JP7275528B2 - ELECTRONIC COMPONENT DEVICE, SEALING MATERIAL AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE - Google Patents
ELECTRONIC COMPONENT DEVICE, SEALING MATERIAL AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE Download PDFInfo
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- JP7275528B2 JP7275528B2 JP2018201782A JP2018201782A JP7275528B2 JP 7275528 B2 JP7275528 B2 JP 7275528B2 JP 2018201782 A JP2018201782 A JP 2018201782A JP 2018201782 A JP2018201782 A JP 2018201782A JP 7275528 B2 JP7275528 B2 JP 7275528B2
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- electronic component
- resin
- component device
- inorganic filler
- sealing material
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- 239000003566 sealing material Substances 0.000 title claims description 39
- 238000000034 method Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 49
- 239000011256 inorganic filler Substances 0.000 claims description 49
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 49
- 229920000647 polyepoxide Polymers 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 31
- 239000011810 insulating material Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 230000009974 thixotropic effect Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 description 37
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- 239000011347 resin Substances 0.000 description 36
- -1 aromatic aldehyde compounds Chemical class 0.000 description 26
- 239000002245 particle Substances 0.000 description 26
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- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 24
- 239000008393 encapsulating agent Substances 0.000 description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 16
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 11
- 239000007983 Tris buffer Substances 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
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- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
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- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- VTWDKFNVVLAELH-UHFFFAOYSA-N 2-methylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=CC1=O VTWDKFNVVLAELH-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
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- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 4
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- 229940005561 1,4-benzoquinone Drugs 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
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- 244000043261 Hevea brasiliensis Species 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
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- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 2
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- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
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- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
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- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
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- 229910052726 zirconium Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- QJIMTLTYXBDJFC-UHFFFAOYSA-N (4-methylphenyl)-diphenylphosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QJIMTLTYXBDJFC-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- FQJZPYXGPYJJIH-UHFFFAOYSA-N 1-bromonaphthalen-2-ol Chemical compound C1=CC=CC2=C(Br)C(O)=CC=C21 FQJZPYXGPYJJIH-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
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- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- OWWNFGGOZYTYQL-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)cyclohex-3-ene-1-carboxylic acid Chemical compound OC(=O)C1CCC=CC1C(=O)OCC1OC1 OWWNFGGOZYTYQL-UHFFFAOYSA-N 0.000 description 1
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- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
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Images
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本発明は、電子部品装置、封止材及び電子部品装置の製造方法に関する。 The present invention relates to an electronic component device, a sealing material, and a method for manufacturing an electronic component device.
半導体素子と基板とが電気的に接続された電子部品装置の構造として、半導体素子と基板とをワイヤを介して接続するワイヤボンディング構造と呼ばれるものがある。ワイヤボンディング構造においては一般に、半導体素子と、基板と、これらを電気的に接続しているワイヤとを封止材と呼ばれる材料で封止することにより、電子部品装置を形成する。封止材は通常、樹脂、無機充填材等の電気絶縁性に優れる材料から構成されている。 As a structure of an electronic component device in which a semiconductor element and a substrate are electrically connected, there is a structure called a wire bonding structure in which the semiconductor element and the substrate are connected via a wire. Generally, in the wire bonding structure, an electronic component device is formed by encapsulating a semiconductor element, a substrate, and wires electrically connecting them with a material called an encapsulant. The encapsulating material is usually made of a material with excellent electrical insulation such as a resin or an inorganic filler.
近年の電子部品装置の高出力化、高密度化等の進展に伴い、電子部品装置の発熱量が増大する傾向にある。そのため、電子部品装置の放熱性を高めるために封止材の熱伝導性の向上が求められている。例えば、特許文献１には、熱伝導性を高めるために無機充填材の６０体積％以上をアルミナとした封止用エポキシ樹脂組成物が記載されている。
2. Description of the Related Art In recent years, the amount of heat generated by electronic component devices tends to increase with the development of higher output and higher density of electronic component devices. Therefore, in order to improve the heat dissipation of the electronic component device, it is required to improve the thermal conductivity of the encapsulant. For example,
熱伝導性と電気絶縁性に優れる無機充填材を封止材に用いる従来の手法では、電気絶縁性の確保を前提としているため採用する材料の選択肢が限られており、熱伝導性のさらなる向上に限界がある。 In the conventional method of using an inorganic filler with excellent thermal conductivity and electrical insulation as a sealing material, the selection of materials to be used is limited because it is premised on ensuring electrical insulation, and thermal conductivity is further improved. has a limit.
上記事情に鑑み、本発明の一態様は、熱伝導性に優れる電子部品装置、熱伝導性に優れる電子部品装置の製造に用いるための封止材、及び熱伝導性に優れる電子部品装置の製造方法を提供することを目的とする。 In view of the above circumstances, one aspect of the present invention provides an electronic component device with excellent thermal conductivity, a sealing material for use in manufacturing the electronic component device with excellent thermal conductivity, and the manufacture of the electronic component device with excellent thermal conductivity. The purpose is to provide a method.
上記課題を解決するための手段には、以下の実施態様が含まれる。
＜１＞電子回路と、前記電子回路の周囲に配置される絶縁部と、前記絶縁部の周囲に配置され、無機充填材を含む封止部と、を備え、前記無機充填材が金属成分を含む、電子部品装置。
＜２＞前記電子回路は、半導体素子と基板とを接続する接続部材である、＜１＞に記載の電子部品装置。
＜３＞無機充填材を含み、前記無機充填材が金属成分を含む、封止材。
＜４＞＜１＞又は＜２＞に記載の電子部品装置の前記封止部を形成するための、＜３＞に記載の封止材。
＜５＞樹脂成分をさらに含む、＜３＞又は＜４＞に記載の封止材。
＜６＞電子回路の周囲に絶縁材を付与して絶縁部を形成する工程と、前記絶縁部の周囲に封止材を付与して封止部を形成する工程と、を有し、前記封止材は無機充填材を含み、前記無機充填材が金属成分を含む、電子部品装置の製造方法。
Means for solving the above problems include the following embodiments.
<1> An electronic circuit, an insulating portion arranged around the electronic circuit, and a sealing portion arranged around the insulating portion and containing an inorganic filler, wherein the inorganic filler contains a metal component electronic device, including;
<2> The electronic component device according to <1>, wherein the electronic circuit is a connection member that connects a semiconductor element and a substrate.
<3> A sealing material containing an inorganic filler, wherein the inorganic filler contains a metal component.
<4> The sealing material according to <3>, for forming the sealing portion of the electronic component device according to <1> or <2>.
<5> The sealing material according to <3> or <4>, further comprising a resin component.
<6> A step of applying an insulating material around an electronic circuit to form an insulating portion; and a step of applying a sealing material around the insulating portion to form a sealing portion; A method of manufacturing an electronic component device, wherein the sealing material contains an inorganic filler, and the inorganic filler contains a metal component.
本発明の一態様によれば、熱伝導性に優れる電子部品装置、熱伝導性に優れる電子部品装置の製造に用いるための封止材、及び熱伝導性に優れる電子部品装置の製造方法が提供される。 According to one aspect of the present invention, an electronic component device with excellent thermal conductivity, a sealing material for use in manufacturing an electronic component device with excellent thermal conductivity, and a method for manufacturing an electronic component device with excellent thermal conductivity are provided. be done.
