜1＞至＜6＞中任一項所述的硬化性樹脂組成物的硬化物的封裝。 ＜8＞如＜7＞所述的電子零件裝置，其包括包含所述硬化性樹脂組成物的硬化物的第1封裝與第2封裝。 ＜9＞一種電子零件裝置的製造方法，其包括將包含如＜1＞至＜6＞中任一項所述的硬化性樹脂組成物的硬化物的第1封裝與第2封裝接合的步驟，所述接合是於所述第1封裝的翹曲狀態與所述第2封裝的翹曲狀態一致的條件下進行。 [發明的效果] Means for solving the above problems include the following embodiments. <1> A curable resin composition containing: a curable resin component, triphenylphosphine oxide, and a filler, the content of the triphenylphosphine oxide being 0.3% by mass of the curable resin composition above. <2> A curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, wherein the content of the triphenylphosphine oxide is less than 0.3 mass of the curable resin composition. %. <3> A curable resin composition containing: a curable resin component, triphenylphosphine oxide, and a filler, the filler containing white silica. <4> The curable resin composition according to any one of <1> to <3>, wherein the curable resin component contains an epoxy resin and a curing agent. <5> The curable resin composition according to any one of <1> to <4>, which is a sealing material for electronic component devices. <6> The curable resin composition according to any one of <1> to <5>, which is used for the production of at least one of the two or more packages in an electronic component device including two or more packages. sealing material. <7> An electronic component device including a package containing a cured product of the curable resin composition according to any one of <1> to <6>. <8> The electronic component device according to <7>, which includes a first package and a second package including a cured product of the curable resin composition. <9> A method of manufacturing an electronic component device, which includes the step of joining a first package and a second package of a cured product containing the curable resin composition according to any one of <1> to <6>, The bonding is performed under the condition that the warp state of the first package matches the warp state of the second package. [Effects of the invention]
根據本發明，可提供一種封裝的翹曲的控制性優異的硬化性樹脂組成物、以及使用其而獲得的電子零件裝置及電子零件裝置的製造方法。According to the present invention, it is possible to provide a curable resin composition excellent in controllability of package warpage, an electronic component device obtained using the curable resin composition, and a manufacturing method of the electronic component device.
以下，對用以實施本發明的形態進行詳細說明。其中，本發明並不限定於以下的實施形態。於以下的實施形態中，其構成要素（亦包括要素步驟等）除特別明示的情況以外，並非必需。關於數值及其範圍亦同樣，並不限制本發明。Hereinafter, the form for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise expressly stated. The same applies to numerical values and their ranges, which do not limit the present invention.
於本揭示中，「步驟」的用語中，除了與其他步驟獨立的步驟以外，即便於無法與其他步驟明確區別的情況下，只要達成該步驟的目的，則亦包含該步驟。 於本揭示中，使用「～」來表示的數值範圍中包含「～」的前後所記載的數值分別作為最小值及最大值。 於本揭示中階段性記載的數值範圍中，一個數值範圍內記載的上限值或下限值亦可置換為其他階段性記載的數值範圍的上限值或下限值。另外，於本揭示中記載的數值範圍中，該數值範圍的上限值或下限值亦可置換為實施例中所示的值。 於本揭示中，亦可包含多種相當於各成分的物質。於在組成物中存在多種相當於各成分的物質的情況下，只要無特別說明，則各成分的含有率或含量是指組成物中所存在的該多種物質的合計含有率或含量。 於本揭示中，亦可包含多種相當於各成分的粒子。於在組成物中存在多種相當於各成分的粒子的情況下，只要無特別說明，則各成分的粒徑是指關於組成物中所存在的該多種粒子的混合物的值。 In this disclosure, the term "step" includes steps that are independent of other steps, even if they cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved. In this disclosure, the numerical range represented by "～" includes the numerical values described before and after "～" as the minimum value and the maximum value respectively. Among the numerical ranges described in stages in this disclosure, the upper limit or lower limit described in one numerical range may also be replaced with the upper limit or lower limit of other numerical ranges described in stages. In addition, in the numerical range described in this disclosure, the upper limit value or the lower limit value of the numerical range can also be replaced with the value shown in the embodiment. In this disclosure, a variety of substances corresponding to each component may also be included. When there are multiple substances corresponding to each component in the composition, unless otherwise specified, the content rate or content of each component refers to the total content rate or content of the multiple substances present in the composition. In this disclosure, a plurality of particles corresponding to each component may also be included. When a plurality of types of particles corresponding to each component are present in the composition, the particle diameter of each component refers to a value for a mixture of the plurality of types of particles present in the composition unless otherwise specified.
＜硬化性樹脂組成物（第1實施形態）＞ 本實施形態的硬化性樹脂組成物為含有硬化性樹脂成分、三苯基氧化膦、以及填充材的硬化性樹脂組成物，所述三苯基氧化膦的含有率為所述硬化性樹脂組成物的0.3質量%以上。 <Cureable resin composition (first embodiment)> The curable resin composition of this embodiment is a curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, and the content of the triphenylphosphine oxide is the curable resin composition. More than 0.3% by mass.
本發明者等人的研究的結果明確，使用含有0.3質量%以上的三苯基氧化膦的硬化性樹脂組成物密封而成的封裝於接合時的高溫條件下（例如，230℃以上）容易產生笑（smile）型翹曲（向下而成為凸狀的翹曲）。其原因雖未必明確，但推測原因在於：使用硬化性樹脂組成物密封而成的封裝中的硬化性樹脂組成物的硬化物中，三苯基氧化膦作為塑化劑發揮作用，可抑制由封裝接合時的加熱引起的該硬化物的膨脹。As a result of the research conducted by the present inventors, it is clear that a package sealed with a curable resin composition containing 0.3 mass % or more of triphenylphosphine oxide is likely to produce the product under high temperature conditions (for example, 230° C. or higher) during bonding. Smile type warpage (warp that becomes convex downward). The reason for this is not necessarily clear, but it is speculated that the cured product of the curable resin composition in the package sealed with the curable resin composition acts as a plasticizer to inhibit the encapsulation. The hardened material expands due to heating during joining.
認為若將於封裝接合時容易產生笑型翹曲的硬化性樹脂組成物用於其中一封裝的密封，則例如於PoP型電子零件裝置中與另一封裝接合時，該另一封裝於接合時產生笑型翹曲，於所述情況下可使封裝彼此的翹曲狀態一致，從而可獲得良好的接合。It is considered that if a curable resin composition that is prone to laugh-shaped warpage during package bonding is used for sealing one of the packages, for example, when bonding to another package in a PoP-type electronic component device, the other package will be Laughter-type warpage occurs. In this case, the warpage states of the packages can be consistent with each other, so that good bonding can be obtained.
硬化性樹脂組成物中的三苯基氧化膦的含有率若為硬化性樹脂組成物整體的0.3質量%以上，則並無特別限制，可根據使用硬化性樹脂組成物而製作的封裝的所期望的翹曲狀態、硬化性樹脂組成物中所含的其他成分的含有率等來設定。 就使封裝的笑型翹曲變大的觀點而言，三苯基氧化膦的含有率較佳為硬化性樹脂組成物整體的0.5質量%以上，更佳為1.0質量%以上，進而佳為1.5質量%以上。 就與硬化性樹脂組成物中所含的其他成分的平衡的觀點而言，三苯基氧化膦的含有率較佳為硬化性樹脂組成物整體的6.0質量%以下，更佳為3.0質量%以下，進而佳為2.0質量%以下，特佳為1.0質量%以下。 The content of triphenylphosphine oxide in the curable resin composition is not particularly limited as long as it is 0.3% by mass or more of the entire curable resin composition. It can be determined according to the desired properties of the package produced using the curable resin composition. The warpage state, the content rate of other components contained in the curable resin composition, etc. are set. From the viewpoint of increasing the smile-type warpage of the package, the content of triphenylphosphine oxide is preferably 0.5 mass % or more of the entire curable resin composition, more preferably 1.0 mass % or more, and still more preferably 1.5 Quality% or more. From the viewpoint of balance with other components contained in the curable resin composition, the content rate of triphenylphosphine oxide is preferably 6.0 mass% or less of the entire curable resin composition, more preferably 3.0 mass% or less. , more preferably 2.0 mass% or less, particularly preferably 1.0 mass% or less.
