KR102231727B1 - 레이저 펄스 에너지 제어 시스템 및 방법 - Google Patents

레이저 펄스 에너지 제어 시스템 및 방법 Download PDF

Info

Publication number
KR102231727B1
KR102231727B1 KR1020157017949A KR20157017949A KR102231727B1 KR 102231727 B1 KR102231727 B1 KR 102231727B1 KR 1020157017949 A KR1020157017949 A KR 1020157017949A KR 20157017949 A KR20157017949 A KR 20157017949A KR 102231727 B1 KR102231727 B1 KR 102231727B1
Authority
KR
South Korea
Prior art keywords
laser
pulse
pulse energy
laser pulse
transmittance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157017949A
Other languages
English (en)
Korean (ko)
Other versions
KR20150104563A (ko
Inventor
마르크 에이. 운라트
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20150104563A publication Critical patent/KR20150104563A/ko
Application granted granted Critical
Publication of KR102231727B1 publication Critical patent/KR102231727B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
KR1020157017949A 2013-01-11 2014-01-09 레이저 펄스 에너지 제어 시스템 및 방법 Active KR102231727B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361751810P 2013-01-11 2013-01-11
US61/751,810 2013-01-11
PCT/US2014/010902 WO2014110276A1 (en) 2013-01-11 2014-01-09 Laser pulse energy control systems and methods

Publications (2)

Publication Number Publication Date
KR20150104563A KR20150104563A (ko) 2015-09-15
KR102231727B1 true KR102231727B1 (ko) 2021-03-26

Family

ID=51164398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157017949A Active KR102231727B1 (ko) 2013-01-11 2014-01-09 레이저 펄스 에너지 제어 시스템 및 방법

Country Status (7)