以下、本発明を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。 DETAILED DESCRIPTION OF THE INVENTION Embodiments for carrying out the present invention will be described in detail below. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps and the like) are not essential unless otherwise specified. The same applies to numerical values and their ranges, which do not limit the present invention.
本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
本開示において「～」を用いて示された数値範囲には、「～」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。
In the present disclosure, the term "process" includes a process that is independent of other processes, and even if the purpose of the process is achieved even if it cannot be clearly distinguished from other processes. .
In the present disclosure, the numerical range indicated using "-" includes the numerical values before and after "-" as the minimum and maximum values, respectively.
In the numerical ranges described step by step in the present disclosure, the upper limit or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described step by step. . Moreover, in the numerical ranges described in the present disclosure, the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
In the present disclosure, each component may contain multiple types of applicable substances. When there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition unless otherwise specified. means quantity.
Particles corresponding to each component in the present disclosure may include a plurality of types. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.
＜電子部品装置＞
本開示の電子部品装置は、電子回路と、前記電子回路の周囲に配置される絶縁部と、前記絶縁部の周囲に配置され、無機充填材を含む封止部と、を備え、前記無機充填材が金属成分を含む、電子部品装置である。
<Electronic parts equipment>
An electronic component device of the present disclosure includes an electronic circuit, an insulating portion arranged around the electronic circuit, and a sealing portion arranged around the insulating portion and containing an inorganic filler, wherein the inorganic filler An electronic component device, wherein the material includes a metal component.
上記構成を有する電子部品装置は、電子回路の周囲に配置される絶縁部によって電子回路が絶縁されているため、電子回路と封止部の接触によるショート等の不具合を回避できる。このため、封止部に金属等の導電性に優れる材料を採用することができ、従来の絶縁性の封止材では達成できないような熱伝導性の大幅な向上を実現できる。 In the electronic component device having the above configuration, since the electronic circuit is insulated by the insulating portion arranged around the electronic circuit, it is possible to avoid problems such as short circuits due to contact between the electronic circuit and the sealing portion. Therefore, a material having excellent conductivity such as metal can be used for the sealing portion, and a large improvement in thermal conductivity, which cannot be achieved with conventional insulating sealing materials, can be realized.
さらに上記構成を有する電子部品装置では、電子回路の周囲に配置される絶縁部が電子回路の位置を固定する役割を果たす。このため、電子部品装置の製造工程において封止部を形成する材料の流動により生じる電子回路の位置ずれ（ワイヤ流れ）を抑制することができる。 Furthermore, in the electronic component device having the above configuration, the insulating portion arranged around the electronic circuit serves to fix the position of the electronic circuit. Therefore, it is possible to suppress displacement of the electronic circuit (wire drift) caused by flow of the material forming the sealing portion in the manufacturing process of the electronic component device.
電子部品装置における電子回路の形状は、特に制限されない。具体的には、素子と基板とを接続するワイヤ、バンプ等の接続部材が挙げられる。 The shape of the electronic circuit in the electronic component device is not particularly limited. Specifically, connection members such as wires and bumps for connecting the element and the substrate can be mentioned.
本開示の電子部品装置において、封止部は、無機充填材として金属成分を含むものであればその材質は特に制限されない。金属成分の種類は特に制限されず、電子部品装置の製造プロセス、所望の熱伝導性等に応じて選択できる。金属成分として具体的には、銅、金、銀、ニッケル、錫、パラジウム、アルミニウム、鉄、鉛、クロム等の金属、これらの金属を含む合金などが挙げられる。封止部に含まれる金属成分は、１種のみでも２種以上の組み合わせであってもよい。 In the electronic component device of the present disclosure, the material of the sealing portion is not particularly limited as long as it contains a metal component as an inorganic filler. The type of metal component is not particularly limited, and can be selected according to the manufacturing process of the electronic component device, the desired thermal conductivity, and the like. Specific examples of metal components include metals such as copper, gold, silver, nickel, tin, palladium, aluminum, iron, lead, and chromium, and alloys containing these metals. The metal components contained in the sealing portion may be of one type or a combination of two or more types.
封止部の成形性の観点からは、金属成分は粒子状（金属粒子）であることが好ましい。金属粒子の粒子径は、特に制限されない。例えば、０．２μｍ～１００μｍであることが好ましく、０．５μｍ～５０μｍであることがより好ましい。粒子径が０．２μｍ以上であると、封止部における金属成分の分散性に優れる傾向にある。粒子径が１００μｍ以下であると、封止部における金属成分の分布の偏りが抑制される傾向にある。 From the viewpoint of moldability of the sealing portion, the metal component is preferably particulate (metal particles). The particle size of the metal particles is not particularly limited. For example, it is preferably 0.2 μm to 100 μm, more preferably 0.5 μm to 50 μm. When the particle size is 0.2 μm or more, the dispersibility of the metal component in the sealing portion tends to be excellent. When the particle size is 100 μm or less, the uneven distribution of the metal component in the sealing portion tends to be suppressed.
本開示において金属粒子の粒子径は、レーザー回折式粒度分布測定装置を用いて得られる体積基準の粒度分布において小径側からの累積が５０％となるときの粒子径（体積平均粒子径、Ｄ５０％）を意味する。 In the present disclosure, the particle diameter of the metal particles is the particle diameter when the accumulation from the small diameter side is 50% in the volume-based particle size distribution obtained using a laser diffraction particle size distribution analyzer (volume average particle diameter, D50% ).
封止材に含まれる無機充填材において、金属成分の占める割合は、特に制限されない。例えば、無機充填材全体の１０体積％～１００体積％であってもよく、５０体積％～１００体積％であってもよく、７５体積％～１００体積％であってもよい。 The proportion of the metal component in the inorganic filler contained in the sealing material is not particularly limited. For example, it may be 10% to 100% by volume, 50% to 100% by volume, or 75% to 100% by volume of the total inorganic filler.
封止部中の無機充填材の含有率は、特に制限されない。熱伝導性の向上効果と他の成分とのバランスの観点からは、封止部全体の５０体積％～８５体積％であることが好ましく、６０体積％～８３体積％であることがより好ましく、７０体積％～８０体積％であることがさらに好ましい。 The content of the inorganic filler in the sealing portion is not particularly limited. From the viewpoint of the balance between the effect of improving thermal conductivity and other components, it is preferably 50% to 85% by volume, more preferably 60% to 83% by volume, of the entire sealing portion. It is more preferably 70% by volume to 80% by volume.
封止部は、樹脂の硬化物をさらに含むものであってもよい。すなわち、封止部は無機充填材と樹脂成分を含む材料の硬化物であってもよい。以下、封止部の形成に用いる材料を「封止材」とも称する。封止材の詳細については、後述する。 The sealing portion may further include a cured resin. That is, the sealing portion may be a cured material containing an inorganic filler and a resin component. Hereinafter, the material used for forming the sealing portion is also referred to as "sealing material". Details of the sealing material will be described later.
本開示の電子部品装置において、絶縁部は、電子回路を電気的に絶縁しうるものであればその材質は特に制限されない。絶縁性の観点からは、絶縁部は、樹脂の硬化物を含むものであってもよい。すなわち、絶縁部は樹脂成分を含む材料の硬化物であってもよい。以下、絶縁部の形成に用いる材料を「絶縁材」とも称する。絶縁材の詳細については、後述する。 In the electronic component device of the present disclosure, the material of the insulating portion is not particularly limited as long as it can electrically insulate the electronic circuit. From the viewpoint of insulation, the insulating portion may contain a cured resin. That is, the insulating portion may be a cured material containing a resin component. Hereinafter, the material used for forming the insulating portion is also referred to as "insulating material". Details of the insulating material will be described later.
