JP6953971B2 - Curable resin composition, electronic component device and method for manufacturing electronic component device - Google Patents

Description

The present invention relates to a curable resin composition, an electronic component device, and a method for manufacturing the electronic component device.

Conventionally, packages (electronic component devices) in which elements such as transistors and ICs are sealed with a sealing material containing a curable resin such as an epoxy resin have been widely used in electronic devices.

In recent years, electronic component devices have been made thinner in order to cope with the miniaturization and weight reduction of electronic devices. Along with this, warpage of the electronic component device due to the difference in the coefficient of thermal expansion between the encapsulant and the substrate is likely to occur. Therefore, the composition of the encapsulant has been studied from the viewpoint of reducing the amount of warpage deformation of the electronic component device (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2005-29641

A so-called PoP type (Package on Package) electronic component device in which a package for sealing a memory chip is arranged on a package for sealing an application processor is usually in a state where a joining member such as a solder ball is arranged between the packages. It is manufactured by heating with and melting the joining members and joining the packages together. At this time, the lower package and the upper package may exhibit different warpage behaviors under the temperature conditions at the time of joining, and sufficient joining may not be obtained. Therefore, it may be desirable to control the warp state of the other package according to the warp state of one package, rather than simply suppressing the warp of the package.

In view of the above circumstances, it is an object of the present invention to provide a curable resin composition having excellent controllability of warpage of a package, and an electronic component device and a method for manufacturing the electronic component device obtained by using the curable resin composition.

Means for solving the above problems include the following embodiments.
<1> A curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, wherein the content of the triphenylphosphine oxide is 0.3 of the curable resin composition. A curable resin composition having a mass% or more.
<2> The curable resin composition according to <1>, wherein the curable resin component contains an epoxy resin and a curing agent.
<3> The curable resin composition according to <1> or <2>, which is a sealing material for an electronic component device.
<4> The curable resin composition according to any one of <1> to <3>, which is a sealing material used for producing at least one of the two or more packages in an electronic component device including two or more packages. thing.
<5> An electronic component device comprising a package containing a cured product of the curable resin composition according to any one of <1> to <4>.
<6> The electronic component apparatus according to <5>, comprising a first package and a second package containing a cured product of the curable resin composition.
<7> The step of joining the first package containing the cured product of the curable resin composition according to any one of <1> to <4> and the second package is included, and the joining includes the step of joining the first package and the second package. It is performed under the condition that the warped state of the first package and the warped state of the second package match.
Manufacturing method of electronic component equipment.

According to the present invention, there is provided a curable resin composition having excellent controllability of warpage of a package, and an electronic component device and a method for manufacturing the electronic component device obtained by using the curable resin composition.

Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.

In the present disclosure, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
The numerical range indicated by using "~" in the present disclosure includes the numerical values before and after "~" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, a plurality of types of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.

<Curable resin composition>
The curable resin composition of the present disclosure is a curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, and the content of the triphenylphosphine oxide is said to be curable. It is 0.3% by mass or more and 6.0% by mass or less of the resin composition.

In curable resin compositions used as encapsulants for packages of electronic component devices, triphenylphosphine oxide is used as a substitute component for halogen-containing flame retardants such as bromoantimony in response to a request for halogen-free. It is being considered.

As a result of the studies by the present inventors, a package sealed with a curable resin composition containing 0.3% by mass or more of triphenylphosphine oxide is subjected to high temperature conditions at the time of bonding (for example, 230 ° C. or higher). It has been clarified that a smile-type warp (warp that becomes convex downward) is likely to occur. Although the cause is not always clear, triphenylphosphine oxide behaves as a plasticizer in the cured product of the curable resin composition in the package sealed with the curable resin composition, and the reaction is caused by heating at the time of joining the packages. It is presumed that this is because the expansion of the cured product is suppressed.

When a curable resin composition that easily causes a smile-type warp when joining packages is used for sealing one package, for example, when joining another package in a PoP-type electronic component device, the other package is joined. When a smile-type warp sometimes occurs, it is considered that the warp states of the packages can be matched and good bonding can be obtained.

