JP6953972B2 - Curable resin composition, electronic component device and method for manufacturing electronic component device - Google Patents
Curable resin composition, electronic component device and method for manufacturing electronic component device Download PDFInfo
- Publication number
- JP6953972B2 JP6953972B2 JP2017194181A JP2017194181A JP6953972B2 JP 6953972 B2 JP6953972 B2 JP 6953972B2 JP 2017194181 A JP2017194181 A JP 2017194181A JP 2017194181 A JP2017194181 A JP 2017194181A JP 6953972 B2 JP6953972 B2 JP 6953972B2
- Authority
- JP
- Japan
- Prior art keywords
- curable resin
- resin composition
- package
- electronic component
- component device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims description 77
- 238000000034 method Methods 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 40
- 229920000647 polyepoxide Polymers 0.000 claims description 40
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 238000005304 joining Methods 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 17
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 claims description 16
- -1 aliphatic aldehyde compound Chemical class 0.000 description 29
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 26
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 17
- 239000005011 phenolic resin Substances 0.000 description 17
- 150000002989 phenols Chemical class 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- 239000007822 coupling agent Substances 0.000 description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 9
- 239000007983 Tris buffer Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 7
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 150000002118 epoxides Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
- 229960001755 resorcinol Drugs 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 3
- 229940005561 1,4-benzoquinone Drugs 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 235000013872 montan acid ester Nutrition 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000004053 quinones Chemical class 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 2
- 150000003739 xylenols Chemical class 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- QJIMTLTYXBDJFC-UHFFFAOYSA-N (4-methylphenyl)-diphenylphosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QJIMTLTYXBDJFC-UHFFFAOYSA-N 0.000 description 1
- QKUSYGZVIAWWPY-UHFFFAOYSA-N 1,3-dioxane;7-oxabicyclo[4.1.0]heptane Chemical compound C1COCOC1.C1CCCC2OC21 QKUSYGZVIAWWPY-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- FQJZPYXGPYJJIH-UHFFFAOYSA-N 1-bromonaphthalen-2-ol Chemical compound C1=CC=CC2=C(Br)C(O)=CC=C21 FQJZPYXGPYJJIH-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- OWWNFGGOZYTYQL-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)cyclohex-3-ene-1-carboxylic acid Chemical compound OC(=O)C1CCC=CC1C(=O)OCC1OC1 OWWNFGGOZYTYQL-UHFFFAOYSA-N 0.000 description 1
- GGIBUEPJJRWWNM-UHFFFAOYSA-N 2-[[2-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical class C1OC1COC1=CC=CC=C1C1=CC=CC=C1OCC1CO1 GGIBUEPJJRWWNM-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- MNOJRWOWILAHAV-UHFFFAOYSA-N 3-bromophenol Chemical compound OC1=CC=CC(Br)=C1 MNOJRWOWILAHAV-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- ZLVFYUORUHNMBO-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol Chemical compound CC1=CC(Br)=CC(C)=C1O ZLVFYUORUHNMBO-UHFFFAOYSA-N 0.000 description 1
- SSQQUEKFNSJLKX-UHFFFAOYSA-N 4-bromo-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(Br)=CC(C(C)(C)C)=C1O SSQQUEKFNSJLKX-UHFFFAOYSA-N 0.000 description 1
- IWJGMJHAIUBWKT-UHFFFAOYSA-N 4-bromo-2-methylphenol Chemical compound CC1=CC(Br)=CC=C1O IWJGMJHAIUBWKT-UHFFFAOYSA-N 0.000 description 1
- WMUWDPLTTLJNPE-UHFFFAOYSA-N 4-bromo-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Br WMUWDPLTTLJNPE-UHFFFAOYSA-N 0.000 description 1
- GPOQODYGMUTOQL-UHFFFAOYSA-N 4-bromo-3-methylphenol Chemical compound CC1=CC(O)=CC=C1Br GPOQODYGMUTOQL-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- LVSPDZAGCBEQAV-UHFFFAOYSA-N 4-chloronaphthalen-1-ol Chemical compound C1=CC=C2C(O)=CC=C(Cl)C2=C1 LVSPDZAGCBEQAV-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- YLDFTMJPQJXGSS-UHFFFAOYSA-N 6-bromo-2-naphthol Chemical compound C1=C(Br)C=CC2=CC(O)=CC=C21 YLDFTMJPQJXGSS-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical group C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- BIEHXHIWQHAVFZ-UHFFFAOYSA-M bromoantimony Chemical compound [Sb]Br BIEHXHIWQHAVFZ-UHFFFAOYSA-M 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-O butylazanium Chemical compound CCCC[NH3+] HQABUPZFAYXKJW-UHFFFAOYSA-O 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N trans-stilbene Chemical compound C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Description
本発明は、硬化性樹脂組成物、電子部品装置及び電子部品装置の製造方法に関する。 The present invention relates to a curable resin composition, an electronic component device, and a method for manufacturing the electronic component device.
従来から、トランジスタ、ＩＣ等の素子がエポキシ樹脂等の硬化性樹脂を含む封止材で封止されたパッケージ（電子部品装置）が電子機器に広く用いられている。 Conventionally, packages (electronic component devices) in which elements such as transistors and ICs are sealed with a sealing material containing a curable resin such as an epoxy resin have been widely used in electronic devices.
近年、電子機器の小型化及び軽量化に対応するため、電子部品装置の薄型化が進んでいる。これに伴い、封止材と基板の熱膨張率の差に起因する電子部品装置の反りが生じやすくなっている。そこで、電子部品装置の反り変形量を低減するという観点からの封止材の組成の検討がなされている（例えば、特許文献１参照）。 In recent years, electronic component devices have been made thinner in order to cope with the miniaturization and weight reduction of electronic devices. Along with this, warpage of the electronic component device due to the difference in the coefficient of thermal expansion between the encapsulant and the substrate is likely to occur. Therefore, the composition of the encapsulant has been studied from the viewpoint of reducing the amount of warpage deformation of the electronic component device (see, for example, Patent Document 1).
アプリケーションプロセッサを封止するパッケージの上にメモリチップを封止するパッケージを配置したいわゆるＰｏＰ型（Ｐａｃｋａｇｅ ｏｎ Ｐａｃｋａｇｅ）の電子部品装置は、通常、パッケージの間にはんだボール等の接合部材を配置した状態で加熱し、接合部材を溶融させてパッケージ間を接合して製造する。このとき、下側のパッケージと上側のパッケージが接合時の温度条件下でそれぞれ異なる反り挙動を示し、充分な接合が得られない場合がある。このため、単にパッケージの反りを抑制するのではなく、一方のパッケージの反りの状態にあわせて他方のパッケージの反りの状態を制御することが望ましい場合がある。 A so-called PoP type (Package on Package) electronic component device in which a package for sealing a memory chip is arranged on a package for sealing an application processor is usually in a state where a joining member such as a solder ball is arranged between the packages. It is manufactured by heating with and melting the joining members and joining the packages together. At this time, the lower package and the upper package may exhibit different warpage behaviors under the temperature conditions at the time of joining, and sufficient joining may not be obtained. Therefore, it may be desirable to control the warp state of the other package according to the warp state of one package, rather than simply suppressing the warp of the package.