以下、図面を参照して本開示の電子部品装置について説明する。ただし、本開示は図面に記載された態様に限定されるものではない。また、図中に示す各部材の大きさは概念的なものであり、部材間の大きさの相対的な関係はこれに限定されない。 The electronic component device of the present disclosure will be described below with reference to the drawings. However, the present disclosure is not limited to the embodiments illustrated in the drawings. Also, the size of each member shown in the drawings is conceptual, and the relative size relationship between the members is not limited to this.
図１は、本開示の電子部品装置の一実施形態の概略断面図である。図１に示す電子部品装置１は、基板２と、素子３と、基板２と素子３とを接続する電子回路４と、を備えている。さらに電子回路４の周囲に絶縁部５が配置され、絶縁部５の周囲に無機充填材７を含む封止部６が配置されている。
FIG. 1 is a schematic cross-sectional view of one embodiment of an electronic component device of the present disclosure. An
本開示の電子部品装置は、絶縁部５によって電子回路４が絶縁されているため、絶縁部５の周囲に配置される封止部６が無機充填材７として金属成分を含んでいても、電子回路４と封止部５の接触が回避され、ショート等の不具合を回避できる。さらに、電子回路４の周囲に配置される絶縁部５が電子回路４の位置を固定する役割を果たすため、電子部品装置１の製造工程において封止部６を形成する材料の流動により生じる電子回路４の位置ずれ（ワイヤ流れ）を抑制することができる。
In the electronic component device of the present disclosure, since the
＜封止材＞
本開示の封止材は、無機充填材を含み、前記無機充填材が金属成分を含む封止材である。本開示の封止材は、上述した電子部品装置の封止部を形成するための封止材であってもよい。
<Sealant>
The encapsulant of the present disclosure contains an inorganic filler, and the inorganic filler contains a metal component. The sealing material of the present disclosure may be a sealing material for forming the sealing portion of the electronic component device described above.
封止材に含まれる金属成分の詳細及び好ましい態様は、上述した封止部に含まれる金属成分の詳細及び好ましい態様と同様である。
封止材中の無機充填材の含有率は、特に制限されない。熱伝導性の向上効果と他の成分とのバランスの観点からは、封止材の固形分全体の５０体積％～８５体積％であることが好ましく、６０体積％～８３体積％であることがより好ましく、７０体積％～８０体積％であることがさらに好ましい。
The details and preferred aspects of the metal component contained in the sealing material are the same as the details and preferred aspects of the metal component contained in the sealing portion described above.
The content of the inorganic filler in the sealing material is not particularly limited. From the viewpoint of the effect of improving thermal conductivity and the balance with other components, it is preferably 50% to 85% by volume, more preferably 60% to 83% by volume, of the total solid content of the sealing material. More preferably, it is 70% by volume to 80% by volume.
封止部の成形性の観点からは、封止材は樹脂成分を含むことが好ましく、封止部の強度及び耐熱性の観点からは、封止材は樹脂成分として熱硬化性樹脂を含むことが好ましい。熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂等が挙げられる。本開示では、エポキシ基を含有するアクリル樹脂等の、熱可塑性と熱硬化性の両方の性質を示すものは「熱硬化性樹脂」に含めるものとする。封止材に含まれる樹脂成分は、１種であっても２種以上であってもよい。 From the viewpoint of moldability of the sealing portion, the sealing material preferably contains a resin component, and from the viewpoint of the strength and heat resistance of the sealing portion, the sealing material should contain a thermosetting resin as a resin component. is preferred. Thermosetting resins include epoxy resins, phenol resins, urea resins, melamine resins, urethane resins, silicone resins, unsaturated polyester resins, and the like. For the purposes of this disclosure, "thermosetting resins" includes those that exhibit both thermoplastic and thermosetting properties, such as acrylic resins containing epoxy groups. The resin component contained in the encapsulant may be one kind or two or more kinds.
封止材は、樹脂成分としてエポキシ樹脂を含むことが好ましい。エポキシ樹脂として具体的には、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも１種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したものであるノボラック型エポキシ樹脂（フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等）；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したものであるトリフェニルメタン型エポキシ樹脂；上記フェノール化合物及びナフトール化合物と、アルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化したものである共重合型エポキシ樹脂；ビスフェノールＡ、ビスフェノールＦ等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂；アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂；スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂；ビスフェノールＳ等のジグリシジルエーテルである硫黄原子含有エポキシ樹脂；ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂；フタル酸、イソフタル酸、テトラヒドロフタル酸等の多価カルボン酸化合物のグリシジルエステルであるグリシジルエステル型エポキシ樹脂；アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したものであるグリシジルアミン型エポキシ樹脂；ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したものであるジシクロペンタジエン型エポキシ樹脂；分子内のオレフィン結合をエポキシ化したものであるビニルシクロヘキセンジエポキシド、３，４－エポキシシクロヘキシルメチル－３，４－エポキシシクロヘキサンカルボキシレート、２－（３，４－エポキシ）シクロヘキシル－５，５－スピロ（３，４－エポキシ）シクロヘキサン－ｍ－ジオキサン等の脂環型エポキシ樹脂；パラキシリレン変性フェノール樹脂のグリシジルエーテルであるパラキシリレン変性エポキシ樹脂；メタキシリレン変性フェノール樹脂のグリシジルエーテルであるメタキシリレン変性エポキシ樹脂；テルペン変性フェノール樹脂のグリシジルエーテルであるテルペン変性エポキシ樹脂；ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるジシクロペンタジエン変性エポキシ樹脂；シクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるシクロペンタジエン変性エポキシ樹脂；多環芳香環変性フェノール樹脂のグリシジルエーテルである多環芳香環変性エポキシ樹脂；ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂；ハロゲン化フェノールノボラック型エポキシ樹脂；ハイドロキノン型エポキシ樹脂；トリメチロールプロパン型エポキシ樹脂；オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂；フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂をエポキシ化したものであるアラルキル型エポキシ樹脂；などが挙げられる。さらにはアクリル樹脂のエポキシ化物等もエポキシ樹脂として挙げられる。これらのエポキシ樹脂は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 The sealing material preferably contains an epoxy resin as a resin component. Specifically, the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. A novolak type epoxy resin (phenol novolak type epoxy resins, ortho-cresol novolac-type epoxy resins, etc.); triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde in the presence of acidic catalysts as epoxy resins. a triphenylmethane-type epoxy resin obtained by epoxidizing a triphenylmethane-type epoxy resin; a copolymer-type epoxy resin obtained by epoxidizing a novolak resin obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound in the presence of an acidic catalyst; bisphenol A, diphenylmethane-type epoxy resins that are diglycidyl ethers such as bisphenol F; biphenyl-type epoxy resins that are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins that are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins that are diglycidyl ethers such as S; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; polyvalent carboxylic acid compounds such as phthalic acid, isophthalic acid and tetrahydrophthalic acid Glycidyl ester type epoxy resin which is a glycidyl ester of; aniline, diaminodiphenylmethane, glycidyl amine type epoxy resin in which the active hydrogen bonded to the nitrogen atom of isocyanuric acid is substituted with a glycidyl group; dicyclopentadiene type epoxy resins obtained by epoxidizing condensation resins; vinylcyclohexene diepoxides obtained by epoxidizing intramolecular olefin bonds, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, Alicyclic epoxy resins such as 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane; paraxylylene-modified epoxy resins that are glycidyl ethers of paraxylylene-modified phenol resins; Metaxylylene-modified epoxy resin that is a glycidyl ether of meta-xylylene-modified phenolic resin; Terpene-modified epoxy resin that is a glycidyl ether of a terpene-modified phenolic resin; Dicyclopentadiene-modified epoxy resin that is a glycidyl ether of a dicyclopentadiene-modified phenolic resin; Cyclopentadiene-modified phenol Cyclopentadiene-modified epoxy resin that is a glycidyl ether of a resin; Polycyclic aromatic ring-modified epoxy resin that is a glycidyl ether of a polycyclic aromatic ring-modified phenol resin; Naphthalene-type epoxy resin that is a glycidyl ether of a naphthalene ring-containing phenol resin; Halogenated phenol Novolak type epoxy resin; hydroquinone type epoxy resin; trimethylolpropane type epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefin bond with peracid such as peracetic acid; aralkyl type such as phenol aralkyl resin and naphthol aralkyl resin aralkyl type epoxy resins obtained by epoxidizing phenolic resins; and the like. Further examples of epoxy resins include epoxidized acrylic resins and the like. These epoxy resins may be used singly or in combination of two or more.