The content of triphenylphosphine oxide in the curable resin composition is not particularly limited as long as it is 0.3% by mass or more of the entire curable resin composition, and a package prepared using the curable resin composition is desired. It can be set according to the state of warpage, the content of other components contained in the curable resin composition, and the like.
From the viewpoint of increasing the warp of the smile type of the package, the content of triphenylphosphine oxide is preferably 0.5% by mass or more, and preferably 1.0% by mass or more of the entire curable resin composition. More preferably, it is more preferably 1.5% by mass or more.
From the viewpoint of the balance with other components contained in the curable resin composition, the content of triphenylphosphine oxide is preferably 3.0% by mass or less of the entire curable resin composition, preferably 2.0% by mass. It is more preferably% or less, and further preferably 1.0% by mass or less.

The curable resin composition may be solid or liquid. Examples of the shape of the curable resin composition when it is a solid include powder and tablet. From the viewpoint of handleability, the curable resin composition is preferably solid at the time of use, and more preferably powdery.

The curable resin composition is preferably at least one encapsulant of the two or more packages in the electronic component device including the two or more packages, and the upper side (the electronic component device is arranged) of the two or more packages. It is more preferable that the package encapsulant is located on the opposite side of the substrate.

(Curable resin component)
The type of the curable resin component contained in the curable resin composition is not particularly limited. From the viewpoint of balancing various properties as a sealing material, a combination of an epoxy resin and a curing agent is preferable.

The type of epoxy resin is not particularly limited and can be selected according to the desired properties of the curable resin composition and the like. Specifically, the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. A novolak type epoxy resin (phenol novolak type) which is an epoxidized novolak resin obtained by condensing or cocondensing a seed phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst. Epoxide resin, orthocresol novolac type epoxy resin, etc.); Epoxide is a triphenylmethane type phenol resin obtained by condensing or cocondensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst. Triphenylmethane type epoxide resin; bisphenol; a copolymerized epoxy resin obtained by epoxidizing a novolak resin obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst. Diphenylmethane type epoxy resin which is a diglycidyl ether such as A and bisphenol F; biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether; stillben type epoxy resin which is a diglycidyl ether of a stilben-based phenol compound; bisphenol Sulfur atom-containing epoxy resin such as diglycidyl ether such as S; epoxy resin which is glycidyl ether of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; polyhydric carboxylic acid compound such as phthalic acid, isophthalic acid and tetrahydrophthalic acid Glycidyl ester type epoxy resin, which is a glycidyl ester of Dicyclopentadiene type epoxy resin which is an epoxide of a condensed resin; vinylcyclohexene diepoxide which is an epoxide of an olefin bond in a molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxide) cyclohexyl-5,5 Alicyclic epoxy resin such as 5-spiro (3,4-epoxy) cyclohexane-m-dioxane; paraxylylene-modified epoxy resin which is glycidyl ether of paraxylylene-modified phenol resin; metaxylylene-modified epoxy resin which is glycidyl ether of metaxylylene-modified phenol resin Terpen-modified epoxy resin, which is a glycidyl ether of terpen-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified epoxy resin, which is a glycidyl ether of cyclopentadiene-modified phenol resin; Polycyclic aromatic ring-modified epoxy resin which is a glycidyl ether of a ring aromatic ring-modified phenol resin; naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; halogenated phenol novolac type epoxy resin; hydroquinone type epoxy resin; trimethylol propane Type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Aralkyl type epoxy resin obtained by epoxyizing an aralkyl type phenol resin such as phenol aralkyl resin and naphthol aralkyl resin. ; And so on. These epoxy resins may be used alone or in combination of two or more.

The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balance of various characteristics such as moldability, reflow resistance and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.

The epoxy equivalent of the epoxy resin may be, for example, a value measured by a method according to JIS K 7236: 2009.

The softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of handleability when preparing the curable resin composition, the temperature is preferably 50 ° C to 130 ° C.

The melting point or softening point of the epoxy resin may be, for example, a value measured by the single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

(Hardener)
The type of the curing agent is not particularly limited, and can be selected according to the desired properties of the curable resin composition and the like. Examples of the curing agent when the resin to be used in combination is an epoxy resin include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, a blocked isocyanate curing agent, and the like. Be done. From the viewpoint of heat resistance, the curing agent is preferably one having a phenolic hydroxyl group in the molecule (phenolic curing agent).