硬化性樹脂組成物可為固體亦可為液體。作為硬化性樹脂組成物為固體時的形狀，可列舉粉末狀、片狀等。就操作性的觀點而言，硬化性樹脂組成物較佳為於使用時為固體，更佳為粉末狀。The curable resin composition may be solid or liquid. Examples of the shape of the curable resin composition when it is solid include powdery form, flake form, and the like. From the viewpoint of operability, the curable resin composition is preferably in solid form when used, and more preferably in powder form.
硬化性樹脂組成物較佳為包括兩個以上封裝的電子零件裝置中的所述兩個以上封裝的至少一個的密封材，更佳為所述兩個以上封裝中位於上側（與配置有電子零件裝置的基板為相反側）的封裝的密封材。The curable resin composition is preferably a sealing material for at least one of the two or more packages in an electronic component device including two or more packages, and more preferably is a sealing material located on the upper side of the two or more packages (with the electronic components arranged therein). The device's substrate is the sealing material of the package on the opposite side).
（硬化性樹脂成分） 硬化性樹脂組成物中所含的硬化性樹脂成分的種類並無特別限制。就作為密封材的各種特性的平衡的觀點而言，較佳為環氧樹脂與硬化劑的組合。 (hardening resin component) The type of curable resin component contained in the curable resin composition is not particularly limited. From the viewpoint of the balance of various characteristics as a sealing material, a combination of an epoxy resin and a hardener is preferred.
環氧樹脂的種類並無特別限制，可根據硬化性樹脂組成物的所期望的特性等選擇。作為環氧樹脂，具體可列舉：使選自由苯酚、甲酚、二甲酚、間苯二酚、鄰苯二酚、雙酚A、雙酚F等酚化合物及α-萘酚、β-萘酚、二羥基萘等萘酚化合物所組成的群組中的至少一種酚性化合物與甲醛、乙醛、丙醛等脂肪族醛化合物在酸性觸媒下縮合或共縮合而獲得酚醛清漆樹脂並將該酚醛清漆樹脂進行環氧化而獲得的酚醛清漆型環氧樹脂（苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂等）；使所述酚性化合物與苯甲醛、水楊醛等芳香族醛化合物在酸性觸媒下縮合或共縮合而獲得三苯基甲烷型酚樹脂並將該三苯基甲烷型酚樹脂進行環氧化而獲得的三苯基甲烷型環氧樹脂；使所述酚化合物及萘酚化合物與醛化合物在酸性觸媒下共縮合而獲得酚醛清漆樹脂並將該酚醛清漆樹脂進行環氧化而獲得的共聚型環氧樹脂；作為雙酚A、雙酚F等的二縮水甘油醚的二苯基甲烷型環氧樹脂；作為烷基取代或未經取代的聯苯酚的二縮水甘油醚的聯苯型環氧樹脂；作為二苯乙烯系酚化合物的二縮水甘油醚的二苯乙烯型環氧樹脂；作為雙酚S等的二縮水甘油醚的含硫原子的環氧樹脂；作為丁二醇、聚乙二醇、聚丙二醇等醇類的縮水甘油醚的環氧樹脂；作為鄰苯二甲酸、間苯二甲酸、四氫鄰苯二甲酸等多元羧酸化合物的縮水甘油酯的縮水甘油酯型環氧樹脂；將苯胺、二胺基二苯基甲烷、異三聚氰酸等的鍵結於氮原子的活性氫以縮水甘油基取代而獲得的縮水甘油胺型環氧樹脂；將二環戊二烯與酚化合物的共縮合樹脂進行環氧化而獲得的二環戊二烯型環氧樹脂；將分子內的烯烴鍵進行環氧化而獲得的二環氧化乙烯基環己烯、3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、2-(3,4-環氧基)環己基-5,5-螺環(3,4-環氧基)環己烷-間二噁烷等脂環型環氧樹脂；作為對二甲苯改質酚樹脂的縮水甘油醚的對二甲苯改質環氧樹脂；作為間二甲苯改質酚樹脂的縮水甘油醚的間二甲苯改質環氧樹脂；作為萜烯改質酚樹脂的縮水甘油醚的萜烯改質環氧樹脂；作為二環戊二烯改質酚樹脂的縮水甘油醚的二環戊二烯改質環氧樹脂；作為環戊二烯改質酚樹脂的縮水甘油醚的環戊二烯改質環氧樹脂；作為多環芳香環改質酚樹脂的縮水甘油醚的多環芳香環改質環氧樹脂；作為含萘環的酚樹脂的縮水甘油醚的萘型環氧樹脂；鹵化酚酚醛清漆型環氧樹脂；對苯二酚型環氧樹脂；三羥甲基丙烷型環氧樹脂；利用過乙酸等過酸將烯烴鍵氧化而獲得的線狀脂肪族環氧樹脂；將苯酚芳烷基樹脂、萘酚芳烷基樹脂等芳烷基型酚樹脂進行環氧化而獲得的芳烷基型環氧樹脂等。該些環氧樹脂可單獨使用一種，亦可組合使用兩種以上。The type of epoxy resin is not particularly limited and can be selected according to desired characteristics of the curable resin composition. Specific examples of the epoxy resin include phenol compounds selected from the group consisting of phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, and α-naphthol and β-naphthalene. At least one phenolic compound in the group consisting of naphthol compounds such as phenol and dihydroxynaphthalene is condensed or co-condensed with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde and the like under an acidic catalyst to obtain a novolak resin and Novolac-type epoxy resin (phenol novolak-type epoxy resin, o-cresol novolac-type epoxy resin, etc.) obtained by epoxidation of the novolak resin; the phenolic compound is mixed with benzaldehyde, salicylaldehyde A triphenylmethane-type epoxy resin obtained by condensing or co-condensing aromatic aldehyde compounds under an acidic catalyst to obtain a triphenylmethane-type phenol resin and epoxidizing the triphenylmethane-type phenol resin; A copolymerized epoxy resin obtained by co-condensing the phenolic compound, naphthol compound and aldehyde compound under an acidic catalyst to obtain a novolac resin and epoxidizing the novolac resin; as bisphenol A, bisphenol F, etc. Diphenylmethane-type epoxy resin as a diglycidyl ether; Diphenyl-type epoxy resin as a diglycidyl ether of alkyl-substituted or unsubstituted biphenol; Diphenylmethane-type epoxy resin as a stilbene-based phenol compound stilbene-type epoxy resin; sulfur atom-containing epoxy resin that is a diglycidyl ether of bisphenol S, etc.; epoxy that is a glycidyl ether of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol. Resin; glycidyl ester type epoxy resin which is the glycidyl ester of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, etc.; aniline, diaminodiphenylmethane, isotrifluoroethylene Glycidyl amine type epoxy resin obtained by replacing the active hydrogen bonded to the nitrogen atom with a glycidyl group such as polycyanuric acid; bicyclic epoxy resin obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenolic compound Pentadiene-type epoxy resin; diepoxidized vinylcyclohexene and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylic obtained by epoxidizing the olefin bonds in the molecule acid ester, 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane and other alicyclic epoxy resins; as a p-xylene modified epoxy resin which is the glycidyl ether of xylene modified phenol resin; m-xylene modified epoxy resin which is the glycidyl ether of m-xylene modified phenol resin; m-xylene modified epoxy resin which is the glycidyl ether of m-xylene modified phenol resin; Terpene-modified epoxy resin as glycidyl ether; dicyclopentadiene-modified epoxy resin as glycidyl ether of dicyclopentadiene-modified phenol resin; glycidyl as cyclopentadiene-modified phenol resin Cyclopentadiene-modified epoxy resin as an ether; polycyclic aromatic ring-modified epoxy resin as a glycidyl ether as a polycyclic aromatic ring-modified phenol resin; naphthalene type as a glycidyl ether of a naphthalene ring-containing phenol resin Epoxy resin; halogenated phenol novolak type epoxy resin; hydroquinone type epoxy resin; trimethylolpropane type epoxy resin; linear aliphatic ring obtained by oxidizing olefin bonds using peracids such as peracetic acid Oxygen resins; aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenol resins such as phenol aralkyl resin and naphthol aralkyl resin, etc. These epoxy resins may be used individually by 1 type, and may be used in combination of 2 or more types.