エポキシ樹脂のエポキシ当量（分子量／エポキシ基数）は、特に制限されない。成形性、耐リフロー性及び電気的信頼等の各種特性バランスの観点からは、１００ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、１５０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 g/eq to 1000 g/eq, more preferably 150 g/eq to 500 g/eq.
エポキシ樹脂のエポキシ当量は、ＪＩＳ Ｋ ７２３６：２００９に準じた方法で測定される値とする。 Let the epoxy equivalent of an epoxy resin be the value measured by the method according to JISK7236:2009.
エポキシ樹脂が常温（２５℃）で固体の場合、その軟化点は特に制限されない。成形性と耐リフロー性の観点からは４０℃～１８０℃であることが好ましく、封止材の調製の際の取扱い性の観点からは５０℃～１３０℃であることがより好ましい。 If the epoxy resin is solid at room temperature (25° C.), its softening point is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40° C. to 180° C., and from the viewpoint of handleability in preparation of the sealing material, it is more preferably 50° C. to 130° C.
エポキシ樹脂の軟化点は、ＪＩＳ Ｋ ７２３４：１９８６に準じた方法で測定される値とする。 Let the softening point of an epoxy resin be the value measured by the method according to JISK7234:1986.
封止材中のエポキシ樹脂の含有率は、強度、流動性、耐熱性、成形性等の観点から０．５質量％～５０質量％であることが好ましく、２質量％～３０質量％であることがより好ましい。 The content of the epoxy resin in the sealing material is preferably 0.5% to 50% by mass, more preferably 2% to 30% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc. is more preferable.
（硬化剤）
封止材は、樹脂成分として硬化物を含んでいてもよい。硬化剤は、併用する樹脂と硬化反応を生じるものであれば特に制限されない。エポキシ樹脂と併用する硬化剤としては、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、ブロックイソシアネート硬化剤等が挙げられる。硬化性及びポットライフの両立の観点からはフェノール硬化剤、アミン硬化剤及び酸無水物硬化剤からなる群より選択される少なくとも１種が好ましく、電気的信頼性の観点からはフェノール硬化剤がより好ましい。
(curing agent)
The sealing material may contain a cured product as a resin component. The curing agent is not particularly limited as long as it causes a curing reaction with the resin used in combination. Curing agents used in combination with epoxy resins include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like. At least one selected from the group consisting of phenol curing agents, amine curing agents and acid anhydride curing agents is preferable from the viewpoint of compatibility between curability and pot life, and phenol curing agents are more preferable from the viewpoint of electrical reliability. preferable.
フェノール硬化剤として具体的には、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、置換又は非置換のビフェノール等の多価フェノール化合物；フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、フェニルフェノール、アミノフェノール等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも一種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等のアルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂；上記フェノール性化合物と、ジメトキシパラキシレン、ビス（メトキシメチル）ビフェニル等とから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂；パラキシリレン変性フェノール樹脂、メタキシリレン変性フェノール樹脂；メラミン変性フェノール樹脂；テルペン変性フェノール樹脂；上記フェノール性化合物と、ジシクロペンタジエンとから共重合により合成されるジシクロペンタジエン型フェノール樹脂及びジシクロペンタジエン型ナフトール樹脂；シクロペンタジエン変性フェノール樹脂；多環芳香環変性フェノール樹脂；ビフェニル型フェノール樹脂；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂；これら２種以上を共重合して得たフェノール樹脂などが挙げられる。これらのフェノール硬化剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 Specific examples of phenol curing agents include polyhydric phenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol , at least one phenolic compound selected from the group consisting of phenolic compounds such as aminophenol and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene, and an aldehyde compound such as formaldehyde, acetaldehyde and propionaldehyde with an acidic catalyst. Novolac type phenolic resins obtained by condensation or cocondensation under the following conditions; aralkyl type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, etc. ; para-xylylene-modified phenolic resin, meta-xylylene-modified phenolic resin; melamine-modified phenolic resin; terpene-modified phenolic resin; Resin; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type phenolic resin; and triphenylmethane type phenol resins obtained by copolymerizing two or more of these phenol resins. These phenol curing agents may be used singly or in combination of two or more.
硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、７０ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、８０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 The functional group equivalent weight of the curing agent (hydroxyl group equivalent weight in the case of a phenol curing agent) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g/eq to 1000 g/eq, more preferably 80 g/eq to 500 g/eq.
硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、ＪＩＳ Ｋ ００７０：１９９２に準じた方法により測定される値とする。 The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenolic curing agent) is a value measured by a method according to JIS K 0070:1992.
硬化剤が常温（２５℃）で固体の場合、その軟化点は特に制限されない。成形性と耐リフロー性の観点からは、４０℃～１８０℃であることが好ましく、封止材の製造時における取扱い性の観点からは、５０℃～１３０℃であることがより好ましい。 If the curing agent is solid at room temperature (25°C), its softening point is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40° C. to 180° C., and from the viewpoint of handleability during production of the sealing material, it is more preferably 50° C. to 130° C.
硬化剤の軟化点は、エポキシ樹脂の軟化点と同様にして測定される値とする。 The softening point of the curing agent is a value measured in the same manner as the softening point of the epoxy resin.
エポキシ樹脂と硬化剤の当量比、すなわちエポキシ樹脂中の官能基数に対する硬化剤中の官能基数の比（硬化剤中の官能基数／エポキシ樹脂中の官能基数）は、特に制限されない。それぞれの未反応分を少なく抑える観点からは、０．５～２．０の範囲に設定されることが好ましく、０．６～１．３の範囲に設定されることがより好ましい。成形性と耐リフロー性の観点からは、０．８～１．２の範囲に設定されることがさらに好ましい。 The equivalent ratio of the epoxy resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent/number of functional groups in the epoxy resin) is not particularly limited. From the viewpoint of suppressing the unreacted amount of each, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set the ratio in the range of 0.8 to 1.2.
（硬化促進剤）
封止材は、硬化促進剤を含んでもよい。硬化促進剤の種類は特に制限されず、併用する樹脂の種類、封止材の所望の特性等に応じて選択できる。
(Curing accelerator)
The encapsulant may contain a curing accelerator. The type of curing accelerator is not particularly limited, and can be selected according to the type of resin used in combination, the desired properties of the encapsulant, and the like.