Specifically, the phenolic curing agent is a polyhydric phenol compound such as resorcin, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol. , At least one phenolic compound selected from the group consisting of phenolic compounds such as aminophenol and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene, and aliphatic aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde. Novolac-type phenolic resin obtained by condensing or co-condensing under an acidic catalyst; phenolal aralkyl resin synthesized from the above phenolic compound and dimethoxyparaxylene, bis (methoxymethyl) biphenyl, etc., naphthol aralkyl resin, etc. Phenolic resin; Phenolic resin modified at least one of paraxylylene and metaxylylene; Melamine-modified phenolic resin; Terpen-modified phenolic resin; Dicyclopentadiene-type phenolic resin and dicyclopentadiene synthesized by copolymerization of the above phenolic compound with dicyclopentadiene. Cyclopentadiene-type naphthol resin; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type phenolic resin; Triphenylmethane-type phenolic resin obtained by condensation; phenolic resin obtained by copolymerizing two or more of these types can be mentioned. These phenol curing agents may be used alone or in combination of two or more.

The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of the balance of various characteristics such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) may be, for example, a value measured by a method according to JIS K 0070: 1992.

The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40 ° C. to 180 ° C., and from the viewpoint of handleability during production of the resin composition, the temperature is more preferably 50 ° C. to 130 ° C.

The melting point or softening point of the curing agent may be, for example, a value measured by the single cylinder rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

The equivalent ratio of the resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the resin (the number of functional groups in the curing agent / the number of functional groups in the resin) is not particularly limited. It is preferable to set it in the range of 0.5 to 2.0, and more preferably set it in the range of 0.6 to 1.3 from the viewpoint of suppressing each unreacted component to a small extent. From the viewpoint of moldability and reflow resistance, it is more preferable to set the range from 0.8 to 1.2.

(Filler)
The type of filler is not particularly limited. Specifically, silica (molten silica, crystalline silica, etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite. , Spinel, mullite, titania, talc, clay, mica and other inorganic materials. A filler having a flame-retardant effect may be used. Examples of the filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc composite hydroxides, and zinc borate.

Among the above-mentioned fillers, silica is preferable from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferable from the viewpoint of high thermal conductivity. As the filler, one type may be used alone or two or more types may be used in combination. Examples of the state of the filler include unpowdered beads, spherical beads of powder, fibers, and the like.

The content of the filler contained in the curable resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 80% by volume, and 40% to 70% by volume of the entire curable resin composition. Is more preferable. When the content of the filler is 30% by volume or more of the entire curable resin composition, the properties such as the coefficient of thermal expansion, the thermal conductivity, and the elastic modulus of the cured product tend to be further improved. When the content of the filler is 90% by volume or less of the entire curable resin composition, an increase in the viscosity of the curable resin composition is suppressed, the fluidity is further improved, and the moldability tends to be better. be.

When the filler is in the form of particles, the average particle size thereof is not particularly limited. For example, the volume average particle size is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle size is 0.2 μm or more, the increase in viscosity of the curable resin composition tends to be further suppressed. When the volume average particle size is 20 μm or less, the filling property into a narrow gap tends to be further improved. The volume average particle size of the packing material can be measured as the particle size (D50) when the cumulative volume from the small diameter side is 50% in the volume-based particle size distribution obtained by the laser scattering diffraction method particle size distribution measuring device. can.

(Curing accelerator)
The curable resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and can be selected according to the type of the curable resin, the desired properties of the curable resin composition, and the like.
Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonen-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU). Cyclic amidin compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidin compound; phenol novolac salts of the cyclic amidin compound or derivatives thereof; Maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone and other quinone compounds, and diazophenylmethane and other quinone compounds with π-bonded compounds added to it. Compounds; Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholin tetraphenylborate salt; pyridine, triethylamine, tri Tertiary amine compounds such as ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; derivatives of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-phosphate Ammonium salt compounds such as butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; triphenylphosphenyl, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl). ) Hosphin, Tris (alkyl / alkoxyphenyl) phosphin, Tris (dialkylphenyl) phosphin, Tris (trialkylphenyl) phosphin, Tris (tetraalkylphenyl) phosphin, Tris (dialkoxyphenyl) phosphin, Tris (trialkoxyphenyl) phosphine , Tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine and other tertiary phosphines; Phosphine compound; said tertiary phosphine or said phosphin compound and maleic anhydride, 1,4-benzoquinone, 2,5-torquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2, Kinone compounds such as 3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and compounds having a π bond such as diazophenylmethane. Addition of a compound having intramolecular polarization; the tertiary phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-Ioated phenol, 3-iodinated phenol, 2-iodinated phenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo -3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo- A compound having intramolecular polarization obtained by reacting a halogenated phenol compound such as 4'-hydroxybiphenyl and then undergoing a step of dehalogenating; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-p-tolylbolate. Tetra-substituted phosphonium and tetra-substituted borate without a phenyl group bonded to a boron atom such as; salts of tetraphenylphosphonium and a phenol compound and the like.