環氧樹脂的環氧當量（分子量/環氧基數）並無特別限制。就成形性、耐回焊性及電氣可靠性等各種特性平衡的觀點而言，較佳為100 g/eq～1000 g/eq，更佳為150 g/eq～500 g/eq。The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various characteristics such as formability, reflow resistance, and electrical reliability, 100 g/eq to 1000 g/eq is preferred, and 150 g/eq to 500 g/eq is more preferred.
環氧樹脂的環氧當量例如亦可為利用依據日本工業標準（Japanese Industrial Standards，JIS）K 7236：2009的方法測定而得的值。The epoxy equivalent of the epoxy resin may be a value measured by a method based on Japanese Industrial Standards (JIS) K 7236:2009, for example.
於環氧樹脂為固體的情況下，其軟化點或熔點並無特別限制。就硬化性樹脂組成物的製備時的操作性的觀點而言，較佳為50℃～130℃。When the epoxy resin is solid, its softening point or melting point is not particularly limited. From the viewpoint of workability during preparation of the curable resin composition, 50°C to 130°C is preferred.
環氧樹脂的熔點設為利用示差掃描熱量測定（Differential scanning calorimetry，DSC）測定而得的值，環氧樹脂的軟化點設為依據JIS K 7234：1986的方法（環球法）測定而得的值。The melting point of the epoxy resin is a value measured by differential scanning calorimetry (DSC), and the softening point of the epoxy resin is a value measured according to the method of JIS K 7234:1986 (ball and ball method). .
（硬化劑） 硬化劑的種類並無特別限制，可根據硬化性樹脂組成物的所期望的特性等選擇。作為所併用的樹脂為環氧樹脂時的硬化劑，可列舉：酚硬化劑、胺硬化劑、酸酐硬化劑、聚硫醇硬化劑、聚胺基醯胺硬化劑、異氰酸酯硬化劑、嵌段異氰酸酯硬化劑等。就耐熱性的觀點而言，硬化劑較佳為於分子中具有酚性羥基的硬化劑（酚硬化劑）。 (hardener) The type of curing agent is not particularly limited, and can be selected according to the desired properties of the curable resin composition. When the resin used together is an epoxy resin, examples of the curing agent include phenol curing agents, amine curing agents, acid anhydride curing agents, polythiol curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanates. Hardener etc. From the viewpoint of heat resistance, the curing agent is preferably a curing agent having a phenolic hydroxyl group in the molecule (phenol curing agent).
作為酚硬化劑，具體可列舉：間苯二酚、鄰苯二酚、雙酚A、雙酚F、經取代或未經取代的聯苯酚等多元酚化合物；使選自由苯酚、甲酚、二甲酚、間苯二酚、鄰苯二酚、雙酚A、雙酚F、苯基苯酚、胺基苯酚等酚化合物及α-萘酚、β-萘酚、二羥基萘等萘酚化合物所組成的群組中的至少一種酚性化合物與甲醛、乙醛、丙醛等脂肪族醛化合物在酸性觸媒下縮合或共縮合而獲得的酚醛清漆型酚樹脂；由所述酚性化合物與二甲氧基對二甲苯、雙(甲氧基甲基)聯苯等合成的苯酚芳烷基樹脂、萘酚芳烷基樹脂等芳烷基型酚樹脂；利用對二甲苯及間二甲苯中的至少一者進行改質的酚樹脂；三聚氰胺改質酚樹脂；萜烯改質酚樹脂；由所述酚性化合物與二環戊二烯藉由共聚而合成的二環戊二烯型酚樹脂及二環戊二烯型萘酚樹脂；環戊二烯改質酚樹脂；多環芳香環改質酚樹脂；聯苯型酚樹脂；使所述酚性化合物與苯甲醛、水楊醛等芳香族醛化合物在酸性觸媒下進行縮合或共縮合而獲得的三苯基甲烷型酚樹脂；將該些兩種以上共聚而獲得的酚樹脂等。該些酚硬化劑可單獨使用一種，亦可組合使用兩種以上。Specific examples of the phenol hardener include: resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol and other polyphenol compounds; selected from the group consisting of phenol, cresol, diphenol, etc. Phenolic compounds such as cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A novolac-type phenolic resin obtained by condensation or co-condensation of at least one phenolic compound in the group with aliphatic aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst; composed of the phenolic compound and Aralkyl-type phenol resins such as methoxy-paraxylene and bis(methoxymethyl)biphenyl, etc., which are synthesized from phenol aralkyl resins, naphthol aralkyl resins, etc.; utilize the content of p-xylene and m-xylene A phenolic resin modified by at least one of them; a melamine-modified phenol resin; a terpene-modified phenol resin; a dicyclopentadiene-type phenol resin synthesized by copolymerization of the phenolic compound and dicyclopentadiene; and Dicyclopentadiene-type naphthol resin; cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified phenol resin; biphenyl-type phenol resin; combining the phenolic compound with benzaldehyde, salicylic aldehyde and other aromatic compounds triphenylmethane type phenol resin obtained by condensation or co-condensation of aldehyde compounds under an acidic catalyst; phenol resin obtained by copolymerizing two or more of these, etc. One type of these phenol hardeners may be used alone, or two or more types may be used in combination.
硬化劑的官能基當量（於酚硬化劑的情況下為羥基當量）並無特別限制。就成形性、耐回焊性、電氣可靠性等各種特性平衡的觀點而言，較佳為70 g/eq～1000 g/eq，更佳為80 g/eq～500 g/eq。The functional group equivalent of the hardener (hydroxyl equivalent in the case of a phenolic hardener) is not particularly limited. From the viewpoint of the balance of various characteristics such as formability, reflow resistance, and electrical reliability, 70 g/eq to 1000 g/eq is preferred, and 80 g/eq to 500 g/eq is more preferred.
硬化劑的官能基當量（於酚硬化劑的情況下為羥基當量）例如亦可為利用依據JIS K 0070：1992的方法測定而得的值。The functional group equivalent of the hardener (hydroxyl equivalent in the case of a phenol hardener) may be a value measured by a method based on JIS K 0070:1992, for example.