Country Link
US (1) US9486877B2 (enExample)
EP (1) EP2943311A4 (enExample)
JP (1) JP6339102B2 (enExample)
KR (1) KR102231727B1 (enExample)
CN (1) CN104903044B (enExample)
TW (1) TWI718087B (enExample)
WO (1) WO2014110276A1 (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10613513B2 (en) * 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
US10838406B2 (en) 2013-02-11 2020-11-17 The Aerospace Corporation Systems and methods for the patterning of material substrates
FR3010924B1 (fr) * 2013-09-20 2015-11-06 Essilor Int Dispositif et procede de marquage laser d'une lentille ophtalmique
JP6355496B2 (ja) * 2014-09-17 2018-07-11 住友重機械工業株式会社 レーザ加工装置及びパルスレーザビームの出力方法
DE102014226921A1 (de) * 2014-12-23 2016-06-23 Carl Zeiss Smt Gmbh Strahlungsquellenmodul
TWI701517B (zh) 2014-12-23 2020-08-11 德商卡爾蔡司Ｓｍｔ有限公司 光學構件
WO2016144290A1 (en) * 2015-03-06 2016-09-15 Intel Corporation Acousto-optics deflector and mirror for laser beam steering
US9785050B2 (en) 2015-06-26 2017-10-10 Cymer, Llc Pulsed light beam spectral feature control
CN116213918B (zh) 2015-09-09 2026-07-14 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
US10838603B2 (en) 2015-11-20 2020-11-17 Nlight, Inc. Programmable waveform simulator
CN105598582B (zh) * 2016-02-04 2017-07-21 广东正业科技股份有限公司 一种激光能量调节装置及激光微加工设备
CN106238905B (zh) * 2016-06-14 2019-06-21 昆山国显光电有限公司 一种激光能量自动补偿方法及设备
CN106064279A (zh) * 2016-07-27 2016-11-02 深圳英诺激光科技有限公司 一种激光打标、漂白装置及其加工方法
CN107946895B (zh) * 2016-10-12 2024-08-30 深圳大学 激光能量稳定装置及其稳定方法
WO2018126078A1 (en) 2016-12-30 2018-07-05 Electro Scientific Industries, Inc. Method and system for extending optics lifetime in laser processing apparatus
US9985414B1 (en) * 2017-06-16 2018-05-29 Banner Engineering Corp. Open-loop laser power-regulation
US10333269B2 (en) 2017-09-27 2019-06-25 Apple Inc. Controlling output power of a laser amplifier with variable pulse rate
CN108057953A (zh) * 2017-12-13 2018-05-22 广东正业科技股份有限公司 一种激光加工系统及激光能量控制方法
JP7043128B2 (ja) * 2018-01-31 2022-03-29 住友重機械工業株式会社 レーザ制御装置及びレーザ加工方法
US11433480B2 (en) * 2018-03-23 2022-09-06 Lawrence Livermore National Security, Llc Additive manufacturing power map to mitigate overhang structure
JP7241615B2 (ja) * 2018-06-29 2023-03-17 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US11454836B2 (en) 2018-06-29 2022-09-27 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
EP3670064A1 (en) * 2018-12-21 2020-06-24 Etxe-Tar, S.A. Method and system for supervision of a scan of an energy beam
NL2025013A (en) 2019-03-07 2020-09-11 Asml Netherlands Bv Laser system for source material conditioning in an euv light source
JP7418169B2 (ja) 2019-08-27 2024-01-19 株式会社ディスコ レーザー加工装置
CN115776923B (zh) * 2020-03-09 2025-01-07 山东迈特莱斯金属表面科技有限公司 激光冲击喷丸过程中用于脉冲激光光束控制的装置和方法
US11609116B2 (en) 2020-08-27 2023-03-21 Banner Engineering Corp Open-loop photodiode gain regulation
DE102020122598A1 (de) * 2020-08-28 2022-03-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Bearbeiten eines Materials
CN114178679B (zh) * 2020-09-15 2024-07-02 台达电子工业股份有限公司 激光加工装置
JP2022063595A (ja) * 2020-10-12 2022-04-22 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工機、及びレーザ加工方法
TWI746320B (zh) 2020-12-18 2021-11-11 財團法人工業技術研究院 產生及更新定位分布圖的方法及其系統
EP4312921A4 (en) * 2021-03-23 2025-05-14 Clerio Vision, Inc. COORDINATED SCANNING AND POWER CONTROL OF LASER FOR SHAPING STRUCTURES IN OPHTHALMIC LENSES
US12419684B2 (en) * 2021-05-21 2025-09-23 Boston Scientific Scimed, Inc. Systems and methods for calibrating laser pulses
CN113649694B (zh) * 2021-08-12 2024-02-27 武汉逸飞激光股份有限公司 圆柱电池集流体焊接方法
CN116207000A (zh) * 2021-11-30 2023-06-02 合肥本源量子计算科技有限责任公司 一种激光退火系统及激光退火方法
CN114473196A (zh) * 2021-12-29 2022-05-13 深圳泰德激光技术股份有限公司 激光焊接设备、方法、控制器及存储介质
CN114498277A (zh) * 2021-12-31 2022-05-13 中国科学院空天信息创新研究院 一种窄线宽脉冲激光器稳频装置
CN115102020B (zh) * 2022-07-14 2025-11-07 杭州奥创光子技术有限公司 一种脉冲激光输出控制装置及控制方法
TWI869831B (zh) * 2023-04-25 2025-01-11 聚嶸科技股份有限公司 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法
CN116604202B (zh) * 2023-06-16 2025-06-27 中冶南方工程技术有限公司 一种激光头距离感应器的精确校准控制方法与系统
JP7672594B1 (ja) * 2024-08-09 2025-05-07 三菱電機株式会社 レーザ装置およびレーザ加工装置
CN119457405A (zh) * 2024-12-20 2025-02-18 舜意科技(山东)有限公司 一种光束调节系统及激光加工设备
CN120395208A (zh) * 2025-07-04 2025-08-01 深圳市大族数控科技股份有限公司 激光加工缺陷监测方法、玻璃基板激光加工方法及设备
CN122275017B (zh) * 2026-05-28 2026-08-07 无锡超强伟业科技有限公司 基于激光信号反馈的机械臂激光加工过程控制方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505843A (ja) * 2005-08-30 2009-02-12 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザー微細加工中に形成される個々の穴のエネルギー監視又は制御
JP2009056474A (ja) * 2007-08-30 2009-03-19 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764937A (en) * 1972-04-26 1973-10-09 United Aircraft Corp Frequency controlled, passively q-switch laser
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH1085967A (ja) * 1996-09-20 1998-04-07 Matsushita Electric Ind Co Ltd レーザ誘起プラズマ検出方法とそれを用いるレーザ制御方法およびレーザ加工機
KR100260766B1 (ko) * 1998-02-18 2000-08-01 구본준 레이저 어닐 장비
US6370174B1 (en) 1999-10-20 2002-04-09 Cymer, Inc. Injection seeded F2 lithography laser
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP2001038479A (ja) * 1999-07-27 2001-02-13 Toyota Motor Corp レーザー加工装置とレーザー加工方法
US6552301B2 (en) * 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6998567B2 (en) * 2003-01-31 2006-02-14 Trimedyne, Inc. Generation and application of efficient solid-state laser pulse trains
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7148448B2 (en) * 2003-10-31 2006-12-12 General Electric Company Monitored laser shock peening
JP4443208B2 (ja) * 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
JP2005219077A (ja) * 2004-02-04 2005-08-18 Sumitomo Heavy Ind Ltd レーザエネルギ調整装置、及びレーザエネルギ調整方法、及びレーザ加工機
US7133188B2 (en) * 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing an upstream Bragg adjustment device
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US20090046751A1 (en) * 2004-10-28 2009-02-19 Stephen Hastings Method and apparatus for precise control of laser processing of materials
DE502005011156D1 (de) * 2005-04-27 2011-05-05 Vitro Laser Gmbh Suboberflächenmarkierungen in einem transparenten Körper
US7767930B2 (en) * 2005-10-03 2010-08-03 Aradigm Corporation Method and system for LASER machining
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
TWI594828B (zh) * 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
KR102383125B1 (ko) 2010-10-22 2022-04-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505843A (ja) * 2005-08-30 2009-02-12 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザー微細加工中に形成される個々の穴のエネルギー監視又は制御
JP2009056474A (ja) * 2007-08-30 2009-03-19 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法