硬化促進剤として具体的には、１，５－ジアザビシクロ［４．３．０］ノネン－５（ＤＢＮ）、１，８－ジアザビシクロ［５．４．０］ウンデセン－７（ＤＢＵ）等のジアザビシクロアルケン、２－メチルイミダゾール、２－フェニルイミダゾール、２－フェニル－４－メチルイミダゾール、２－ヘプタデシルイミダゾール等の環状アミジン化合物；前記環状アミジン化合物の誘導体；前記環状アミジン化合物又はその誘導体のフェノールノボラック塩；これらの化合物に無水マレイン酸、１，４－ベンゾキノン、２，５－トルキノン、１，４－ナフトキノン、２，３－ジメチルベンゾキノン、２，６－ジメチルベンゾキノン、２，３－ジメトキシ－５－メチル－１，４－ベンゾキノン、２，３－ジメトキシ－１，４－ベンゾキノン、フェニル－１，４－ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；ＤＢＵのテトラフェニルボレート塩、ＤＢＮのテトラフェニルボレート塩、２－エチル－４－メチルイミダゾールのテトラフェニルボレート塩、Ｎ－メチルモルホリンのテトラフェニルボレート塩等の環状アミジニウム化合物；ピリジン、トリエチルアミン、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス（ジメチルアミノメチル）フェノール等の三級アミン化合物；前記三級アミン化合物の誘導体；酢酸テトラ－ｎ－ブチルアンモニウム、リン酸テトラ－ｎ－ブチルアンモニウム、酢酸テトラエチルアンモニウム、安息香酸テトラ－ｎ－ヘキシルアンモニウム、水酸化テトラプロピルアンモニウム等のアンモニウム塩化合物；トリフェニルホスフィン、ジフェニル（ｐ－トリル）ホスフィン、トリス（アルキルフェニル）ホスフィン、トリス（アルコキシフェニル）ホスフィン、トリス（アルキル・アルコキシフェニル）ホスフィン、トリス（ジアルキルフェニル）ホスフィン、トリス（トリアルキルフェニル）ホスフィン、トリス（テトラアルキルフェニル）ホスフィン、トリス（ジアルコキシフェニル）ホスフィン、トリス（トリアルコキシフェニル）ホスフィン、トリス（テトラアルコキシフェニル）ホスフィン、トリアルキルホスフィン、ジアルキルアリールホスフィン、アルキルジアリールホスフィン等の三級ホスフィン；前記三級ホスフィンと有機ボロン類との錯体等のホスフィン化合物；前記三級ホスフィン又は前記ホスフィン化合物と無水マレイン酸、１，４－ベンゾキノン、２，５－トルキノン、１，４－ナフトキノン、２，３－ジメチルベンゾキノン、２，６－ジメチルベンゾキノン、２，３－ジメトキシ－５－メチル－１，４－ベンゾキノン、２，３－ジメトキシ－１，４－ベンゾキノン、フェニル－１，４－ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；前記三級ホスフィン又は前記ホスフィン化合物と４－ブロモフェノール、３－ブロモフェノール、２－ブロモフェノール、４－クロロフェノール、３－クロロフェノール、２－クロロフェノール、４－ヨウ化フェノール、３－ヨウ化フェノール、２－ヨウ化フェノール、４－ブロモ－２－メチルフェノール、４－ブロモ－３－メチルフェノール、４－ブロモ－２，６－ジメチルフェノール、４－ブロモ－３，５－ジメチルフェノール、４－ブロモ－２，６－ジ－ｔｅｒｔ－ブチルフェノール、４－クロロ－１－ナフトール、１－ブロモ－２－ナフトール、６－ブロモ－２－ナフトール、４－ブロモ－４’－ヒドロキシビフェニル等のハロゲン化フェノール化合物を反応させた後に、脱ハロゲン化水素の工程を経て得られる、分子内分極を有する化合物；テトラフェニルホスホニウム等のテトラ置換ホスホニウム、テトラ－ｐ－トリルボレート等のホウ素原子に結合したフェニル基がないテトラ置換ホスホニウム及びテトラ置換ボレート；テトラフェニルホスホニウムとフェノール化合物との塩などが挙げられる。 Specific examples of curing accelerators include diaza such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU). Cyclic amidine compounds such as bicycloalkene, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolacs of the cyclic amidine compounds or derivatives thereof Salt; These compounds contain maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5- quinone compounds such as methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone and phenyl-1,4-benzoquinone; intramolecular compounds having π bonds such as diazophenylmethane compounds with polarization; cyclic amidinium compounds such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, tetraphenylborate salt of N-methylmorpholine; pyridine, Tertiary amine compounds such as triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; derivatives of the tertiary amine compounds; tetra-n-butylammonium acetate, tetraphosphate - Ammonium salt compounds such as n-butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris (alkoxyphenyl)phosphine, tris(alkyl/alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxy) tertiary phosphines such as phenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine and alkyldiarylphosphine; phosphine compounds such as complexes of the tertiary phosphine and organic borons; The phosphine compound and maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl- quinone compounds such as 1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone and phenyl-1,4-benzoquinone; compound; the tertiary phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodinated phenol, 3- iodinated phenol, 2-iodinated phenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, Halogens such as 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4'-hydroxybiphenyl Compounds having intramolecular polarization obtained through the step of dehydrohalogenation after reacting a phenolic compound; tetra-substituted phosphoniums and tetra-substituted borates with no groups; salts of tetraphenylphosphoniums with phenolic compounds; and the like.
封止材が硬化促進剤を含む場合、その量は、樹脂成分１００質量部に対して０．１質量部～３０質量部であることが好ましく、１質量部～１５重量部であることがより好ましい。硬化促進剤の量が樹脂成分１００質量部に対して０．１質量部以上であると、短時間で良好に硬化する傾向にある。硬化促進剤の量が樹脂成分１００質量部に対して３０質量部以下であると、硬化速度が速すぎず良好な成形品が得られる傾向にある。 When the encapsulant contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass with respect to 100 parts by mass of the resin component. preferable. When the amount of the curing accelerator is 0.1 parts by mass or more with respect to 100 parts by mass of the resin component, there is a tendency for satisfactory curing in a short period of time. When the amount of the curing accelerator is 30 parts by mass or less with respect to 100 parts by mass of the resin component, the curing speed is not too fast and a good molded article tends to be obtained.
（金属成分以外の無機充填材）
封止材は、金属成分以外の無機充填材を含有してもよい。
金属成分以外の無機充填材として具体的には、溶融シリカ、結晶シリカ、ガラス、アルミナ、炭酸カルシウム、ケイ酸ジルコニウム、ケイ酸カルシウム、窒化珪素、窒化アルミ、窒化ホウ素、ベリリア、ジルコニア、ジルコン、フォステライト、ステアタイト、スピネル、ムライト、チタニア、タルク、クレー、マイカ等が挙げられる。難燃効果を有する無機充填材を用いてもよい。難燃効果を有する無機充填材としては、水酸化アルミニウム、水酸化マグネシウム、マグネシウムと亜鉛の複合水酸化物等の複合金属水酸化物、硼酸亜鉛などが挙げられる。
(Inorganic filler other than metal components)
The sealing material may contain an inorganic filler other than the metal component.