於硬化劑為固體的情況下，其軟化點或熔點並無特別限制。就成形性與耐回焊性的觀點而言，較佳為40℃～180℃，就硬化性樹脂組成物的製造時的操作性的觀點而言，更佳為50℃～130℃。When the hardener is solid, its softening point or melting point is not particularly limited. From the viewpoint of formability and reflow resistance, the temperature is preferably 40°C to 180°C, and from the viewpoint of workability during production of the curable resin composition, the temperature is more preferably 50°C to 130°C.
將硬化劑的熔點或軟化點設為與環氧樹脂的熔點或軟化點同樣地測定而得的值。The melting point or softening point of the hardener is a value measured in the same manner as the melting point or softening point of the epoxy resin.
樹脂與硬化劑的當量比、即硬化劑中的官能基數相對於樹脂中的官能基數的比（硬化劑中的官能基數/樹脂中的官能基數）並無特別限制。就將各自的未反應成分抑制得少的觀點而言，較佳為設定為0.5～2.0的範圍，更佳為設定為0.6～1.3的範圍。就成形性與耐回焊性的觀點而言，進而佳為設定為0.8～1.2的範圍。The equivalent ratio of the resin to the hardener, that is, the ratio of the number of functional groups in the hardener to the number of functional groups in the resin (number of functional groups in the hardener/number of functional groups in the resin) is not particularly limited. From the viewpoint of suppressing each unreacted component to a small amount, it is preferably set to the range of 0.5 to 2.0, and more preferably set to the range of 0.6 to 1.3. From the viewpoint of formability and reflow resistance, it is more preferable to set it in the range of 0.8 to 1.2.
（填充材） 填充材的種類並無特別限制。具體可列舉：二氧化矽（熔融二氧化矽、結晶二氧化矽等）、玻璃、氧化鋁、碳酸鈣、矽酸鋯、矽酸鈣、氮化矽、氮化鋁、氮化硼、氧化鈹、氧化鋯、鋯石、鎂橄欖石（fosterite）、凍石、尖晶石、富鋁紅柱石、二氧化鈦、滑石、黏土、雲母等無機材料。亦可使用具有阻燃效果的填充材。作為具有阻燃效果的填充材，可列舉：氫氧化鋁、氫氧化鎂、鎂與鋅的複合氫氧化物等複合金屬氫氧化物、硼酸鋅等。 (filler material) The type of filler material is not particularly limited. Specific examples include: silica (fused silica, crystallized silica, etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllium oxide , zirconia, zircon, forsterite, pyrolite, spinel, mullite, titanium dioxide, talc, clay, mica and other inorganic materials. Filling materials with flame retardant effects can also be used. Examples of fillers having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc composite hydroxides, zinc borate, and the like.
所述填充材中，就線膨脹係數減少的觀點而言，較佳為二氧化矽，就高熱傳導性的觀點而言，較佳為氧化鋁。填充材可單獨使用一種，亦可組合使用兩種以上。作為填充材的狀態，可列舉粉末、將粉末球形化的顆粒、纖維等。Among the fillers, silica is preferred from the viewpoint of reducing linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. One type of filler may be used alone, or two or more types may be used in combination. Examples of the state of the filler include powder, particles obtained by spheroidizing the powder, and fibers.
硬化性樹脂組成物中所含的填充材的含有率並無特別限制。就流動性及強度的觀點而言，較佳為硬化性樹脂組成物整體的30體積%～90體積%，更佳為35體積%～80體積%，進而佳為40體積%～70體積%。若填充材的含有率為硬化性樹脂組成物整體的30體積%以上，則存在硬化物的熱膨脹係數、熱傳導率、彈性係數等特性進一步提高的傾向。若填充材的含有率為硬化性樹脂組成物整體的90體積%以下，則存在硬化性樹脂組成物的黏度的上昇得到抑制、流動性進一步提高且成形性變得更良好的傾向。The content rate of the filler contained in the curable resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30 to 90 volume% of the entire curable resin composition, more preferably 35 to 80 volume%, and still more preferably 40 to 70 volume%. If the filler content is 30 volume % or more of the entire curable resin composition, the properties of the cured product, such as thermal expansion coefficient, thermal conductivity, and elastic modulus, tend to be further improved. When the filler content is 90 volume % or less of the entire curable resin composition, an increase in the viscosity of the curable resin composition is suppressed, the fluidity is further improved, and the moldability tends to become better.
於填充材為粒子狀的情況下，其平均粒徑並無特別限制。例如，體積平均粒徑較佳為0.2 μm～20 μm，更佳為0.5 μm～15 μm。若體積平均粒徑為0.2 μm以上，則存在硬化性樹脂組成物的黏度的上昇得到進一步抑制的傾向。若體積平均粒徑為20 μm以下，則存在對狹小的縫隙的填充性進一步提高的傾向。填充材的體積平均粒徑可作為藉由雷射散射繞射法粒度分佈測定裝置而獲得的體積基準的粒度分佈中自小粒徑側起的體積的累計成為50%時的粒徑（D50）而進行測定。When the filler is in the form of particles, its average particle size is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 20 μm, more preferably 0.5 μm to 15 μm. If the volume average particle diameter is 0.2 μm or more, an increase in the viscosity of the curable resin composition tends to be further suppressed. When the volume average particle diameter is 20 μm or less, the filling property of narrow gaps tends to be further improved. The volume average particle diameter of the filler can be regarded as the particle diameter when the cumulative volume from the small particle diameter side in the volume-based particle size distribution obtained by a laser scattering diffraction particle size distribution measuring device reaches 50% (D50) to measure.