本発明は上記事情に鑑み、パッケージの反りの制御性に優れる硬化性樹脂組成物、並びにこれを用いて得られる電子部品装置及び電子部品装置の製造方法を提供することを課題とする。 In view of the above circumstances, it is an object of the present invention to provide a curable resin composition having excellent controllability of warpage of a package, and an electronic component device and a method for manufacturing the electronic component device obtained by using the curable resin composition.
上記課題を解決するための手段には、以下の実施態様が含まれる。
＜１＞硬化性樹脂成分と、トリフェニルホスフィンオキシドと、充填材と、を含有する硬化性樹脂組成物であって、前記トリフェニルホスフィンオキシドの含有率が前記硬化性樹脂組成物の０．３質量％未満である、硬化性樹脂組成物。
＜２＞前記硬化性樹脂成分がエポキシ樹脂と硬化剤とを含む、＜１＞に記載の硬化性樹脂組成物。
＜３＞電子部品装置の封止材である、＜１＞又は＜２＞に記載の硬化性樹脂組成物。
＜４＞２以上のパッケージを備える電子部品装置における前記２以上のパッケージの少なくとも１つの作製に用いる封止材である、＜１＞〜＜３＞のいずれか１項に記載の硬化性樹脂組成物。
＜５＞＜１＞〜＜４＞のいずれか１項に記載の硬化性樹脂組成物の硬化物を含むパッケージを備える電子部品装置。
＜６＞前記硬化性樹脂組成物の硬化物を含む第１のパッケージと第２のパッケージとを備える、＜５＞に記載の電子部品装置。
＜７＞＜１＞〜＜４＞のいずれか１項に記載の硬化性樹脂組成物の硬化物を含む第１のパッケージと第２のパッケージとを接合する工程を含み、前記接合は、前記第１のパッケージの反りの状態と前記第２のパッケージの反りの状態とが合致する条件で行われる、電子部品装置の製造方法。
Means for solving the above problems include the following embodiments.
<1> A curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, wherein the content of the triphenylphosphine oxide is 0.3 of the curable resin composition. A curable resin composition that is less than% by mass.
<2> The curable resin composition according to <1>, wherein the curable resin component contains an epoxy resin and a curing agent.
<3> The curable resin composition according to <1> or <2>, which is a sealing material for an electronic component device.
<4> The curable resin composition according to any one of <1> to <3>, which is a sealing material used for producing at least one of the two or more packages in an electronic component device including two or more packages. thing.
<5> An electronic component device comprising a package containing a cured product of the curable resin composition according to any one of <1> to <4>.
<6> The electronic component apparatus according to <5>, comprising a first package and a second package containing a cured product of the curable resin composition.
<7> The step of joining the first package containing the cured product of the curable resin composition according to any one of <1> to <4> and the second package is included, and the joining includes the step of joining the first package and the second package. A method for manufacturing an electronic component device, which is performed under the condition that the warped state of the first package and the warped state of the second package match.
本発明によれば、パッケージの反りの制御性に優れる硬化性樹脂組成物、並びにこれを用いて得られる電子部品装置及び電子部品装置の製造方法が提供される。 According to the present invention, there is provided a curable resin composition having excellent controllability of warpage of a package, and an electronic component device and a method for manufacturing the electronic component device obtained by using the curable resin composition.
以下、本発明を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。 Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.
本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
本開示において「〜」を用いて示された数値範囲には、「〜」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
In the present disclosure, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
The numerical range indicated by using "~" in the present disclosure includes the numerical values before and after "~" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, a plurality of types of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
＜硬化性樹脂組成物＞
本開示の硬化性樹脂組成物は、硬化性樹脂成分と、トリフェニルホスフィンオキシドと、充填材と、を含有する硬化性樹脂組成物であって、前記トリフェニルホスフィンオキシドの含有率が前記硬化性樹脂組成物の０．３質量％未満である。前記トリフェニルホスフィンオキシドの含有率の下限値は特に制限されないが、例えば、前記硬化性樹脂組成物の０．０１質量％以上であることが好ましい。
<Curable resin composition>
The curable resin composition of the present disclosure is a curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, and the content of the triphenylphosphine oxide is said to be curable. It is less than 0.3% by mass of the resin composition. The lower limit of the content of the triphenylphosphine oxide is not particularly limited, but is preferably 0.01% by mass or more of the curable resin composition, for example.
電子部品装置のパッケージの封止材として使用される硬化性樹脂組成物においては、ハロゲンフリー化の要請を受けてブロモアンチモン等のハロゲンを含有する難燃剤の代替成分としてトリフェニルホスフィンオキシドの使用が検討されている。 In curable resin compositions used as encapsulants for packages of electronic component devices, triphenylphosphine oxide is used as a substitute component for halogen-containing flame retardants such as bromoantimony in response to a request for halogen-free. It is being considered.
本発明者らの検討により、トリフェニルホスフィンオキシドを含有する硬化性樹脂組成物を用いて封止したパッケージは、接合時の高温条件下（例えば、２３０℃以上）でｓｍｉｌｅ型の反り（下に向かって凸状となる反り）を生じやすいことが明らかとなった。その要因は必ずしも明らかではないが、トリフェニルホスフィンオキシドが硬化性樹脂組成物中で可塑剤としてふるまうためと推測される。 According to the study by the present inventors, a package sealed with a curable resin composition containing triphenylphosphine oxide has a smile-type warp (underneath) under high temperature conditions at the time of bonding (for example, 230 ° C. or higher). It became clear that warpage that becomes convex toward the side) is likely to occur. The cause is not always clear, but it is presumed that triphenylphosphine oxide behaves as a plasticizer in the curable resin composition.
上記知見をもとにさらに検討したところ、トリフェニルホスフィンオキシドの含有率を０．３質量％未満に抑えた硬化性樹脂組成物を用いて封止したパッケージは、接合時の高温条件下（例えば、２３０℃以上）でｃｒｙ型の反り（上に向かって凸状となる反り）を生じる傾向にあることがわかった。 As a result of further investigation based on the above findings, the package sealed with the curable resin composition in which the content of triphenylphosphine oxide was suppressed to less than 0.3% by mass was subjected to high temperature conditions at the time of joining (for example,). , 230 ° C. or higher), it was found that there is a tendency for a cry-type warp (warp that becomes convex upward) to occur.
パッケージの接合時にｃｒｙ型の反りを生じる硬化性樹脂組成物を一方のパッケージの封止に用いると、例えば、ＰｏＰ型の電子部品装置において他のパッケージと接合する際に当該他のパッケージが接合時にｃｒｙ型の反りを生じるものである場合、パッケージ同士の反りの状態を合致させることができ、良好な接合が得られると考えられる。 When a curable resin composition that causes a cry type warp when joining packages is used for sealing one package, for example, when joining another package in a PoP type electronic component device, the other package is joined at the time of joining. When a cry type warp is generated, it is considered that the warp states of the packages can be matched and good bonding can be obtained.
硬化性樹脂組成物におけるトリフェニルホスフィンオキシドの含有率は、硬化性樹脂組成物全体の０．３質量％未満であれば特に制限されず、硬化性樹脂組成物を用いて作製されるパッケージの所望の反りの状態、硬化性樹脂組成物に含まれる他の成分の含有率等に応じて設定できる。
パッケージのｃｒｙ型の反りを大きくする観点からは、トリフェニルホスフィンオキシドの含有率は硬化性樹脂組成物全体の０．２質量％以下であることが好ましく、０．１質量％以下であることがより好ましい。
The content of triphenylphosphine oxide in the curable resin composition is not particularly limited as long as it is less than 0.3% by mass of the entire curable resin composition, and a package made by using the curable resin composition is desired. It can be set according to the state of warpage, the content of other components contained in the curable resin composition, and the like.