Specific examples of inorganic fillers other than metal components include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, and phosphor. Stellite, steatite, spinel, mullite, titania, talc, clay, mica and the like. Inorganic fillers having a flame retardant effect may also be used. Inorganic fillers having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxides of magnesium and zinc, and zinc borate.
金属成分以外の無機充填材の中でも、線膨張係数低減の観点からは溶融シリカ等のシリカが好ましく、高熱伝導性の観点からはアルミナが好ましい。金属成分以外の無機充填材は１種を単独で用いても２種以上を組み合わせて用いてもよい。 Among inorganic fillers other than metal components, silica such as fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferred from the viewpoint of high thermal conductivity. Inorganic fillers other than metal components may be used singly or in combination of two or more.
金属成分以外の無機充填材が粒子状である場合、その粒子径は特に制限されない。例えば、粒子径が０．２μｍ～１００μｍであることが好ましく、０．５μｍ～５０μｍであることがより好ましい。粒子径が０．２μｍ以上であると、封止材の粘度の上昇がより抑制される傾向がある。粒子径が１００μｍ以下であると、充填性がより向上する傾向にある。 When the inorganic filler other than the metal component is particulate, the particle size is not particularly limited. For example, the particle size is preferably 0.2 μm to 100 μm, more preferably 0.5 μm to 50 μm. When the particle size is 0.2 μm or more, the increase in viscosity of the sealing material tends to be more suppressed. When the particle size is 100 μm or less, the filling property tends to be further improved.
本開示において金属成分以外の無機充填材の粒子径は、金属粒子と同様にして測定される体積平均粒子径を意味する。 In the present disclosure, the particle size of inorganic fillers other than metal components means the volume average particle size measured in the same manner as metal particles.
（カップリング剤）
封止材は、カップリング剤を含んでもよい。カップリング剤として具体的には、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン等のシラン系化合物、チタン系化合物、アルミニウムキレート化合物、アルミニウム／ジルコニウム系化合物などの公知のカップリング剤が挙げられる。
(coupling agent)
The encapsulant may contain a coupling agent. Specific examples of coupling agents include known coupling agents such as silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium-based compounds, aluminum chelate compounds, and aluminum/zirconium-based compounds. is mentioned.
封止材がカップリング剤を含む場合、その量は、無機充填材１００質量部に対して０．０５質量部～５質量部であることが好ましく、０．１質量部～２．５質量部であることがより好ましい。カップリング剤の量が無機充填材１００質量部に対して０．０５質量部以上であると、フレームとの接着性がより向上する傾向にある。カップリング剤の量が無機充填材１００質量部に対して５質量部以下であると、パッケージの成形性がより向上する傾向にある。 When the sealing material contains a coupling agent, the amount thereof is preferably 0.05 parts by mass to 5 parts by mass with respect to 100 parts by mass of the inorganic filler, and 0.1 part by mass to 2.5 parts by mass. is more preferable. When the amount of the coupling agent is 0.05 parts by mass or more with respect to 100 parts by mass of the inorganic filler, the adhesion to the frame tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
（イオン交換体）
封止材は、イオン交換体を含んでもよい。イオン交換体として具体的には、ハイドロタルサイト化合物、並びにマグネシウム、アルミニウム、チタン、ジルコニウム及びビスマスからなる群より選ばれる少なくとも１種の元素の含水酸化物等が挙げられる。イオン交換体は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Ion exchanger)
The encapsulant may contain an ion exchanger. Specific examples of ion exchangers include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth. The ion exchangers may be used singly or in combination of two or more.
封止材がイオン交換体を含む場合、その量は、樹脂成分１００質量部に対して０．１質量部～３０質量部であることが好ましく、１質量部～１０質量部であることがより好ましい。 When the sealing material contains an ion exchanger, the amount thereof is preferably 0.1 to 30 parts by mass, more preferably 1 to 10 parts by mass, with respect to 100 parts by mass of the resin component. preferable.
（離型剤）
封止材は、離型剤を含んでもよい。離型剤として具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、モンタン酸エステル等のエステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Release agent)
The encapsulant may contain a release agent. Specific examples of the release agent include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. be done. The release agent may be used alone or in combination of two or more.
封止材が離型剤を含む場合、その量は、樹脂成分１００質量部に対して０．０１質量部～１０質量部であることが好ましく、０．１質量部～５質量部であることがより好ましい。 When the encapsulant contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the resin component. is more preferred.
（難燃剤）
封止材は、難燃剤を含んでもよい。難燃剤として具体的には、ハロゲン原子、アンチモン原子、窒素原子又はリン原子を含む有機又は無機の化合物、金属水酸化物等が挙げられる。難燃剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Flame retardants)
The encapsulant may contain a flame retardant. Specific examples of flame retardants include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, and metal hydroxides. A flame retardant may be used individually by 1 type, or may be used in combination of 2 or more type.
封止材が難燃剤を含む場合、その量は、所望の難燃効果を得るのに充分な量であれば特に制限されない。例えば、樹脂成分１００質量部に対して１質量部～３０質量部であることが好ましく、２質量部～２０質量部であることがより好ましい。 When the encapsulant contains a flame retardant, its amount is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect. For example, it is preferably 1 part by mass to 30 parts by mass, more preferably 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the resin component.
（着色剤）
封止材は、着色剤を含んでもよい。着色剤として具体的には、カーボンブラック、有機染料、有機顔料、酸化チタン、鉛丹、ベンガラ等が挙げられる。着色剤の含有量は目的等に応じて適宜選択できる。着色剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(coloring agent)
The encapsulant may contain a colorant. Specific examples of colorants include carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the coloring agent can be appropriately selected according to the purpose and the like. A coloring agent may be used individually by 1 type, or may be used in combination of 2 or more type.
（応力緩和剤）
封止材は、シリコーンオイル、シリコーンゴム粒子等の応力緩和剤を含んでもよい。応力緩和剤として具体的には、シリコーン系、スチレン系、オレフィン系、ウレタン系、ポリエステル系、ポリエーテル系、ポリアミド系、ポリブタジエン系等の熱可塑性エラストマー、ＮＲ（天然ゴム）、ＮＢＲ（アクリロニトリル－ブタジエンゴム）、アクリルゴム、ウレタンゴム、シリコーンパウダー等のゴム粒子、メタクリル酸メチル－スチレン－ブタジエン共重合体（ＭＢＳ）、メタクリル酸メチル－シリコーン共重合体、メタクリル酸メチル－アクリル酸ブチル共重合体等のコア－シェル構造を有するゴム粒子などが挙げられる。応力緩和剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。
(Stress relaxation agent)
The encapsulant may contain a stress relieving agent such as silicone oil or silicone rubber particles. Specific examples of stress relaxation agents include thermoplastic elastomers such as silicone, styrene, olefin, urethane, polyester, polyether, polyamide, and polybutadiene, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, rubber particles such as silicone powder, methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer, etc. and rubber particles having a core-shell structure. A stress relaxation agent may be used individually by 1 type, or may be used in combination of 2 or more type.
＜絶縁材＞
電子部品装置の絶縁部の形成に用いる絶縁材の状態は特に制限されず、電子部品装置及び電子回路の形状等に応じて選択できる。具体的には、ワイヤ状の電子回路を絶縁するワイヤコート材、バンプ状の電子回路を絶縁するアンダーフィル材等であってもよい。
<Insulating material>
The state of the insulating material used for forming the insulating portion of the electronic component device is not particularly limited, and can be selected according to the shape of the electronic component device and the electronic circuit. Specifically, a wire coating material for insulating wire-shaped electronic circuits, an underfill material for insulating bump-shaped electronic circuits, or the like may be used.