（硬化促進劑） 硬化性樹脂組成物亦可包含硬化促進劑。硬化促進劑的種類並無特別限制，可根據硬化性樹脂的種類、硬化性樹脂組成物的所期望的特性等選擇。 作為硬化促進劑，可列舉：1,5-二氮雜雙環[4.3.0]壬烯-5（1,5-Diazabicyclo[4.3.0]nonene-5，DBN）、1,8-二氮雜雙環[5.4.0]十一碳烯-7（1,8-Diazabicyclo[5.4.0]undecene-7，DBU）等二氮雜雙環烯烴、2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、2-十七烷基咪唑等環狀脒化合物；所述環狀脒化合物的衍生物；所述環狀脒化合物或其衍生物的苯酚酚醛清漆鹽；以及於該些化合物上加成馬來酸酐、1,4-苯醌、2,5-甲苯醌、1,4-萘醌、2,3-二甲基苯醌、2,6-二甲基苯醌、2,3-二甲氧基-5-甲基-1,4-苯醌、2,3-二甲氧基-1,4-苯醌、苯基-1,4-苯醌等醌化合物、重氮苯基甲烷等具有π鍵的化合物而形成的具有分子內極化的化合物；DBU的四苯基硼鹽、DBN的四苯基硼鹽、2-乙基-4-甲基咪唑的四苯基硼鹽、N-甲基嗎啉的四苯基硼鹽等環狀脒鎓化合物；吡啶、三乙胺、三乙二胺、苄基二甲基胺、三乙醇胺、二甲基胺基乙醇、三(二甲基胺基甲基)苯酚等三級胺化合物；所述三級胺化合物的衍生物；乙酸四-正丁基銨、磷酸四-正丁基銨、乙酸四乙基銨、苯甲酸四-正己基銨、氫氧化四丙基銨等銨鹽化合物；三苯基膦、二苯基(對甲苯)膦、三(烷基苯基)膦、三(烷氧基苯基)膦、三(烷基·烷氧基苯基)膦、三(二烷基苯基)膦、三(三烷基苯基)膦、三(四烷基苯基)膦、三(二烷氧基苯基)膦、三(三烷氧基苯基)膦、三(四烷氧基苯基)膦、三烷基膦、二烷基芳基膦、烷基二芳基膦等三級膦；所述三級膦與有機硼類的錯合物等膦化合物；將所述三級膦或所述膦化合物與馬來酸酐、1,4-苯醌、2,5-甲苯醌、1,4-萘醌、2,3-二甲基苯醌、2,6-二甲基苯醌、2,3-二甲氧基-5-甲基-1,4-苯醌、2,3-二甲氧基-1,4-苯醌、苯基-1,4-苯醌等醌化合物、重氮苯基甲烷等具有π鍵的化合物加成而形成的具有分子內極化的化合物；於使所述三級膦或所述膦化合物與4-溴苯酚、3-溴苯酚、2-溴苯酚、4-氯苯酚、3-氯苯酚、2-氯苯酚、4-碘苯酚、3-碘苯酚、2-碘苯酚、4-溴-2-甲基苯酚、4-溴-3-甲基苯酚、4-溴-2,6-二甲基苯酚、4-溴-3,5-二甲基苯酚、4-溴-2,6-二-第三丁基苯酚、4-氯-1-萘酚、1-溴-2-萘酚、6-溴-2-萘酚、4-溴-4'-羥基聯苯等鹵化苯酚化合物反應後經過脫鹵化氫的步驟而獲得的具有分子內極化的化合物；四苯基鏻等四取代鏻、四-對甲苯硼酸鹽等不存在與硼原子鍵結的苯基的四取代鏻及四取代硼酸鹽；四苯基鏻與酚化合物的鹽等。 (hardening accelerator) The curable resin composition may also contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected according to the type of curable resin, desired properties of the curable resin composition, and the like. Examples of hardening accelerators include: 1,5-Diazabicyclo[4.3.0]nonene-5 (DBN), 1,8-diazabicyclo[4.3.0]nonene-5, DBN Diazabicycloalkenes such as 1,8-Diazabicyclo[5.4.0]undecene-7 (DBU), 2-methylimidazole, 2-phenylimidazole, 2- Cyclic amidine compounds such as phenyl-4-methylimidazole and 2-heptadecylimidazole; derivatives of the cyclic amidine compound; phenol novolac salts of the cyclic amidine compound or its derivatives; and Maleic anhydride, 1,4-benzoquinone, 2,5-toluoquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, and 2,6-dimethylbenzoquinone were added to these compounds. , 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone and other quinone compounds Compounds with intramolecular polarization formed from compounds with π bonds such as diazophenylmethane; DBU tetraphenylboron salt, DBN tetraphenylboron salt, 2-ethyl-4-methylimidazole Cyclic amidinium compounds such as tetraphenylboron salt and tetraphenylboron salt of N-methylmorpholine; pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylamine Tertiary amine compounds such as ethanol and tris(dimethylaminomethyl)phenol; derivatives of the tertiary amine compounds; tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethyl acetate Ammonium salt compounds such as ammonium, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; triphenylphosphine, diphenyl(p-toluene)phosphine, tris(alkylphenyl)phosphine, tris(alkoxybenzene) base)phosphine, tris(alkyl·alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(di Alkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, etc. phosphine compounds; phosphine compounds such as complexes of the tertiary phosphine and organic boron; combining the tertiary phosphine or the phosphine compound with maleic anhydride, 1,4-benzoquinone, 2,5-toluoquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2, Compounds with intramolecular polarization formed by the addition of quinone compounds such as 3-dimethoxy-1,4-benzoquinone and phenyl-1,4-benzoquinone, and compounds with π bonds such as diazophenylmethane ; In making the tertiary phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3 -Iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5- Dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4- Compounds with intramolecular polarization obtained by dehydrohalogenation after the reaction of halogenated phenol compounds such as bromo-4'-hydroxybiphenyl; tetraphenylphosphonium and other tetra-substituted phosphonium, tetra-p-toluene borate, etc. do not exist with Tetra-substituted phosphonium and tetra-substituted borates of phenyl groups bonded to boron atoms; salts of tetraphenyl phosphonium and phenolic compounds, etc.
於硬化性樹脂組成物包含硬化促進劑的情況下，硬化促進劑的量較佳為相對於硬化性樹脂成分100質量份而為0.1質量份～30質量份，更佳為1質量份～15質量份。When the curable resin composition contains a curing accelerator, the amount of the curing accelerator is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass relative to 100 parts by mass of the curable resin component. share.
[各種添加劑] 硬化性樹脂組成物除了所述成分以外，亦可包含以下例示的偶合劑、脫模劑、著色劑等各種添加劑。硬化性樹脂組成物除了以下例示的添加劑以外，亦可視需要包含在本技術領域中周知的各種添加劑。 [Various additives] In addition to the above-mentioned components, the curable resin composition may also contain various additives such as a coupling agent, a release agent, and a colorant exemplified below. In addition to the additives exemplified below, the curable resin composition may optionally contain various additives well known in the art.
（偶合劑） 為了提高樹脂成分與填充材的接著性，硬化性樹脂組成物亦可包含偶合劑。作為偶合劑，可列舉：環氧基矽烷、巰基矽烷、胺基矽烷、烷基矽烷、脲基矽烷、乙烯基矽烷等矽烷化合物、鈦化合物、鋁螯合物、鋁/鋯化合物等公知的偶合劑。其中，就操作性的觀點而言，較佳為矽烷化合物。偶合劑可單獨使用一種，亦可組合使用兩種以上。 (coupling agent) In order to improve the adhesiveness between the resin component and the filler, the curable resin composition may also contain a coupling agent. Examples of the coupling agent include well-known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium compounds, aluminum chelates, and aluminum/zirconium compounds. mixture. Among them, from the viewpoint of workability, a silane compound is preferred. One coupling agent may be used alone, or two or more coupling agents may be used in combination.
於硬化性樹脂組成物包含偶合劑的情況下，偶合劑的量較佳為相對於填充材100質量份而為0.05質量份～5質量份，更佳為0.1質量份～2.5質量份。When the curable resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass relative to 100 parts by mass of the filler.
（脫模劑） 就獲得成形時的與模具的良好的脫模性的觀點而言，硬化性樹脂組成物亦可包含脫模劑。脫模劑並無特別限制，可使用先前公知者。具體可列舉：棕櫚蠟（carnauba wax）、二十八酸、硬脂酸等高級脂肪酸、高級脂肪酸金屬鹽、二十八酸酯等酯系蠟、氧化聚乙烯、非氧化聚乙烯等聚烯烴系蠟等。脫模劑可單獨使用一種，亦可組合使用兩種以上。 (release agent) From the viewpoint of obtaining good releasability from the mold during molding, the curable resin composition may contain a release agent. The release agent is not particularly limited, and conventionally known ones can be used. Specific examples include: carnauba wax, higher fatty acids such as octacarboxylic acid and stearic acid, higher fatty acid metal salts, ester waxes such as octacarboxylic acid esters, and polyolefins such as oxidized polyethylene and non-oxidized polyethylene. Wax etc. One type of release agent may be used alone, or two or more types may be used in combination.
於硬化性樹脂組成物包含脫模劑的情況下，脫模劑的量較佳為相對於硬化性樹脂成分的合計100質量份而為0.01質量份～10質量份，更佳為0.1質量份～5質量份。When the curable resin composition contains a release agent, the amount of the release agent is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 100 parts by mass relative to 100 parts by mass in total of the curable resin component. 5 parts by mass.