From the viewpoint of increasing the curl of the package, the content of triphenylphosphine oxide is preferably 0.2% by mass or less, and preferably 0.1% by mass or less of the entire curable resin composition. More preferred.
硬化性樹脂組成物は、固体であっても液体であってもよい。硬化性樹脂組成物が固体である場合の形状としては、粉末状、タブレット状等が挙げられる。取り扱い性の観点からは、硬化性樹脂組成物は使用の際に固体であることが好ましく、粉末状であることがより好ましい。 The curable resin composition may be solid or liquid. Examples of the shape of the curable resin composition when it is a solid include powder and tablet. From the viewpoint of handleability, the curable resin composition is preferably solid at the time of use, and more preferably powdery.
硬化性樹脂組成物は、２以上のパッケージを備える電子部品装置における前記２以上のパッケージの少なくとも１つの封止材であることが好ましく、前記２以上のパッケージのうち上側（電子部品装置が配置される基板と逆側）に位置するパッケージの封止材であることがより好ましい。 The curable resin composition is preferably at least one encapsulant of the two or more packages in the electronic component device including the two or more packages, and the upper side (the electronic component device is arranged) of the two or more packages. It is more preferable that the package encapsulant is located on the opposite side of the substrate.
（硬化性樹脂成分）
硬化性樹脂組成物に含まれる硬化性樹脂成分の種類は、特に制限されない。封止材としての諸特性のバランスの観点からは、エポキシ樹脂と硬化剤の組み合わせであることが好ましい。
(Curable resin component)
The type of the curable resin component contained in the curable resin composition is not particularly limited. From the viewpoint of balancing various properties as a sealing material, a combination of an epoxy resin and a curing agent is preferable.
エポキシ樹脂の種類は特に制限されず、硬化性樹脂組成物の所望の特性等に応じて選択できる。エポキシ樹脂として具体的には、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ等のフェノール化合物及びα−ナフトール、β−ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも１種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したものであるノボラック型エポキシ樹脂（フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等）；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したものであるトリフェニルメタン型エポキシ樹脂；上記フェノール化合物及びナフトール化合物と、アルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化したものである共重合型エポキシ樹脂；ビスフェノールＡ、ビスフェノールＦ等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂；アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂；スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂；ビスフェノールＳ等のジグリシジルエーテルである硫黄原子含有エポキシ樹脂；ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂；フタル酸、イソフタル酸、テトラヒドロフタル酸等の多価カルボン酸化合物のグリシジルエステルであるグリシジルエステル型エポキシ樹脂；アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したものであるグリシジルアミン型エポキシ樹脂；ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したものであるジシクロペンタジエン型エポキシ樹脂；分子内のオレフィン結合をエポキシ化したものであるビニルシクロヘキセンジエポキシド、３，４−エポキシシクロヘキシルメチル−３，４−エポキシシクロヘキサンカルボキシレート、２−（３，４−エポキシ）シクロヘキシル−５，５−スピロ（３，４−エポキシ）シクロヘキサン−ｍ−ジオキサン等の脂環型エポキシ樹脂；パラキシリレン変性フェノール樹脂のグリシジルエーテルであるパラキシリレン変性エポキシ樹脂；メタキシリレン変性フェノール樹脂のグリシジルエーテルであるメタキシリレン変性エポキシ樹脂；テルペン変性フェノール樹脂のグリシジルエーテルであるテルペン変性エポキシ樹脂；ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるジシクロペンタジエン変性エポキシ樹脂；シクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるシクロペンタジエン変性エポキシ樹脂；多環芳香環変性フェノール樹脂のグリシジルエーテルである多環芳香環変性エポキシ樹脂；ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂；ハロゲン化フェノールノボラック型エポキシ樹脂；ハイドロキノン型エポキシ樹脂；トリメチロールプロパン型エポキシ樹脂；オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂；フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂をエポキシ化したものであるアラルキル型エポキシ樹脂；などが挙げられる。これらのエポキシ樹脂は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 The type of epoxy resin is not particularly limited and can be selected according to the desired properties of the curable resin composition and the like. Specifically, the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. A novolak type epoxy resin (phenol novolak type) which is an epoxidized novolak resin obtained by condensing or cocondensing a seed phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst. Epoxide resin, orthocresol novolac type epoxy resin, etc.); Epoxide is a triphenylmethane type phenol resin obtained by condensing or cocondensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst. Triphenylmethane type epoxide resin; bisphenol; a copolymerized epoxy resin obtained by epoxidizing a novolak resin obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst. Diphenylmethane type epoxy resin which is a diglycidyl ether such as A and bisphenol F; biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether; stillben type epoxy resin which is a diglycidyl ether of a stilben-based phenol compound; bisphenol Sulfur atom-containing epoxy resin such as diglycidyl ether such as S; epoxy resin which is glycidyl ether of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; polyhydric carboxylic acid compound such as phthalic acid, isophthalic acid and tetrahydrophthalic acid Glycidyl ester type epoxy resin, which is a glycidyl ester of Dicyclopentadiene type epoxy resin which is an epoxide of a condensed resin; vinylcyclohexene diepoxide which is an epoxide of an olefin bond in a molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxide) cyclohexyl-5,5 Alicyclic epoxy resin such as 5-spiro (3,4-epoxy) cyclohexane-m-dioxane; paraxylylene-modified epoxy resin which is glycidyl ether of paraxylylene-modified phenol resin; metaxylylene-modified epoxy resin which is glycidyl ether of metaxylylene-modified phenol resin Terpen-modified epoxy resin, which is a glycidyl ether of terpen-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified epoxy resin, which is a glycidyl ether of cyclopentadiene-modified phenol resin; Polycyclic aromatic ring-modified epoxy resin which is a glycidyl ether of a ring aromatic ring-modified phenol resin; naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; halogenated phenol novolac type epoxy resin; hydroquinone type epoxy resin; trimethylol propane Type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Aralkyl type epoxy resin obtained by epoxyizing an aralkyl type phenol resin such as phenol aralkyl resin and naphthol aralkyl resin. ; And so on. These epoxy resins may be used alone or in combination of two or more.
エポキシ樹脂のエポキシ当量（分子量／エポキシ基数）は、特に制限されない。成形性、耐リフロー性及び電気的信頼等の各種特性バランスの観点からは、１００ｇ／ｅｑ〜１０００ｇ／ｅｑであることが好ましく、１５０ｇ／ｅｑ〜５００ｇ／ｅｑであることがより好ましい。 The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, reflow resistance and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.
エポキシ樹脂のエポキシ当量は、例えば、ＪＩＳ Ｋ ７２３６：２００９に準じた方法で測定される値であってもよい。 The epoxy equivalent of the epoxy resin may be, for example, a value measured by a method according to JIS K 7236: 2009.
エポキシ樹脂の軟化点又は融点は特に制限されない。硬化性樹脂組成物の調製の際の取扱い性の観点からは、５０℃〜１３０℃であることが好ましい。 The softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of handleability when preparing the curable resin composition, the temperature is preferably 50 ° C to 130 ° C.