電子回路の位置ずれを抑制しながら電子回路の周囲に絶縁材を付与する観点からは、絶縁材は液状であることが好ましい。この場合、絶縁材は常温（２５℃）で液状であっても、常温では固体であって電子回路の周囲に付与する際の温度で液状になるものであってもよい。液状の絶縁材としては、例えば、液状の樹脂成分を含むものが挙げられる。 From the viewpoint of applying the insulating material around the electronic circuit while suppressing the positional displacement of the electronic circuit, the insulating material is preferably liquid. In this case, the insulating material may be liquid at room temperature (25° C.), or may be solid at room temperature and become liquid at the temperature at which it is applied around the electronic circuit. Examples of the liquid insulating material include those containing a liquid resin component.
絶縁材は、７５℃、せん断速度５ｓ－１で測定される粘度が３．０Ｐａ・ｓ以下であることが好ましく、２．０Ｐａ・ｓ以下であることがより好ましい。絶縁材の７５℃、せん断速度５ｓ－１での粘度が３．０Ｐａ・ｓ以下であると、絶縁材を電子回路の周囲に付与する際に、電子回路の位置ずれの発生が効果的に抑制される傾向にある。上記粘度の下限は特に制限されないが、電子回路の周囲に付与した状態を保持する観点からは、０．０１Ｐａ・ｓ以上であることが好ましい。 The insulating material preferably has a viscosity of 3.0 Pa·s or less, more preferably 2.0 Pa·s or less, measured at 75° C. and a shear rate of 5 s −1 . If the viscosity of the insulating material at 75 ° C. and a shear rate of 5 s -1 is 3.0 Pa s or less, the occurrence of misalignment of the electronic circuit when the insulating material is applied around the electronic circuit is effectively suppressed. tend to be Although the lower limit of the viscosity is not particularly limited, it is preferably 0.01 Pa·s or more from the viewpoint of maintaining the state of application to the periphery of the electronic circuit.
絶縁材は、２５℃、せん断速度１０ｓ－１で測定される粘度が３０Ｐａ・ｓ以下であることが好ましく、２０Ｐａ・ｓ以下であることがより好ましい。上記粘度の下限は特に制限されないが、ワイヤの周囲に付与した状態を保持する観点からは、０．１Ｐａ・ｓ以上であることが好ましい。 The insulating material preferably has a viscosity of 30 Pa·s or less, more preferably 20 Pa·s or less, measured at 25° C. and a shear rate of 10 s −1 . Although the lower limit of the viscosity is not particularly limited, it is preferably 0.1 Pa·s or more from the viewpoint of maintaining the state of application around the wire.
本開示において、絶縁材の２５℃での粘度はＥ型粘度計を用いて測定される値であり、７５℃での粘度はレオメータ（例えば、ＴＡインスツルメント社の商品名「ＡＲ２０００」）を用いて測定される値である。 In the present disclosure, the viscosity of the insulating material at 25 ° C. is a value measured using an E-type viscometer, and the viscosity at 75 ° C. is measured with a rheometer (for example, TA Instruments' product name "AR2000"). It is a value measured using
絶縁材の揺変指数は、用途（例えば、ワイヤコート材として用いるかアンダーフィル材として用いるか）、電子回路及び電子部品装置の状態等に応じて設定できる。例えば、７５℃での揺変指数が０．１～２．５であることが好ましい。 The thixotropic index of the insulating material can be set according to the application (for example, whether it is used as a wire coating material or an underfill material), the state of electronic circuits and electronic component devices, and the like. For example, it preferably has a thixotropic index at 75°C of 0.1 to 2.5.
絶縁材の７５℃での揺変指数は、７５℃、せん断速度５ｓ－１の条件で測定される粘度を粘度Ａとし、７５℃、せん断速度５０ｓ－１の条件で測定される粘度を粘度Ｂとしたとき、粘度Ａ／粘度Ｂの値として得られる。 The thixotropic index of the insulating material at 75°C is defined as viscosity A, which is the viscosity measured at 75°C and a shear rate of 5 s -1 , and viscosity B, which is the viscosity measured at 75°C and a shear rate of 50 s -1 . is obtained as a value of viscosity A/viscosity B.
絶縁材は、樹脂成分として熱硬化性樹脂を含むものであってよく、樹脂成分としてエポキシ樹脂及び硬化剤を含むものであってもよい。樹脂成分の種類は特に制限されず、封止材の成分として一般的に用いられるものから選択してもよい。 The insulating material may contain a thermosetting resin as a resin component, or may contain an epoxy resin and a curing agent as a resin component. The type of resin component is not particularly limited, and may be selected from those commonly used as components of encapsulants.
絶縁材は、必要に応じ、樹脂成分以外の成分として上述した封止材に含まれてもよい成分を含有してもよい。特に、絶縁部の強度及び放熱性の観点から、無機充填材を含むことが好ましい。絶縁材に含まれる無機充填材の種類は、特に制限されない。例えば、上述した封止材に含まれてもよい金属成分以外の無機充填材から選択してもよい。充分な絶縁性を得る観点からは、絶縁材は無機充填材として金属成分を含まないことが好ましい。 If necessary, the insulating material may contain components other than the resin component that may be contained in the sealing material described above. In particular, it is preferable to contain an inorganic filler from the viewpoint of strength and heat dissipation of the insulating portion. The type of inorganic filler contained in the insulating material is not particularly limited. For example, it may be selected from inorganic fillers other than the metal components that may be contained in the sealing material described above. From the viewpoint of obtaining sufficient insulation, it is preferable that the insulating material does not contain a metal component as an inorganic filler.
絶縁材に無機充填材を配合することの効果を充分に得る観点からは、無機充填材の配合量は、絶縁材全体の５０質量％以上であってもよく、６０質量％以上であってもよく、７０質量％以上であってもよい。絶縁材の粘度上昇を抑制する観点からは、無機充填材の配合量は、絶縁材全体の８０質量％以下であることが好ましい。 From the viewpoint of sufficiently obtaining the effect of blending the inorganic filler into the insulating material, the amount of the inorganic filler blended may be 50% by mass or more, or 60% by mass or more of the entire insulating material. It may be 70% by mass or more. From the viewpoint of suppressing an increase in the viscosity of the insulating material, the amount of the inorganic filler compounded is preferably 80% by mass or less of the entire insulating material.
＜電子部品装置の製造方法＞
本開示の電子部品装置の製造方法は、電子回路の周囲に絶縁材を付与して絶縁部を形成する工程と、前記絶縁部の周囲に金属成分を含む封止材を付与して封止部を形成する工程と、を有する電子部品装置の製造方法である。
<Method for manufacturing electronic component device>
A method for manufacturing an electronic component device according to the present disclosure includes a step of applying an insulating material around an electronic circuit to form an insulating portion, and applying a sealing material containing a metal component around the insulating portion to form a sealing portion. and a method of manufacturing an electronic component device.
絶縁材を電子回路の周囲に付与する方法及び絶縁部の周囲に封止材を付与する方法は、特に制限されない。例えば、ディスペンス方式、注型方式、印刷方式等を採用できる。 The method of applying the insulating material around the electronic circuit and the method of applying the sealing material around the insulating portion are not particularly limited. For example, a dispensing method, a casting method, a printing method, or the like can be used.