Also Published As

Publication number Publication date
JP2016504199A (ja) 2016-02-12
WO2014110276A1 (en) 2014-07-17
EP2943311A4 (en) 2016-08-31
CN104903044B (zh) 2018-01-12
US9486877B2 (en) 2016-11-08
CN104903044A (zh) 2015-09-09
EP2943311A1 (en) 2015-11-18
TW201434563A (zh) 2014-09-16
JP6339102B2 (ja) 2018-06-06
US20140197140A1 (en) 2014-07-17
TWI718087B (zh) 2021-02-11
KR20150104563A (ko) 2015-09-15

Similar Documents

Publication Publication Date Title
US9486877B2 (en) Laser pulse energy control systems and methods
KR102093841B1 (ko) 타겟 특징부와 레이저 비임의 관통 렌즈 정렬을 사용하는 레이저 처리 시스템
JP6087916B2 (ja) 使用中の音響光学ビーム偏向器および音響光学変調器の温度安定性を実現するためのシステムならびに方法
JP2016504199A5 (enExample)
KR20160127461A (ko) 레이저 가공 장치 및 그 가공방법
US20240198459A1 (en) Method For Monitoring A Laser Machining Process Of A Laser Machine Tool
JP2011003630A (ja) レーザ照射装置、及びレーザ照射方法
JPWO2017009945A1 (ja) エキシマレーザ装置
CN102292652B (zh) 光波距离测定方法和光波距离测定装置
JP2008526513A (ja) 精密エネルギ制御用のレーザによる物質の加工方法、システム、およびこれに用いるサブシステム
JP2012096256A (ja) レーザ加工装置
GB2342157A (en) Laser beam spatial energy distribution measurement
KR101659858B1 (ko) 레이저 측정장치, 레이저 가공 시스템 및 레이저 측정방법
KR100870710B1 (ko) 스캐너 오작동 감지방법
JPWO2019058522A1 (ja) レーザ加工装置
EP2544317B1 (en) A method and an apparatus for controlling the time interval between consecutive pulses of a pulsed laser beam, a respective laser processing method and a system

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150703

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190103

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200521

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20201130

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200521

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20201130

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20200721

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20190103

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20210121

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20201231

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20201130

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20200721

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20190103

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20210318

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20210319

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240305

Start annual number: 4

End annual number: 4