エポキシ樹脂の融点又は軟化点は、例えば、ＪＩＳ Ｋ ７２３４：１９８６及びＪＩＳ Ｋ ７２３３：１９８６に記載の単一円筒回転粘度計法により測定される値であってもよい。 The melting point or softening point of the epoxy resin may be, for example, a value measured by the single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
（硬化剤）
硬化剤の種類は特に制限されず、硬化性樹脂組成物の所望の特性等に応じて選択できる。併用する樹脂がエポキシ樹脂である場合の硬化剤としては、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、ブロックイソシアネート硬化剤等が挙げられる。耐熱性の観点からは、硬化剤は、フェノール性水酸基を分子中に有するもの（フェノール硬化剤）であることが好ましい。
(Hardener)
The type of the curing agent is not particularly limited, and can be selected according to the desired properties of the curable resin composition and the like. Examples of the curing agent when the resin to be used in combination is an epoxy resin include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, a blocked isocyanate curing agent, and the like. Be done. From the viewpoint of heat resistance, the curing agent is preferably one having a phenolic hydroxyl group in the molecule (phenolic curing agent).
フェノール硬化剤として具体的には、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、置換又は非置換のビフェノール等の多価フェノール化合物；フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、フェニルフェノール、アミノフェノール等のフェノール化合物及びα−ナフトール、β−ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも一種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂；上記フェノール性化合物と、ジメトキシパラキシレン、ビス（メトキシメチル）ビフェニル等とから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂；パラキシリレン及びメタキシリレンの少なくとも一方で変性したフェノール樹脂；メラミン変性フェノール樹脂；テルペン変性フェノール樹脂；上記フェノール性化合物と、ジシクロペンタジエンとから共重合により合成されるジシクロペンタジエン型フェノール樹脂及びジシクロペンタジエン型ナフトール樹脂；シクロペンタジエン変性フェノール樹脂；多環芳香環変性フェノール樹脂；ビフェニル型フェノール樹脂；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂；これら２種以上を共重合して得たフェノール樹脂などが挙げられる。これらのフェノール硬化剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 Specifically, the phenolic curing agent is a polyhydric phenol compound such as resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol. , At least one phenolic compound selected from the group consisting of phenolic compounds such as aminophenol and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene, and aliphatic aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde. Novolac-type phenolic resin obtained by condensing or co-condensing under an acidic catalyst; phenolal aralkyl resin synthesized from the above phenolic compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc., naphthol aralkyl resin, etc. Phenolic resin; Phenolic resin modified at least one of paraxylylene and metaxylylene; Melamine-modified phenolic resin; Terpen-modified phenolic resin; Dicyclopentadiene-type phenolic resin and dicyclopentadiene synthesized by copolymerization of the above phenolic compound with dicyclopentadiene. Cyclopentadiene-type naphthol resin; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type phenolic resin; Triphenylmethane-type phenolic resin obtained by condensation; phenolic resin obtained by copolymerizing two or more of these types can be mentioned. These phenol curing agents may be used alone or in combination of two or more.
硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、７０ｇ／ｅｑ〜１０００ｇ／ｅｑであることが好ましく、８０ｇ／ｅｑ〜５００ｇ／ｅｑであることがより好ましい。 The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of the balance of various characteristics such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.
硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、例えば、ＪＩＳ Ｋ ００７０：１９９２に準じた方法により測定される値であってもよい。 The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) may be, for example, a value measured by a method according to JIS K 0070: 1992.
硬化剤の軟化点又は融点は、特に制限されない。成形性と耐リフロー性の観点からは、４０℃〜１８０℃であることが好ましく、樹脂組成物の製造時における取扱い性の観点からは、５０℃〜１３０℃であることがより好ましい。 The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability during production of the resin composition, the temperature is more preferably 50 ° C. to 130 ° C.
硬化剤の融点又は軟化点は、例えば、ＪＩＳ Ｋ ７２３４：１９８６及びＪＩＳ Ｋ ７２３３：１９８６に記載の単一円筒回転粘度計法により測定される値であってもよい。 The melting point or softening point of the curing agent may be, for example, a value measured by the single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.
樹脂と硬化剤との当量比、すなわち樹脂中の官能基数に対する硬化剤中の官能基数の比（硬化剤中の官能基数／樹脂中の官能基数）は、特に制限されない。それぞれの未反応分を少なく抑える関連からは、０．５〜２．０の範囲に設定されることが好ましく、０．６〜１．３の範囲に設定されることがより好ましい。成形性と耐リフロー性の観点からは、０．８〜１．２の範囲に設定されることがさらに好ましい。 The equivalent ratio of the resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the resin (the number of functional groups in the curing agent / the number of functional groups in the resin) is not particularly limited. It is preferable to set it in the range of 0.5 to 2.0, and more preferably set it in the range of 0.6 to 1.3 from the viewpoint of suppressing each unreacted component to a small extent. From the viewpoint of moldability and reflow resistance, it is more preferable to set the range from 0.8 to 1.2.
（充填材）
充填材の種類は、特に制限されない。具体的には、シリカ（溶融シリカ、結晶シリカ等）、ガラス、アルミナ、炭酸カルシウム、ケイ酸ジルコニウム、ケイ酸カルシウム、窒化珪素、窒化アルミニウム、窒化ホウ素、ベリリア、ジルコニア、ジルコン、フォステライト、ステアタイト、スピネル、ムライト、チタニア、タルク、クレー、マイカ等の無機材料が挙げられる。難燃効果を有する充填材を用いてもよい。難燃効果を有する充填材としては、水酸化アルミニウム、水酸化マグネシウム、マグネシウムと亜鉛の複合水酸化物等の複合金属水酸化物、硼酸亜鉛などが挙げられる。
(Filler)
The type of filler is not particularly limited. Specifically, silica (molten silica, crystalline silica, etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite. , Spinel, mullite, titania, talc, clay, mica and other inorganic materials. A filler having a flame-retardant effect may be used. Examples of the filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc composite hydroxides, and zinc borate.
上記充填材の中でも、線膨張係数低減の観点からはシリカが好ましく、高熱伝導性の観点からはアルミナが好ましい。充填材は１種を単独で用いても２種以上を組み合わせて用いてもよい。充填材の状態としては粉未、粉末を球形化したビーズ、繊維等が挙げられる。 Among the above-mentioned fillers, silica is preferable from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferable from the viewpoint of high thermal conductivity. As the filler, one type may be used alone or two or more types may be used in combination. Examples of the state of the filler include unpowdered beads, spherical beads of powder, fibers, and the like.
硬化性樹脂組成物に含まれる充填材の含有率は、特に制限されない。流動性及び強度の観点からは、硬化性樹脂組成物全体の３０体積％〜９０体積％であることが好ましく、３５体積％〜８０体積％であることがより好ましく、４０体積％〜７０体積％であることがさらに好ましい。充填材の含有率が硬化性樹脂組成物全体の３０体積％以上であると、硬化物の熱膨張係数、熱伝導率、弾性率等の特性がより向上する傾向にある。充填材の含有率が硬化性樹脂組成物全体の９０体積％以下であると、硬化性樹脂組成物の粘度の上昇が抑制され、流動性がより向上して成形性がより良好になる傾向にある。 The content of the filler contained in the curable resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 80% by volume, and 40% to 70% by volume of the entire curable resin composition. Is more preferable. When the content of the filler is 30% by volume or more of the entire curable resin composition, the properties such as the coefficient of thermal expansion, the thermal conductivity, and the elastic modulus of the cured product tend to be further improved. When the content of the filler is 90% by volume or less of the entire curable resin composition, an increase in the viscosity of the curable resin composition is suppressed, the fluidity is further improved, and the moldability tends to be better. be.