When the curable resin composition contains a curing accelerator, the amount thereof is preferably 0.1 part by mass to 30 parts by mass, and 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the curable resin component. Is more preferable.

[Various additives]
In addition to the above-mentioned components, the curable resin composition may contain various additives such as a coupling agent, a mold release agent, and a colorant exemplified below. The curable resin composition may contain various additives well known in the art, if necessary, in addition to the additives exemplified below.

(Coupling agent)
The curable resin composition may contain a coupling agent in order to enhance the adhesiveness between the resin component and the filler. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane and vinylsilane, titanium compounds, aluminum chelate compounds and aluminum / zirconium compounds. Of these, a silane compound is preferable from the viewpoint of handleability. As the coupling agent, one type may be used alone or two or more types may be used in combination.

When the curable resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass, and 0.1 parts by mass to 2 parts by mass with respect to 100 parts by mass of the filler. It is more preferably 5.5 parts by mass.

(Release agent)
The curable resin composition may contain a mold release agent from the viewpoint of obtaining good mold releasability from the mold at the time of molding. The release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as carnauba wax, montanic acid and stearic acid, ester-based waxes such as higher fatty acid metal salts and montanic acid esters, and polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene. The release agent may be used alone or in combination of two or more.

When the curable resin composition contains a mold release agent, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, and 0.1 parts by mass to 5 parts by mass, based on 100 parts by mass of the total of the curable resin components. More preferably, it is by mass.

(Colorant)
The curable resin composition may further contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead tan, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. As the colorant, one type may be used alone or two or more types may be used in combination.

When the curable resin composition contains a colorant, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, and 0.1 parts by mass to 5 parts by mass, based on 100 parts by mass of the total of the curable resin components. It is more preferable that it is a part.

(Use of curable resin composition)
The curable resin composition can be used in various mounting techniques as a sealing material for electronic component devices. In one embodiment, a curable resin composition is used as a sealing material when producing at least one of two or more packages in an electronic component device including two or more packages. By using the curable resin composition as a sealing material for one package, the warp of the package can be controlled according to the warp state of the other package, and good bonding between the packages can be achieved. ..

Examples of the method for producing a package using the curable resin composition include a compression molding method, a transfer molding method, an injection molding method, and the like, and any of these can be adopted.

(Method for preparing curable resin composition)
The method for preparing the curable resin composition is not particularly limited. As a general method, a method in which a predetermined amount of components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized can be mentioned. More specifically, for example, a method in which a predetermined amount of the above-mentioned components is uniformly stirred and mixed, kneaded with a kneader, roll, extruder or the like preheated to 70 ° C. to 140 ° C., cooled and pulverized. Can be mentioned.

<Electronic component equipment>
The electronic component device of the present disclosure includes a package containing a cured product of the above-mentioned curable resin composition.

The electronic component device of the present disclosure may include a first package containing a cured product of the above-mentioned curable resin composition and a second package (for example, a PoP type electronic component device). In this case, the positional relationship between the first package and the second package is not particularly limited, but it is preferable that the first package is located on the second package (opposite to the substrate on which the electronic component device is arranged). ..

Examples of the method for producing a package using the curable resin composition include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like, and any of these can be adopted.

<Manufacturing method of electronic component equipment>
The method for manufacturing an electronic component device of the present disclosure includes a step of joining a first package containing a cured product of the above-mentioned curable resin composition and a second package, and the joining includes the step of joining the first package. This is a method for manufacturing an electronic component device, which is performed under the condition that the warped state and the warped state of the second package match.

Good bonding between packages can be achieved by joining the first package and the second package under the condition that the warped state of the first package and the warped state of the second package match. ..

In the above method, when the warp state of the first package and the warp state of the second package match, the first package and the second package are both smile type warp under the temperature condition at the time of joining. And the curvature of the warp of both is about the same.