（著色劑） 硬化性樹脂組成物亦可進一步包含著色劑。作為著色劑，可列舉碳黑、有機染料、有機顏料、氧化鈦、鉛丹、氧化鐵等公知的著色劑。著色劑的含量可根據目的等適宜選擇。著色劑可單獨使用一種，亦可組合使用兩種以上。 (colorant) The curable resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead, and iron oxide. The content of the colorant can be appropriately selected depending on the purpose and the like. A colorant may be used individually by 1 type, and may be used in combination of 2 or more types.
於硬化性樹脂組成物包含著色劑的情況下，著色劑的量較佳為相對於硬化性樹脂成分的合計100質量份而為0.01質量份～10質量份，更佳為0.1質量份～5質量份。When the curable resin composition contains a colorant, the amount of the colorant is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass relative to 100 parts by mass in total of the curable resin component. share.
（硬化性樹脂組成物的用途） 硬化性樹脂組成物作為電子零件裝置的密封材而可用於各種安裝技術中。於某一實施態樣中使用硬化性樹脂組成物作為製作包含兩個以上封裝的電子零件裝置中的兩個以上封裝的至少一個時的密封材。藉由將硬化性樹脂組成物用作其中一封裝的密封材，可根據另一封裝的翹曲狀態來控制封裝的翹曲，從而可達成封裝間的良好的接合。 (Use of curable resin composition) Curable resin compositions are used as sealing materials for electronic component devices in various mounting technologies. In one embodiment, a curable resin composition is used as a sealing material when producing at least one of two or more packages in an electronic component device including two or more packages. By using the curable resin composition as a sealing material of one package, the warpage of the package can be controlled according to the warpage state of the other package, thereby achieving good bonding between the packages.
作為使用硬化性樹脂組成物來製作封裝的方法，可列舉壓縮成形法、轉移成形法、噴射成形法等，亦可採用該些中的任一種。Examples of a method for producing a package using a curable resin composition include compression molding, transfer molding, injection molding, and the like, and any of these may be used.
（硬化性樹脂組成物的製備方法） 硬化性樹脂組成物的製備方法並無特別限制。作為一般的方法，可列舉如下方法：於藉由混合機等將規定調配量的成分充分混合後，藉由研磨輥、擠出機等熔融混煉，進行冷卻並粉碎。更具體而言，例如可列舉如下方法：將所述成分的規定量均勻地攪拌及混合，利用預先加熱為70℃～140℃的捏合機、輥、擠壓機等進行混煉並冷卻，進行粉碎。 (Preparation method of curable resin composition) The preparation method of the curable resin composition is not particularly limited. As a general method, the following method can be mentioned: after fully mixing the predetermined compounding amount of components with a mixer etc., melt-kneading with a grinding roll, an extruder etc., cooling and grinding|pulverizing. More specifically, for example, the following method can be cited: uniformly stirring and mixing a predetermined amount of the above ingredients, kneading and cooling using a kneader, roller, extruder, etc. that is preheated to 70°C to 140°C, and then cooling. Crush.
＜電子零件裝置＞ 本揭示的電子零件裝置包括包含所述硬化性樹脂組成物的硬化物的封裝。 ＜Electronic component devices＞ An electronic component device of the present disclosure includes a package containing a cured product of the curable resin composition.
本揭示的電子零件裝置亦可為包括包含所述硬化性樹脂組成物的硬化物的第1封裝與第2封裝者（例如，PoP型電子零件裝置）。該情況下，第1封裝與第2封裝的位置關係並無特別限制，較佳為第1封裝位於第2封裝之上（與配置有電子零件裝置的基板為相反側）。The electronic component device of the present disclosure may be a first package and a second package (for example, a PoP type electronic component device) including a cured product containing the curable resin composition. In this case, the positional relationship between the first package and the second package is not particularly limited, but it is preferable that the first package is located above the second package (opposite to the substrate on which the electronic component device is arranged).
作為使用硬化性樹脂組成物來製作封裝的方法，可列舉低壓轉移成形法、噴射成形法、壓縮成形法等，亦可採用該些中的任一種。Examples of a method for producing a package using a curable resin composition include low-pressure transfer molding, injection molding, compression molding, and the like, and any of these may be used.
＜硬化性樹脂組成物（第2實施形態）＞ 本實施形態的硬化性樹脂組成物為含有硬化性樹脂成分、三苯基氧化膦、以及填充材的硬化性樹脂組成物，所述三苯基氧化膦的含有率未滿所述硬化性樹脂組成物的0.3質量%。 <Cureable resin composition (second embodiment)> The curable resin composition of this embodiment is a curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, and the content rate of the triphenylphosphine oxide is less than the curable resin composition. 0.3 mass% of the substance.
三苯基氧化膦的含有率的下限值並無特別限制，例如較佳為所述硬化性樹脂組成物的0.01質量%以上。The lower limit of the content of triphenylphosphine oxide is not particularly limited, but is preferably 0.01% by mass or more of the curable resin composition, for example.
根據本發明者等人的研究可知，使用將三苯基氧化膦的含有率抑制為未滿0.3質量%的硬化性樹脂組成物密封而成的封裝存在於接合時的高溫條件下（例如，230℃以上）產生哭（cry）型翹曲（向上而成為凸狀的翹曲）的傾向。According to studies by the present inventors, it was found that a package sealed with a curable resin composition in which the content of triphenylphosphine oxide is suppressed to less than 0.3% by mass exists under high-temperature conditions during bonding (for example, 230 ℃ or above) tends to produce cry-type warpage (warp that becomes upward and convex).
認為若將於封裝接合時產生哭型翹曲的硬化性樹脂組成物用於其中一封裝的密封，則例如於PoP型電子零件裝置中與另一封裝接合時，該另一封裝於接合時產生哭型翹曲，於所述情況下可使封裝彼此的翹曲狀態一致，從而可獲得良好的接合。It is considered that if a curable resin composition that causes warpage during package bonding is used for sealing one of the packages, for example, when bonding to another package in a PoP-type electronic component device, the other package will produce warpage during bonding. Crying type warpage, in this case, the warpage states of the packages can be consistent with each other, so that good bonding can be achieved.
硬化性樹脂組成物中的三苯基氧化膦的含有率若未滿硬化性樹脂組成物整體的0.3質量%，則並無特別限制，可根據使用硬化性樹脂組成物而製作的封裝的所期望的翹曲狀態、硬化性樹脂組成物中所含的其他成分的含有率等來設定。 就使封裝的哭型翹曲變大的觀點而言，三苯基氧化膦的含有率較佳為硬化性樹脂組成物整體的0.2質量%以下，更佳為0.1質量%以下。 The content of triphenylphosphine oxide in the curable resin composition is not particularly limited as long as it is less than 0.3% by mass of the entire curable resin composition. It can be determined according to the desired properties of the package produced using the curable resin composition. The warpage state, the content rate of other components contained in the curable resin composition, etc. are set. From the viewpoint of increasing the cry warpage of the package, the content rate of triphenylphosphine oxide is preferably 0.2 mass% or less of the entire curable resin composition, more preferably 0.1 mass% or less.
本實施形態的硬化性樹脂組成物的詳細及較佳的態樣除三苯基氧化膦的含有率未滿0.3質量%以外，與第1實施形態的硬化性樹脂組成物的詳細及較佳的態樣相同，可參照對第1實施形態的硬化性樹脂組成物記載的事項。The details and preferred aspects of the curable resin composition of this embodiment are the same as the details and preferred aspects of the curable resin composition of the first embodiment, except that the content of triphenylphosphine oxide is less than 0.3% by mass. The aspects are the same, and the matters described for the curable resin composition of the first embodiment can be referred to.