上記方法において、電子回路、絶縁部、封止部、絶縁材及び封止材の詳細は、上述した電子回路、絶縁部、封止部、絶縁材及び封止材の詳細と同様である。 In the above method, the details of the electronic circuit, the insulating part, the sealing part, the insulating material, and the sealing material are the same as the details of the electronic circuit, the insulating part, the sealing part, the insulating material, and the sealing material described above.
以下、上記実施形態を実施例により具体的に説明するが、上記実施形態はこれらの実施例に限定されるものではない。なお、表中の各材料に相当する項目の単位は「質量部」であり、空欄は該当する材料を用いないことを表す。 EXAMPLES Hereinafter, the above-described embodiment will be specifically described with reference to Examples, but the above-described embodiment is not limited to these Examples. In addition, the unit of the item corresponding to each material in the table is "parts by mass", and a blank indicates that the corresponding material is not used.
（樹脂組成物の調製）
下記に示す成分を表１に示す配合割合（ｇ）で混合し、実施例と比較例の樹脂組成物を調製した。表１中、「－」は成分が配合されていないことを示す。
(Preparation of resin composition)
The components shown below were mixed at the compounding ratio (g) shown in Table 1 to prepare resin compositions of Examples and Comparative Examples. In Table 1, "-" indicates that the component was not blended.
・エポキシ樹脂１…ビフェニル型エポキシ樹脂（三菱ケミカル株式会社、商品名「ＹＸ－４０００」、エポキシ当量１９２ｇ／ｅｑ）
・エポキシ樹脂２…ビスフェノール型エポキシ樹脂（新日鉄住金化学株式会社、商品名「ＹＳＬＶ－８０ＸＹ」、エポキシ当量１９２ｇ／ｅｑ）
・硬化剤１…多官能フェノール樹脂（エア・ウォーター株式会社、商品名「ＨＥ９１０」、水酸基当量１０５ｇ／ｅｑのトリフェニルメタン型フェノール樹脂）
・硬化促進剤１…リン系硬化促進剤（有機リン化合物）
・
・ Epoxy resin 2 ... bisphenol type epoxy resin (Nippon Steel & Sumikin Chemical Co., Ltd., trade name "YSLV-80XY", epoxy equivalent 192 g / eq)
Curing agent 1: Polyfunctional phenolic resin (Air Water Inc., trade name "HE910", triphenylmethane type phenolic resin with a hydroxyl equivalent of 105 g/eq)
・Curing accelerator 1: Phosphorus-based curing accelerator (organic phosphorus compound)
・無機充填材１：銅フィラー、体積平均粒径１．５μｍ
・無機充填材２：銅フィラー、体積平均粒径５０μｍ
・無機充填材３：アルミニウムフィラー、体積平均粒径４５μｍ
・無機充填材４：アルミナフィラー、体積平均粒径０．７μｍ
・無機充填材５：アルミナフィラー、体積平均粒径１０μｍ
・ Inorganic filler 1: copper filler, volume average particle size 1.5 μm
・ Inorganic filler 2: copper filler, volume average particle size 50 μm
・ Inorganic filler 3: aluminum filler, volume average particle size 45 μm
・ Inorganic filler 4: alumina filler, volume average particle size 0.7 μm
・ Inorganic filler 5: alumina filler, volume average particle size 10 μm
・カップリング剤：アニリノシラン（Ｎ－フェニル－３－アミノプロピルトリメトキシシラン、信越化学工業株式会社、商品名：ＫＢＭ－５７３）
・着色剤：カーボンブラック（三菱ケミカル株式会社、商品名：ＭＡ－１００）
・離型剤：モンタン酸エステル（株式会社セラリカＮＯＤＡ）
・難燃剤：アルキルホスフィンオキシド（大八化学、：ＴＰ－５０）
Coupling agent: Anilinosilane (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd., trade name: KBM-573)
・ Coloring agent: carbon black (Mitsubishi Chemical Co., Ltd., product name: MA-100)
・Releasing agent: Montan acid ester (Celarica NODA Co., Ltd.)
・Flame retardant: Alkylphosphine oxide (Daihachi Chemical: TP-50)
（熱伝導性の評価）
樹脂組成物の熱伝導性の評価は、下記により行った。具体的には、金型温度１８０℃、成形圧力７ＭＰａ、硬化時間３００秒間の条件で樹脂組成物のトランスファー成形を行い、金型形状の硬化物を得た。得られた硬化物のアルキメデス法により測定した比重は、３．００ｇ／ｃｍ３～３．４０ｇ／ｃｍ３であった。また硬化物の熱拡散率を熱拡散率測定装置（ＮＥＴＺＳＣＨ社、ＬＦＡ４６７）を用いてレーザーフラッシュ法により測定した。熱伝導率が１０Ｗ／（ｍ・Ｋ）以上である場合は熱伝導性の評価をＡとし、１０Ｗ／（ｍ・Ｋ）未満である場合は熱伝導性の評価をＢとした。
(Evaluation of thermal conductivity)
Evaluation of the thermal conductivity of the resin composition was performed as follows. Specifically, transfer molding of the resin composition was performed under conditions of a mold temperature of 180° C., a molding pressure of 7 MPa, and a curing time of 300 seconds to obtain a cured product in the shape of a mold. The specific gravity of the resulting cured product measured by the Archimedes method was 3.00 g/cm 3 to 3.40 g/cm 3 . The thermal diffusivity of the cured product was measured by the laser flash method using a thermal diffusivity measuring device (LFA467, NETZSCH). When the thermal conductivity was 10 W/(m·K) or more, the thermal conductivity was evaluated as A, and when it was less than 10 W/(m·K), the thermal conductivity was evaluated as B.
（流動性の評価）
樹脂組成物の流動性の評価は、スパイラルフロー試験により行った。具体的には、ＥＭＭＩ－１－６６に準じたスパイラルフロー測定用金型を用いてエポキシ樹脂組成物を成形し、樹脂組成物の成形物の流動距離（ｃｍ）を測定した。樹脂組成物の成形は、トランスファー成形機を用い、金型温度１８０℃、成形圧力６．９ＭＰａ、硬化時間１２０秒の条件下で行った。流動距離が８０ｃｍ以上である場合は流動性の評価をＡとし、８０ｃｍ未満である場合は流動性の評価をＢとした。
(Evaluation of liquidity)
Fluidity evaluation of the resin composition was performed by a spiral flow test. Specifically, the epoxy resin composition was molded using a mold for spiral flow measurement conforming to EMMI-1-66, and the flow distance (cm) of the molding of the resin composition was measured. Molding of the resin composition was performed using a transfer molding machine under conditions of a mold temperature of 180° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds. When the flow distance was 80 cm or more, the fluidity was evaluated as A, and when it was less than 80 cm, the fluidity was evaluated as B.
表１に示すように、無機充填材として金属成分（銅又はアルミニウム）を含む実施例の樹脂組成物は、金属成分を含まない比較例の樹脂組成物に比べて硬化時の熱伝導性に優れている。また、硬化前の流動性も良好であり、電子部品装置用の封止材として好適に使用できる。 As shown in Table 1, the resin compositions of Examples containing a metal component (copper or aluminum) as an inorganic filler have excellent thermal conductivity during curing compared to the resin compositions of Comparative Examples that do not contain a metal component. ing. In addition, it has good fluidity before curing, and can be suitably used as a sealing material for electronic component devices.
１…電子部品装置、２…基板、３…素子、４…電子回路、５…絶縁部、６…封止部、７…無機充填材
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