JPWO2021153691A1 - - Google Patents

Info

Publication number
JPWO2021153691A1
JPWO2021153691A1 JP2021574121A JP2021574121A JPWO2021153691A1 JP WO2021153691 A1 JPWO2021153691 A1 JP WO2021153691A1 JP 2021574121 A JP2021574121 A JP 2021574121A JP 2021574121 A JP2021574121 A JP 2021574121A JP WO2021153691 A1 JPWO2021153691 A1 JP WO2021153691A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021574121A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021153691A1 publication Critical patent/JPWO2021153691A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021574121A 2020-01-30 2021-01-28 Pending JPWO2021153691A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020013926 2020-01-30
PCT/JP2021/003095 WO2021153691A1 (en) 2020-01-30 2021-01-28 Compound material, molded body, and cured product of compound material

Publications (1)

Publication Number Publication Date
JPWO2021153691A1 true JPWO2021153691A1 (en) 2021-08-05

Family

ID=77079391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021574121A Pending JPWO2021153691A1 (en) 2020-01-30 2021-01-28

Country Status (4)

Country Link
JP (1) JPWO2021153691A1 (en)
CN (1) CN114746505A (en)
TW (1) TW202136356A (en)
WO (1) WO2021153691A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6187455B2 (en) * 2012-03-29 2017-08-30 住友ベークライト株式会社 Resin composition and semiconductor device
JP6931542B2 (en) * 2016-03-29 2021-09-08 積水化学工業株式会社 Cured resin composition, resin composition and multilayer substrate
JP2018024832A (en) * 2016-07-29 2018-02-15 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
SG11202002844QA (en) * 2017-10-04 2020-04-29 Hitachi Chemical Co Ltd Curable resin composition, electronic component device, and production method for electronic component device
CN111989769B (en) * 2018-04-16 2021-07-13 住友电木株式会社 Method for manufacturing electronic device

Also Published As

Publication number Publication date
CN114746505A (en) 2022-07-12
TW202136356A (en) 2021-10-01
WO2021153691A1 (en) 2021-08-05

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231228