＜硬化性樹脂組成物（第3實施形態）＞ 本實施形態的硬化性樹脂組成物為含有硬化性樹脂成分、三苯基氧化膦、以及填充材，且所述填充材包含白矽石的硬化性樹脂組成物。 <Cureable resin composition (3rd embodiment)> The curable resin composition of this embodiment contains a curable resin component, triphenylphosphine oxide, and a filler, and the filler contains white silica.
本發明者等人的研究的結果可知，含有三苯基氧化膦以及白矽石的硬化性樹脂組成物於所製作的封裝中產生哭型翹曲。 使用含有三苯基氧化膦以及白矽石的硬化性樹脂組成物而製作的封裝產生哭型翹曲的原因雖未必明確，但認為：白矽石具有藉由於高溫條件下（230℃～240℃）發生相轉移而膨脹係數增大的性質，因該性質而三苯基氧化膦的作用被抵消。 As a result of the study by the present inventors, it was found that the curable resin composition containing triphenylphosphine oxide and white silica causes cry-type warpage in the package produced. Although it is not necessarily clear why a package made of a curable resin composition containing triphenylphosphine oxide and silica suffers from cry-type warpage, it is believed that silica has the ability to react under high-temperature conditions (230°C to 240°C). ) phase transfer occurs and the expansion coefficient increases. Due to this property, the effect of triphenylphosphine oxide is offset.
硬化性樹脂組成物中所含的白矽石的含有率並無特別限制，可根據使用硬化性樹脂組成物密封而成的封裝的所期望的翹曲狀態、硬化性樹脂組成物中所含的其他成分的含有率等來設定。 就充分獲得封裝的翹曲的控制效果的觀點而言，白矽石的含有率較佳為硬化性樹脂組成物整體的2質量%以上，更佳為4質量%以上，進而佳為6質量%以上。 The content rate of white silica contained in the curable resin composition is not particularly limited, and may depend on the desired warp state of the package sealed using the curable resin composition, the content of the white silica contained in the curable resin composition, The content ratio of other ingredients can be set. From the viewpoint of fully obtaining the warpage control effect of the package, the content rate of white silica is preferably 2 mass% or more of the entire curable resin composition, more preferably 4 mass% or more, and still more preferably 6 mass% above.
填充材中白矽石所佔的比例並無特別限制，就硬化性樹脂組成物的特性的平衡的觀點而言，白矽石於填充材整體中所佔的比例較佳為2質量%以上。The proportion of silica in the filler is not particularly limited, but from the viewpoint of balancing the properties of the curable resin composition, the proportion of silica in the entire filler is preferably 2 mass % or more.
就防止適用於記憶體封裝時的軟性錯誤的觀點而言，硬化性樹脂組成物中所含的白矽石較佳為α射線量為5 ppb以下。藉由將α射線量為5 ppb以下的白矽石與α射線量少的其他填充材加以組合，可有效地防止由來源於硬化性樹脂組成物的α射線的放出引起的電子零件裝置的軟性錯誤。白矽石的α射線量例如可藉由蓋格計數器（Geiger counter）來測定。From the viewpoint of preventing soft errors when applied to memory packaging, the white silica contained in the curable resin composition preferably has an α-ray dose of 5 ppb or less. By combining white silica with an α-ray dose of 5 ppb or less and other fillers with a small α-ray dose, it is possible to effectively prevent the softness of electronic components caused by the emission of α-rays derived from the curable resin composition. Mistake. The α-ray dose of white silica can be measured, for example, with a Geiger counter.
硬化性樹脂組成物中所含的三苯基氧化膦的含有率並無特別限制，可根據阻燃性等所期望的性能的程度、硬化性樹脂組成物中所含的其他成分的含有率等來設定。 就充分獲得阻燃效果的觀點而言，三苯基氧化膦的含有率較佳為硬化性樹脂組成物整體的0.2質量%以上，更佳為0.3質量%以上，進而佳為0.5質量%以上。 就與硬化性樹脂組成物中所含的其他成分的平衡的觀點而言，三苯基氧化膦的含有率較佳為硬化性樹脂組成物整體的3.0質量%以下，更佳為2.0質量%以下，進而佳為1.0質量%以下。 The content rate of triphenylphosphine oxide contained in the curable resin composition is not particularly limited, and may depend on the degree of desired performance such as flame retardancy, the content rate of other components contained in the curable resin composition, etc. to set. From the viewpoint of fully obtaining the flame retardant effect, the content rate of triphenylphosphine oxide is preferably 0.2 mass% or more of the entire curable resin composition, more preferably 0.3 mass% or more, and still more preferably 0.5 mass% or more. From the viewpoint of balance with other components contained in the curable resin composition, the content rate of triphenylphosphine oxide is preferably 3.0 mass% or less of the entire curable resin composition, more preferably 2.0 mass% or less. , more preferably 1.0% by mass or less.
本實施形態的硬化性樹脂組成物的詳細及較佳的態樣除含有白矽石以外，與第1實施形態的硬化性樹脂組成物的詳細及較佳的態樣相同，可參照對第1實施形態的硬化性樹脂組成物記載的事項。The details and preferred aspects of the curable resin composition of this embodiment are the same as the details and preferred aspects of the curable resin composition of the first embodiment except that it contains white silica. Refer to the description of the first embodiment. Matters described in the curable resin composition of the embodiment.
＜電子零件裝置的製造方法＞ 本揭示的電子零件裝置的製造方法為如下電子零件裝置的製造方法：其包括將包含所述硬化性樹脂組成物的硬化物的第1封裝與第2封裝接合的步驟，所述接合是於所述第1封裝的翹曲狀態與所述第2封裝的翹曲狀態一致的條件下進行。 ＜Manufacturing method of electronic component device＞ A method of manufacturing an electronic component device of the present disclosure is a method of manufacturing an electronic component device that includes the step of joining a first package and a second package including a cured product of the curable resin composition, the joining being at the This is performed under the condition that the warpage state of the first package matches the warp state of the second package.
藉由於第1封裝的翹曲狀態與所述第2封裝的翹曲狀態一致的條件下進行第1封裝與第2封裝的接合，可達成封裝間的良好的接合。By bonding the first package and the second package under the condition that the warpage state of the first package is consistent with the warp state of the second package, good bonding between the packages can be achieved.
所述方法中，作為第1封裝的翹曲狀態與第2封裝的翹曲狀態一致的情況，可列舉第1封裝與第2封裝均於接合時的溫度條件下產生笑型或哭型翹曲，且兩者的翹曲的曲率為相同程度的情況。In the above method, as a case where the warpage state of the first package coincides with the warpage state of the second package, the first package and the second package both produce laugh-type or cry-type warpage under the temperature conditions during bonding. , and the curvatures of the two warps are the same.
藉由變更用於第1封裝的製作的硬化性樹脂組成物中所含的三苯基氧化膦的含有率，可根據第2封裝的翹曲狀態控制第1封裝接合時的翹曲狀態。因而，所述方法亦可包括根據第2封裝的翹曲狀態控制用於第1封裝的製作的硬化性樹脂組成物中所含的三苯基氧化膦的含有率的步驟。By changing the content rate of triphenylphosphine oxide contained in the curable resin composition used for producing the first package, the warp state during bonding of the first package can be controlled based on the warp state of the second package. Therefore, the method may include a step of controlling the content rate of triphenylphosphine oxide contained in the curable resin composition used for production of the first package based on the warpage state of the second package.
所述方法中，將第1封裝與第2封裝加以接合的方法並無特別限制，亦可為加熱至配置於第1封裝與第2封裝之間的焊料球等接合構件熔融的溫度為止的方法。Among the above methods, the method of joining the first package and the second package is not particularly limited, and may be a method of heating to a temperature at which joining members such as solder balls disposed between the first package and the second package melt. .