充填材が粒子状である場合、その平均粒子径は、特に制限されない。例えば、体積平均粒子径が０．２μｍ〜２０μｍであることが好ましく、０．５μｍ〜１５μｍであることがより好ましい。体積平均粒子径が０．２μｍ以上であると、硬化性樹脂組成物の粘度の上昇がより抑制される傾向がある。体積平均粒子径が２０μｍ以下であると、狭い隙間への充填性がより向上する傾向にある。充填材の体積平均粒子径は、レーザー散乱回折法粒度分布測定装置により得られる体積基準の粒度分布において小径側からの体積の累積が５０％となるときの粒子径（Ｄ５０）として測定することができる。 When the filler is in the form of particles, the average particle size thereof is not particularly limited. For example, the volume average particle size is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle size is 0.2 μm or more, the increase in viscosity of the curable resin composition tends to be further suppressed. When the volume average particle size is 20 μm or less, the filling property into a narrow gap tends to be further improved. The volume average particle size of the packing material can be measured as the particle size (D50) when the cumulative volume from the small diameter side is 50% in the volume-based particle size distribution obtained by the laser scattering diffraction method particle size distribution measuring device. can.
（硬化促進剤）
硬化性樹脂組成物は、硬化促進剤を含んでもよい。硬化促進剤の種類は特に制限されず、硬化性樹脂の種類、硬化性樹脂組成物の所望の特性等に応じて選択できる。
硬化促進剤としては、１，５−ジアザビシクロ［４．３．０］ノネン−５（ＤＢＮ）、１，８−ジアザビシクロ［５．４．０］ウンデセン−７（ＤＢＵ）等のジアザビシクロアルケン、２−メチルイミダゾール、２−フェニルイミダゾール、２−フェニル−４−メチルイミダゾール、２−ヘプタデシルイミダゾール等の環状アミジン化合物；前記環状アミジン化合物の誘導体；前記環状アミジン化合物又はその誘導体のフェノールノボラック塩；これらの化合物に無水マレイン酸、１，４−ベンゾキノン、２，５−トルキノン、１，４−ナフトキノン、２，３−ジメチルベンゾキノン、２，６−ジメチルベンゾキノン、２，３−ジメトキシ−５−メチル−１，４−ベンゾキノン、２，３−ジメトキシ−１，４−ベンゾキノン、フェニル−１，４−ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；ＤＢＵのテトラフェニルボレート塩、ＤＢＮのテトラフェニルボレート塩、２−エチル−４−メチルイミダゾールのテトラフェニルボレート塩、Ｎ−メチルモルホリンのテトラフェニルボレート塩等の環状アミジニウム化合物；ピリジン、トリエチルアミン、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス（ジメチルアミノメチル）フェノール等の三級アミン化合物；前記三級アミン化合物の誘導体；酢酸テトラ−ｎ−ブチルアンモニウム、リン酸テトラ−ｎ−ブチルアンモニウム、酢酸テトラエチルアンモニウム、安息香酸テトラ−ｎ−ヘキシルアンモニウム、水酸化テトラプロピルアンモニウム等のアンモニウム塩化合物；トリフェニルホスフィン、ジフェニル（ｐ−トリル）ホスフィン、トリス（アルキルフェニル）ホスフィン、トリス（アルコキシフェニル）ホスフィン、トリス（アルキル・アルコキシフェニル）ホスフィン、トリス（ジアルキルフェニル）ホスフィン、トリス（トリアルキルフェニル）ホスフィン、トリス（テトラアルキルフェニル）ホスフィン、トリス（ジアルコキシフェニル）ホスフィン、トリス（トリアルコキシフェニル）ホスフィン、トリス（テトラアルコキシフェニル）ホスフィン、トリアルキルホスフィン、ジアルキルアリールホスフィン、アルキルジアリールホスフィン等の三級ホスフィン；前記三級ホスフィンと有機ボロン類との錯体等のホスフィン化合物；前記三級ホスフィン又は前記ホスフィン化合物と無水マレイン酸、１，４−ベンゾキノン、２，５−トルキノン、１，４−ナフトキノン、２，３−ジメチルベンゾキノン、２，６−ジメチルベンゾキノン、２，３−ジメトキシ−５−メチル−１，４−ベンゾキノン、２，３−ジメトキシ−１，４−ベンゾキノン、フェニル−１，４−ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；前記三級ホスフィン又は前記ホスフィン化合物と４−ブロモフェノール、３−ブロモフェノール、２−ブロモフェノール、４−クロロフェノール、３−クロロフェノール、２−クロロフェノール、４−ヨウ化フェノール、３−ヨウ化フェノール、２−ヨウ化フェノール、４−ブロモ−２−メチルフェノール、４−ブロモ−３−メチルフェノール、４−ブロモ−２，６−ジメチルフェノール、４−ブロモ−３，５−ジメチルフェノール、４−ブロモ−２，６−ジ−ｔ−ブチルフェノール、４−クロロ−１−ナフトール、１−ブロモ−２−ナフトール、６−ブロモ−２−ナフトール、４−ブロモ−４’−ヒドロキシビフェニル等のハロゲン化フェノール化合物を反応させた後に、脱ハロゲン化水素の工程を経て得られる、分子内分極を有する化合物；テトラフェニルホスホニウム等のテトラ置換ホスホニウム、テトラ−ｐ−トリルボレート等のホウ素原子に結合したフェニル基がないテトラ置換ホスホニウム及びテトラ置換ボレート；テトラフェニルホスホニウムとフェノール化合物との塩などが挙げられる。
(Curing accelerator)
The curable resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and can be selected according to the type of the curable resin, the desired properties of the curable resin composition, and the like.
Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonen-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU). Cyclic amidin compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidin compound; phenol novolac salts of the cyclic amidin compound or derivatives thereof; Maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone and other quinone compounds, and diazophenylmethane and other quinone compounds with π-bonded compounds added to it. Compounds; Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholin tetraphenylborate salt; pyridine, triethylamine, tri Tertiary amine compounds such as ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; derivatives of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-phosphate Ammonium salt compounds such as butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; triphenylphosphenyl, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl). ) Hosphin, Tris (alkyl / alkoxyphenyl) phosphin, Tris (dialkylphenyl) phosphin, Tris (trialkylphenyl) phosphin, Tris (tetraalkylphenyl) phosphin, Tris (dialkoxyphenyl) phosphin, Tris (trialkoxyphenyl) phosphine , Tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine and other tertiary phosphines; Phosphine compound; said tertiary phosphine or said phosphin compound and maleic anhydride, 1,4-benzoquinone, 2,5-torquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2, Kinone compounds such as 3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and compounds having a π bond such as diazophenylmethane. Addition of a compound having intramolecular polarization; the tertiary phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-Ioated phenol, 3-iodinated phenol, 2-iodinated phenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo -3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo- A compound having intramolecular polarization obtained by reacting a halogenated phenol compound such as 4'-hydroxybiphenyl and then undergoing a step of dehalogenating; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-p-tolylbolate. Tetra-substituted phosphonium and tetra-substituted borate without a phenyl group bonded to a boron atom such as; salts of tetraphenylphosphonium and a phenol compound and the like.