By changing the content of triphenylphosphine contained in the curable resin composition used for producing the first package, the state of warpage at the time of joining the first package is adjusted to the state of warpage of the second package. Can be controlled. Therefore, the above method may include a step of controlling the content of triphenylphosphine contained in the curable resin composition used for producing the first package according to the warped state of the second package. ..

In the above method, the method of joining the first package and the second package is not particularly limited, but the method is heated to a temperature at which the joining member such as a solder ball arranged between the first package and the second package melts. It may be a method of doing.

In the above method, the positional relationship between the first package and the second package is not particularly limited, but the first package is located on the second package (opposite to the substrate on which the electronic component device is arranged). You may.

Hereinafter, the above-described embodiment will be specifically described with reference to Examples, but the scope of the above-mentioned Embodiment is not limited to these Examples.

(Preparation of curable resin composition)
The components shown below were mixed in the formulations (parts by mass) shown in Table 1 to prepare curable resin compositions of Examples and Comparative Examples.

-Epoxy resin 1 ... Biphenyl type epoxy resin, epoxy equivalent 192 g / eq, Mitsubishi Chemical Corporation, product name "YX-4000")
-Epoxy resin 2 ... Biphenylene aralkyl type epoxy resin, epoxy equivalent 277 g / eq, Nippon Kayaku Co., Ltd., product name "NC-3000")

-Curing agent 1 ... Biphenyl-type phenol resin, hydroxyl group equivalent 202 g / eq, Meiwa Kasei Co., Ltd., product name "MEHC-7851-SS")
-Curing agent 2 ... Triphenylmethane type phenol resin, hydroxyl group equivalent 103 g / eq, Meiwa Kasei Co., Ltd., product name "MEH-7500-3S")

-Curing accelerator 1: adduct of triphenylphosphine and 1,4-benzoquinone-Curing accelerator 2: adduct of tri-n-butylphosphine and 1,4-benzoquinone-Coupling agent 1 ... N-phenyl -3-Aminopropyltrimethoxysilane (Shinetsu Chemical Industry Co., Ltd., product name "KBM-573")
-Coupling agent 2 ... Methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-13")
-Release agent 1: Montanic acid ester wax (Clariant, HW-E)
-Release agent 2: Polyethylene wax / pigment ... Carbon black (Mitsubishi Chemical Corporation, product name "MA600MJ")

・ Ion trap agent: Magnesium, aluminum, hydroxide, carbonate, hydrate (Sakai Chemical Industry Co., Ltd., STABIACE HT-P)
-Silicone compound: Polysiloxane (Toray Dow Corning Silicone Co., Ltd., product name "AY42-119")
-Triphenylphosphine oxide (TPPO)
・ Filler: Fused silica (volume average particle size: 20 μm)

(Evaluation of warpage condition)
Using the prepared curable resin composition, an evaluation package (15 mm × 15 mm, sealing thickness: 350 mm, overall thickness: 440 mm) on which a chip having a thickness of 9 mm × 9 mm and a thickness of 150 um was mounted was prepared. After performing post-cure at 175 ° C. for 5 hours, it is placed in a heating device and the temperature inside the device is raised from 30 ° C. (heating rate 10 ° C./25 seconds) to 260 ° C. and then up to 30 ° C. A test for lowering the temperature (lowering speed: 10 ° C./25 seconds) was carried out, and the state of warpage of the evaluation package at 260 ° C. and the maximum height (μm) of the warp from the ground plane were examined. Table 1 shows the results as a negative value for the maximum height when the smile type warp is generated and a positive value for the maximum height when the criy type warp is generated.

As shown in the results of Table 1, the package of the example using the curable resin composition having a triphenylphosphine oxide content of 0.3% by mass or more is a smile when the heat treatment temperature reaches 260 ° C. The mold was warped.
From the above, it was found that by using a curable resin composition having a triphenylphosphine oxide content of 0.3% by mass or more, a smile-type warp can be generated at the time of joining the packages.

Claims (1)

The step of joining the first package containing the cured product of the curable resin composition and the second package is included, and the joining includes a warped state of the first package and a warped state of the second package. Is done under the conditions that match
The curable resin composition contains a curable resin component containing an epoxy resin and a curing agent, triphenylphosphine oxide, and a filler, and the content of the triphenylphosphine oxide is the curable resin composition. A method for manufacturing an electronic component device, which is 0.3% by mass or more of the above.