所述方法中，第1封裝與第2封裝的位置關係並無特別限制，亦可為第1封裝位於第2封裝之上（與配置有電子零件裝置的基板為相反側）。 [實施例] In the method, the positional relationship between the first package and the second package is not particularly limited, and the first package may be located above the second package (opposite to the substrate on which the electronic component device is arranged). [Example]
以下，藉由實施例對所述實施形態進行具體說明，但所述實施形態的範圍並不限定於該些實施例。Hereinafter, the embodiment will be described in detail using examples, but the scope of the embodiment is not limited to these examples.
（硬化性樹脂組成物的製備） 以表1所示的配方（質量份）混合下述所示的成分，而製備實施例與比較例的硬化性樹脂組成物。 (Preparation of curable resin composition) The ingredients shown below were mixed with the formula (parts by mass) shown in Table 1 to prepare curable resin compositions of Examples and Comparative Examples.
·環氧樹脂1···聯苯型環氧樹脂、環氧當量192 g/eq、三菱化學股份有限公司、品名「YX-4000」） ·環氧樹脂2···伸聯苯基芳烷基型環氧樹脂、環氧當量277 g/eq、日本化藥股份有限公司、品名「NC-3000」） ·Epoxy resin 1···Biphenyl type epoxy resin, epoxy equivalent 192 g/eq, Mitsubishi Chemical Co., Ltd., product name "YX-4000") ·Epoxy resin 2···Biphenyl aralkyl type epoxy resin, epoxy equivalent 277 g/eq, Nippon Kayaku Co., Ltd., product name "NC-3000")
·硬化劑1···聯苯型酚樹脂、羥基當量202 g/eq、明和化成股份有限公司、品名「MEHC-7851-SS」） ·硬化劑2···三苯基甲烷型酚樹脂、羥基當量103 g/eq、明和化成股份有限公司、品名「MEH-7500-3S」） ·Hardening agent 1···Biphenyl type phenol resin, hydroxyl equivalent 202 g/eq, Meiwa Chemical Co., Ltd., product name "MEHC-7851-SS") ·Hardening agent 2···triphenylmethane type phenol resin, hydroxyl equivalent 103 g/eq, Meiwa Chemical Co., Ltd., product name "MEH-7500-3S")
·硬化促進劑1：三苯基膦與1,4-苯醌的加成物 ·硬化促進劑2：三正丁基膦與1,4-苯醌的加成物 ·偶合劑1···N-苯基-3-胺基丙基三甲氧基矽烷（信越化學工業股份有限公司、品名「KBM-573」） ·偶合劑2···甲基三甲氧基矽烷（信越化學工業股份有限公司、品名「KBM-13」） ·脫模劑1：二十八酸酯蠟（科萊恩（Clariant）公司、HW-E） ·脫模劑2：聚乙烯蠟 ·顏料···碳黑（三菱化學股份有限公司、品名「MA600」） ·Harding accelerator 1: adduct of triphenylphosphine and 1,4-benzoquinone ·Harding accelerator 2: adduct of tri-n-butylphosphine and 1,4-benzoquinone ·Coupling agent 1···N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., product name "KBM-573") ·Coupling agent 2···Methyltrimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., brand name "KBM-13") ·Release agent 1: Octocanoic acid ester wax (Clariant, HW-E) ·Release agent 2: polyethylene wax ·Pigment···Carbon black (Mitsubishi Chemical Co., Ltd., product name "MA600")
·離子捕捉劑···鎂·鋁氫氧化·碳酸酯·水合物（堺化學工業股份有限公司、STABIACE HT-P） ·矽酮化合物···聚矽氧烷（東麗道康寧矽酮（Toray Dow Corning Silicone）股份有限公司、品名「AY42-119」） ·三苯基氧化膦（TPPO） ·填充材1···熔融二氧化矽（體積平均粒徑：20 μm） ·填充材2···白矽石（體積平均粒徑：11 μm） ·Ion scavenger···Magnesium·Aluminum hydroxide·Carbonate·hydrate (Sakai Chemical Industry Co., Ltd., STABIACE HT-P) ·Silicone compound···Polysiloxane (Toray Dow Corning Silicone Co., Ltd., product name "AY42-119") ·Triphenylphosphine oxide (TPPO) ·Filling material 1···Fused silica (volume average particle size: 20 μm) ·Filling material 2···White silica (volume average particle size: 11 μm)
（翹曲狀態的評價）
使用所製備的硬化性樹脂組成物，製作搭載有9 mm×9 mm、厚度150 μm的晶片的評價用封裝（15 mm×15 mm、密封厚：350 mm、整體厚：440 mm）。於175℃下進行5小時的後固化後，配置於加熱裝置並實施將裝置內的溫度自30℃昇溫（昇溫速度10℃/25 sec）並達到260℃後降溫（降溫速度10℃/25 sec）至30℃的試驗，調查260℃的評價用封裝的翹曲狀態以及翹曲的距接地面的最大高度（μm）。將產生笑型翹曲時的最大高度設為負值，將產生哭型翹曲時的最大高度設為正值並將結果示於表1中。
[表1]
如表1的結果所示，使用三苯基氧化膦的含有率為0.3質量%以上的硬化性樹脂組成物的實施例1-1～實施例1-5的封裝於熱處理溫度達到260℃時產生笑型翹曲。 使用三苯基氧化膦的含有率未滿0.3質量%的硬化性樹脂組成物的實施例2-1、實施例2-2的封裝於熱處理溫度達到260℃時產生哭型翹曲。 使用含有三苯基氧化膦與白矽石的硬化性樹脂組成物的實施例3-1～實施例3-3於熱處理溫度達到260℃時產生哭型翹曲。 根據以上可知，藉由使用本揭示的硬化性樹脂組成物，可控制接合時的封裝的翹曲狀態。 As shown in the results in Table 1, in the packages of Examples 1-1 to 1-5 using curable resin compositions with a triphenylphosphine oxide content of 0.3% by mass or more, the heat treatment temperature reached 260° C. Smiling warp. The packages of Examples 2-1 and 2-2 using curable resin compositions with a triphenylphosphine oxide content of less than 0.3% by mass produced cry warpage when the heat treatment temperature reached 260°C. Examples 3-1 to 3-3 using the curable resin composition containing triphenylphosphine oxide and white silica produced crying warpage when the heat treatment temperature reached 260°C. From the above, it is understood that by using the curable resin composition of the present disclosure, the warpage state of the package during bonding can be controlled.
日本專利申請第2017-194180號、第2017-194181號及第2017-194182號的揭示藉由參照而將其整體併入本說明書中。 關於本說明書中所記載的所有文獻、專利申請、及技術規格，與具體且各個地記載有藉由參照而併入各個文獻、專利申請、及技術規格的情況同等程度地，引用且併入至本說明書中。 The disclosures of Japanese Patent Application Nos. 2017-194180, 2017-194181, and 2017-194182 are hereby incorporated by reference in their entirety. All documents, patent applications, and technical specifications described in this specification are hereby incorporated by reference to the same extent as if each individual document, patent application, or technical specification was specifically and individually indicated to be incorporated by reference. in this manual.
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| SG10202110711TA (en) | 2021-11-29 |
| TW201922911A (en) | 2019-06-16 |
| SG11202002844QA (en) | 2020-04-29 |
| KR20200055730A (en) | 2020-05-21 |
| WO2019069870A1 (en) | 2019-04-11 |
| TWI774852B (en) | 2022-08-21 |
| TW202244178A (en) | 2022-11-16 |
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