硬化性樹脂組成物が硬化促進剤を含む場合、その量は硬化性樹脂成分１００質量部に対して０．１質量部〜３０質量部であることが好ましく、１質量部〜１５質量部であることがより好ましい。 When the curable resin composition contains a curing accelerator, the amount thereof is preferably 0.1 part by mass to 30 parts by mass, and 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the curable resin component. Is more preferable.
［各種添加剤］
硬化性樹脂組成物は、上述の成分に加えて、以下に例示するカップリング剤、離型剤、着色剤等の各種添加剤を含んでもよい。硬化性樹脂組成物は、以下に例示する添加剤以外にも必要に応じて当技術分野で周知の各種添加剤を含んでもよい。
[Various additives]
In addition to the above-mentioned components, the curable resin composition may contain various additives such as a coupling agent, a mold release agent, and a colorant exemplified below. The curable resin composition may contain various additives well known in the art, if necessary, in addition to the additives exemplified below.
（カップリング剤）
硬化性樹脂組成物は、樹脂成分と充填材との接着性を高めるために、カップリング剤を含んでもよい。カップリング剤としては、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン等のシラン化合物、チタン化合物、アルミニウムキレート化合物、アルミニウム／ジルコニウム化合物などの公知のカップリング剤が挙げられる。中でも取り扱い性の観点からは、シラン化合物が好ましい。カップリング剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Coupling agent)
The curable resin composition may contain a coupling agent in order to enhance the adhesiveness between the resin component and the filler. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane and vinylsilane, titanium compounds, aluminum chelate compounds and aluminum / zirconium compounds. Of these, a silane compound is preferable from the viewpoint of handleability. As the coupling agent, one type may be used alone or two or more types may be used in combination.
硬化性樹脂組成物がカップリング剤を含む場合、カップリング剤の量は、充填材１００質量部に対して０．０５質量部〜５質量部であることが好ましく、０．１質量部〜２．５質量部であることがより好ましい。 When the curable resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass, and 0.1 parts by mass to 2 parts by mass with respect to 100 parts by mass of the filler. It is more preferably 5.5 parts by mass.
（離型剤）
硬化性樹脂組成物は、成形時における金型との良好な離型性を得る観点から、離型剤を含んでもよい。離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、モンタン酸エステル等のエステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Release agent)
The curable resin composition may contain a mold release agent from the viewpoint of obtaining good mold releasability from the mold at the time of molding. The release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester-based waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene. The release agent may be used alone or in combination of two or more.
硬化性樹脂組成物が離型剤を含む場合、その量は硬化性樹脂成分の合計１００質量部に対して０．０１質量部〜１０質量部であることが好ましく、０．１質量部〜５質量部であることがより好ましい。 When the curable resin composition contains a mold release agent, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, and 0.1 parts by mass to 5 parts by mass, based on 100 parts by mass of the total of the curable resin components. More preferably, it is by mass.
（着色剤）
硬化性樹脂組成物は、着色剤をさらに含んでもよい。着色剤としてはカーボンブラック、有機染料、有機顔料、酸化チタン、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有量は目的等に応じて適宜選択できる。着色剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Colorant)
The curable resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead tan, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. As the colorant, one type may be used alone or two or more types may be used in combination.
硬化性樹脂組成物が着色剤を含む場合、その量は硬化性樹脂成分の合計１００質量部に対して０．０１質量部〜１０質量部であることが好ましく、０．１質量部〜５質量部であることがより好ましい。 When the curable resin composition contains a colorant, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, and 0.1 parts by mass to 5 parts by mass, based on 100 parts by mass of the total of the curable resin components. It is more preferable that it is a part.
（硬化性樹脂組成物の用途）
硬化性樹脂組成物は、電子部品装置の封止材として種々の実装技術に用いることができる。ある実施態様では、２以上のパッケージを含む電子部品装置における２以上のパッケージの少なくとも１つを作製する際の封止材として硬化性樹脂組成物を用いる。硬化性樹脂組成物を一方のパッケージの封止材として用いることで、他方のパッケージの反りの状態にあわせてパッケージの反りを制御することができ、パッケージ間の良好な接合を達成することができる。
(Use of curable resin composition)
The curable resin composition can be used in various mounting techniques as a sealing material for electronic component devices. In one embodiment, a curable resin composition is used as a sealing material when producing at least one of two or more packages in an electronic component device including two or more packages. By using the curable resin composition as a sealing material for one package, the warp of the package can be controlled according to the warp state of the other package, and good bonding between the packages can be achieved. ..
硬化性樹脂組成物を用いてパッケージを作製する方法としては、圧縮成形法、トランスファ成形法、インジェクション成形法等が挙げられ、これらのいずれも採用できる。 Examples of the method for producing a package using the curable resin composition include a compression molding method, a transfer molding method, an injection molding method, and the like, and any of these can be adopted.
（硬化性樹脂組成物の調製方法）
硬化性樹脂組成物の調製方法は、特に制限されない。一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合した後、ミキシングロール、押出機等によって溶融混練し、冷却し、粉砕する方法を挙げることができる。より具体的には、例えば、上述した成分の所定量を均一に撹拌及び混合し、予め７０℃〜１４０℃に加熱してあるニーダー、ロール、エクストルーダー等で混練し、冷却し、粉砕する方法を挙げることができる。
(Method for preparing curable resin composition)
The method for preparing the curable resin composition is not particularly limited. As a general method, a method in which a predetermined amount of components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized can be mentioned. More specifically, for example, a method in which a predetermined amount of the above-mentioned components is uniformly stirred and mixed, kneaded with a kneader, roll, extruder or the like preheated to 70 ° C. to 140 ° C., cooled and pulverized. Can be mentioned.
＜電子部品装置＞
本開示の電子部品装置は、上述の硬化性樹脂組成物の硬化物を含むパッケージを備える。
<Electronic component equipment>
The electronic component device of the present disclosure includes a package containing a cured product of the above-mentioned curable resin composition.
本開示の電子部品装置は、上述する硬化性樹脂組成物の硬化物を含む第１のパッケージと第２のパッケージとを備えるもの（例えば、ＰｏＰ型の電子部品装置）であってもよい。この場合、第１のパッケージと第２のパッケージの位置関係は特に制限されないが、第１のパッケージが第２のパッケージの上（電子部品装置を配置する基板と逆側）に位置することが好ましい。 The electronic component device of the present disclosure may include a first package containing a cured product of the above-mentioned curable resin composition and a second package (for example, a PoP type electronic component device). In this case, the positional relationship between the first package and the second package is not particularly limited, but it is preferable that the first package is located on the second package (opposite to the substrate on which the electronic component device is arranged). ..
硬化性樹脂組成物を用いてパッケージを作製する方法としては、低圧トランスファ成形法、インジェクション成形法、圧縮成形法等が挙げられ、これらのいずれも採用できる。 Examples of the method for producing a package using the curable resin composition include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like, and any of these can be adopted.
＜電子部品装置の製造方法＞
本開示の電子部品装置の製造方法は、上述する硬化性樹脂組成物の硬化物を含む第１のパッケージと第２のパッケージとを接合する工程を含み、
前記接合は、前記第１のパッケージの反りの状態と前記第２のパッケージの反りの状態とが合致する条件で行われる。
<Manufacturing method of electronic component equipment>
The method for manufacturing an electronic component device of the present disclosure includes a step of joining a first package containing a cured product of the above-mentioned curable resin composition and a second package.
The joining is performed under the condition that the warped state of the first package and the warped state of the second package match.
第１のパッケージと第２のパッケージとの接合を第１のパッケージの反りの状態と前記第２のパッケージの反りの状態とが合致する条件で行うことで、パッケージ間の良好な接合を達成できる。 Good bonding between packages can be achieved by joining the first package and the second package under the condition that the warped state of the first package and the warped state of the second package match. ..
上記方法において第１のパッケージの反りの状態と第２のパッケージの反りの状態とが合致する場合としては、第１のパッケージと第２のパッケージがともに接合時の温度条件下でｓｍｉｌｅ型の反りを生じ、かつ両者の反りの曲率が同程度である場合が挙げられる。 In the above method, when the warp state of the first package and the warp state of the second package match, the first package and the second package are both smile type warp under the temperature condition at the time of joining. And the curvature of the warp of both is about the same.
第１のパッケージの作製に用いる硬化性樹脂組成物に含まれるトリフェニルホスフィンの含有率を変更することで、第１のパッケージの接合時の反りの状態を第２のパッケージの反りの状態にあわせて制御することができる。従って、上記方法は第１のパッケージの作製に用いる硬化性樹脂組成物に含まれるトリフェニルホスフィンの含有率を第２のパッケージの反りの状態にあわせて制御する工程を含むものであってもよい。 By changing the content of triphenylphosphine contained in the curable resin composition used for producing the first package, the state of warpage at the time of joining the first package is adjusted to the state of warpage of the second package. Can be controlled. Therefore, the above method may include a step of controlling the content of triphenylphosphine contained in the curable resin composition used for producing the first package according to the warped state of the second package. ..
上記方法において第１のパッケージと第２のパッケージとを接合する方法は特に制限されないが、第１のパッケージと第２のパッケージの間に配置されるはんだボール等の接合部材が溶融する温度まで加熱する方法であってもよい。 In the above method, the method of joining the first package and the second package is not particularly limited, but the method is heated to a temperature at which the joining member such as a solder ball arranged between the first package and the second package melts. It may be a method of doing.
上記方法において第１のパッケージと第２のパッケージの位置関係は特に制限されないが、第１のパッケージが第２のパッケージの上（電子部品装置を配置する基板と逆側）に位置するものであってもよい。 In the above method, the positional relationship between the first package and the second package is not particularly limited, but the first package is located on the second package (opposite to the substrate on which the electronic component device is arranged). You may.
以下、上記実施形態を実施例により具体的に説明するが、上記実施形態の範囲はこれらの実施例に限定されるものではない。 Hereinafter, the above-described embodiment will be specifically described with reference to Examples, but the scope of the above-mentioned Embodiment is not limited to these Examples.
（硬化性樹脂組成物の調製）
下記に示す成分を表１に示す配合（質量部）で混合し、実施例と比較例の硬化性樹脂組成物を調製した。
(Preparation of curable resin composition)
The components shown below were mixed in the formulations (parts by mass) shown in Table 1 to prepare curable resin compositions of Examples and Comparative Examples.
・エポキシ樹脂１…ビフェニル型エポキシ樹脂、エポキシ当量１９２ｇ／ｅｑ、三菱化学株式会社、品名「ＹＸ−４０００」）
・エポキシ樹脂２…ビフェニレンアラルキル型エポキシ樹脂、エポキシ当量２７７ｇ／ｅｑ、日本化薬株式会社、品名「ＮＣ−３０００」）
-Epoxy resin 1 ... Biphenyl type epoxy resin, epoxy equivalent 192 g / eq, Mitsubishi Chemical Corporation, product name "YX-4000")
-Epoxy resin 2 ... Biphenylene aralkyl type epoxy resin, epoxy equivalent 277 g / eq, Nippon Kayaku Co., Ltd., product name "NC-3000")
・硬化剤１…ビフェニル型フェノール樹脂、水酸基当量２０２ｇ／ｅｑ、明和化成株式会社、品名「ＭＥＨＣ−７８５１−ＳＳ」）
・硬化剤２…トリフェニルメタン型フェノール樹脂、水酸基当量１０３ｇ／ｅｑ、明和化成株式会社、品名「ＭＥＨ−７５００−３Ｓ」）
-Curing agent 1 ... Biphenyl-type phenol resin, hydroxyl group equivalent 202 g / eq, Meiwa Kasei Co., Ltd., product name "MEHC-7851-SS")
-Curing agent 2 ... Triphenylmethane type phenol resin, hydroxyl group equivalent 103 g / eq, Meiwa Kasei Co., Ltd., product name "MEH-7500-3S")
・硬化促進剤１：トリフェニルホスフィンと１，４−ベンゾキノンとの付加物
・硬化促進剤２：トリ−ｎ−ブチルホスフィンと１，４−ベンゾキノンとの付加物
・カップリング剤１…Ｎ−フェニル−３−アミノプロピルトリメトキシシラン（信越化学工業株式会社、品名「ＫＢＭ−５７３」）
・カップリング剤２…メチルトリメトキシシラン（信越化学工業株式会社、品名「ＫＢＭ−１３」）
・離型剤１：モンタン酸エステルワックス（クラリアント社、ＨＷ−Ｅ）
・離型剤２：ポリエチレンワックス
・顔料…カーボンブラック（三菱ケミカル株式会社、品名「ＭＡ６００ＭＪ」）
-Curing accelerator 1: adduct of triphenylphosphine and 1,4-benzoquinone-Curing accelerator 2: adduct of tri-n-butylphosphine and 1,4-benzoquinone-Coupling agent 1 ... N-phenyl -3-Aminopropyltrimethoxysilane (Shinetsu Chemical Industry Co., Ltd., product name "KBM-573")
-Coupling agent 2 ... Methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-13")
-Release agent 1: Montanic acid ester wax (Clariant, HW-E)
-Release agent 2: Polyethylene wax / pigment ... Carbon black (Mitsubishi Chemical Corporation, product name "MA600MJ")
・イオントラップ剤…マグネシウム・アルミニウムハイドロオキサイド・カーボネート・ハイドレート（堺化学工業株式会社、ＳＴＡＢＩＡＣＥ ＨＴ−Ｐ）
・シリコーン化合物…ポリシロキサン（東レ・ダウコーニング・シリコーン株式会社、品名「ＡＹ４２−１１９」）
・トリフェニルホスフィンオキシド（ＴＰＰＯ）
・充填材…溶融シリカ（体積平均粒子径２０μｍ）
・ Ion trap agent: Magnesium, aluminum, hydroxide, carbonate, hydrate (Sakai Chemical Industry Co., Ltd., STABIACE HT-P)
-Silicone compound: Polysiloxane (Toray Dow Corning Silicone Co., Ltd., product name "AY42-119")
-Triphenylphosphine oxide (TPPO)
・ Filler: Fused silica (volume average particle size 20 μm)
（反りの状態の評価）
調製した硬化性樹脂組成物を用いて、９ｍｍ×９ｍｍ、厚さ１５０ｕｍのチップを搭載した評価用パッケージ（１５ｍｍ×１５ｍｍ、封止厚：３５０ｍｍ、全体厚：４４０ｍｍ）を作製した。１７５℃で５時間のポストキュアを行った後、加熱装置に配置して装置内の温度を３０℃から昇温（昇温速度１０℃／２５秒）して２６０℃に達した後に３０℃まで降温（降温速度１０℃／２５秒）させる試験を実施し、２６０℃における評価用パッケージの反りの状態と、反りの接地面からの最大高さ（μｍ）を調べた。ｓｍｉｌｅ型の反りを生じている場合の最大高さはマイナス値、ｃｒｙ型の反りを生じている場合の最大高さはプラス値として結果を表１に示す。
(Evaluation of warpage condition)
Using the prepared curable resin composition, an evaluation package (15 mm × 15 mm, sealing thickness: 350 mm, overall thickness: 440 mm) on which a chip having a thickness of 9 mm × 9 mm and a thickness of 150 um was mounted was prepared. After performing post-cure at 175 ° C. for 5 hours, it is placed in a heating device and the temperature inside the device is raised from 30 ° C. (heating rate 10 ° C./25 seconds) to 260 ° C. and then up to 30 ° C. A test for lowering the temperature (lowering speed: 10 ° C./25 seconds) was carried out, and the state of warpage of the evaluation package at 260 ° C. and the maximum height (μm) of the warp from the ground plane were examined. Table 1 shows the results as a negative value for the maximum height when the smile type warp is generated and a positive value for the maximum height when the criy type warp is generated.
表１の結果に示すように、トリフェニルホスフィンオキシドの含有率が０．３質量％未満である硬化性樹脂組成物を用いた実施例のパッケージは、熱処理温度が２６０℃に達したときにｃｒｙ型の反りが生じた。
以上から、トリフェニルホスフィンオキシドの含有率が０．３質量％未満である硬化性樹脂組成物を用いることで、パッケージの接合時にｃｒｙ型の反りを生じさせることができることがわかった。
As shown in the results of Table 1, the package of the example using the curable resin composition having a triphenylphosphine oxide content of less than 0.3% by mass is cry when the heat treatment temperature reaches 260 ° C. The mold was warped.
From the above, it was found that by using a curable resin composition having a triphenylphosphine oxide content of less than 0.3% by mass, a cry type warp can be generated at the time of joining the packages.
Claims (1)
前記硬化性樹脂組成物はエポキシ樹脂と硬化剤とを含む硬化性樹脂成分と、トリフェニルホスフィンオキシドと、充填材と、を含有し、前記トリフェニルホスフィンオキシドの含有率が前記硬化性樹脂組成物の０．３質量％未満である、電子部品装置の製造方法。The curable resin composition contains a curable resin component containing an epoxy resin and a curing agent, triphenylphosphine oxide, and a filler, and the content of the triphenylphosphine oxide is the curable resin composition. A method for manufacturing an electronic component device, which is less than 0.3% by mass.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017194181A JP6953972B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
| SG10202110711TA SG10202110711TA (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
| SG11202002844QA SG11202002844QA (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
| KR1020207009440A KR102628332B1 (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and method of manufacturing electronic component device |
| PCT/JP2018/036742 WO2019069870A1 (en) | 2017-10-04 | 2018-10-01 | Curable resin composition, electronic component device, and production method for electronic component device |
| TW111128042A TWI833301B (en) | 2017-10-04 | 2018-10-03 | Curable resin composition and electronic component device |
| TW107134865A TWI774852B (en) | 2017-10-04 | 2018-10-03 | Method of producing electronic component device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017194181A JP6953972B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019065225A JP2019065225A (en) | 2019-04-25 |
| JP6953972B2 true JP6953972B2 (en) | 2021-10-27 |
Family
ID=66337602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017194181A Active JP6953972B2 (en) | 2017-10-04 | 2017-10-04 | Curable resin composition, electronic component device and method for manufacturing electronic component device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6953972B2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004115583A (en) * | 2002-09-24 | 2004-04-15 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
| JP2006131653A (en) * | 2004-11-02 | 2006-05-25 | Air Water Chemical Inc | Flame-retardant for epoxy resin and epoxy resin composition obtained using the same |
| JP2006193619A (en) * | 2005-01-13 | 2006-07-27 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
| JP2013237855A (en) * | 2005-12-13 | 2013-11-28 | Hitachi Chemical Co Ltd | Epoxy resin composition for encapsulation and electronic component device |
| JP6018967B2 (en) * | 2013-04-26 | 2016-11-02 | 日東電工株式会社 | Method for manufacturing thermosetting sealing resin sheet and electronic component package |
| JP2017031371A (en) * | 2015-08-05 | 2017-02-09 | 京セラ株式会社 | Resin composition for encapsulating semiconductor and semiconductor device |
-
2017
- 2017-10-04 JP JP2017194181A patent/JP6953972B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019065225A (en) | 2019-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102628332B1 (en) | Curable resin composition, electronic component device, and method of manufacturing electronic component device | |
| CN114981353A (en) | Resin composition for molding and electronic component device | |
| JP2023105016A (en) | Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device | |
| JP2018172545A (en) | Solid sealing material for compression molding, semiconductor device, and semiconductor device production method | |
| JP7452028B2 (en) | Encapsulating resin composition, electronic component device, and method for manufacturing electronic component device | |
| JP2008121003A (en) | Epoxy resin molding material for use in sealing, and electronic component device using the same | |
| JP6953971B2 (en) | Curable resin composition, electronic component device and method for manufacturing electronic component device | |
| JP2020152825A (en) | Resin composition for sealing, electronic component device, and production method for electronic component device | |
| JPWO2019176859A1 (en) | Epoxy resin composition and electronic component equipment | |
| WO2019131096A1 (en) | Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device | |
| JP2022125150A (en) | Resin composition and electronic component device | |
| JPWO2020065872A1 (en) | Manufacturing method of sealing resin composition, electronic component device and electronic component device | |
| JPWO2019004458A1 (en) | Sealing resin composition, relocated wafer, semiconductor package, and method for manufacturing semiconductor package | |
| JP6953972B2 (en) | Curable resin composition, electronic component device and method for manufacturing electronic component device | |
| JP2018104603A (en) | Curable resin composition and electronic component device | |
| JP6953973B2 (en) | Curable resin composition, electronic component device and method for manufacturing electronic component device | |
| JP2022093030A (en) | Resin composition and high-frequency device | |
| JP2021116329A (en) | Sealing resin composition, electronic component device, and method for producing electronic component device | |
| JP7275528B2 (en) | ELECTRONIC COMPONENT DEVICE, SEALING MATERIAL AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE | |
| JP2021084980A (en) | Sealing resin composition, electronic component device and method for producing electronic component device | |
| WO2020021667A1 (en) | Electronic-component-device manufacturing method, electronic component device, and sealing material | |
| TWI833301B (en) | Curable resin composition and electronic component device | |
| WO2022124405A1 (en) | Resin composition for molding and high frequency device | |
| JP2023040897A (en) | Thermosetting resin composition and electronic component device | |
| WO2020158851A1 (en) | Resin composition for sealing, electronic component device, and method for producing electronic component device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200807 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210601 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210715 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210831 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210913 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6953972 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |