CN104903044B - 激光脉冲能量控制系统及方法 - Google Patents
激光脉冲能量控制系统及方法 Download PDFInfo
- Publication number
- CN104903044B CN104903044B CN201480004050.5A CN201480004050A CN104903044B CN 104903044 B CN104903044 B CN 104903044B CN 201480004050 A CN201480004050 A CN 201480004050A CN 104903044 B CN104903044 B CN 104903044B
- Authority
- CN
- China
- Prior art keywords
- laser
- pulse
- pulse energy
- energy
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361751810P | 2013-01-11 | 2013-01-11 | |
| US61/751,810 | 2013-01-11 | ||
| PCT/US2014/010902 WO2014110276A1 (en) | 2013-01-11 | 2014-01-09 | Laser pulse energy control systems and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104903044A CN104903044A (zh) | 2015-09-09 |
| CN104903044B true CN104903044B (zh) | 2018-01-12 |
Family
ID=51164398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480004050.5A Active CN104903044B (zh) | 2013-01-11 | 2014-01-09 | 激光脉冲能量控制系统及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9486877B2 (enExample) |
| EP (1) | EP2943311A4 (enExample) |
| JP (1) | JP6339102B2 (enExample) |
| KR (1) | KR102231727B1 (enExample) |
| CN (1) | CN104903044B (enExample) |
| TW (1) | TWI718087B (enExample) |
| WO (1) | WO2014110276A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11687065B2 (en) | 2020-12-18 | 2023-06-27 | Industrial Technology Research Institute | Method and system for generating and updating position distribution graph |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10613513B2 (en) * | 2013-02-11 | 2020-04-07 | The Aerospace Corporation | Systems and methods for modifying material substrates |
| US10838406B2 (en) | 2013-02-11 | 2020-11-17 | The Aerospace Corporation | Systems and methods for the patterning of material substrates |
| FR3010924B1 (fr) * | 2013-09-20 | 2015-11-06 | Essilor Int | Dispositif et procede de marquage laser d'une lentille ophtalmique |
| JP6355496B2 (ja) * | 2014-09-17 | 2018-07-11 | 住友重機械工業株式会社 | レーザ加工装置及びパルスレーザビームの出力方法 |
| DE102014226921A1 (de) * | 2014-12-23 | 2016-06-23 | Carl Zeiss Smt Gmbh | Strahlungsquellenmodul |
| TWI701517B (zh) | 2014-12-23 | 2020-08-11 | 德商卡爾蔡司Smt有限公司 | 光學構件 |
| WO2016144290A1 (en) * | 2015-03-06 | 2016-09-15 | Intel Corporation | Acousto-optics deflector and mirror for laser beam steering |
| US9785050B2 (en) | 2015-06-26 | 2017-10-10 | Cymer, Llc | Pulsed light beam spectral feature control |
| CN116213918B (zh) | 2015-09-09 | 2026-07-14 | 伊雷克托科学工业股份有限公司 | 镭射处理设备、镭射处理工件的方法及相关配置 |
| US10838603B2 (en) | 2015-11-20 | 2020-11-17 | Nlight, Inc. | Programmable waveform simulator |
| CN105598582B (zh) * | 2016-02-04 | 2017-07-21 | 广东正业科技股份有限公司 | 一种激光能量调节装置及激光微加工设备 |
| CN106238905B (zh) * | 2016-06-14 | 2019-06-21 | 昆山国显光电有限公司 | 一种激光能量自动补偿方法及设备 |
| CN106064279A (zh) * | 2016-07-27 | 2016-11-02 | 深圳英诺激光科技有限公司 | 一种激光打标、漂白装置及其加工方法 |
| CN107946895B (zh) * | 2016-10-12 | 2024-08-30 | 深圳大学 | 激光能量稳定装置及其稳定方法 |
| WO2018126078A1 (en) | 2016-12-30 | 2018-07-05 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
| US9985414B1 (en) * | 2017-06-16 | 2018-05-29 | Banner Engineering Corp. | Open-loop laser power-regulation |
| US10333269B2 (en) | 2017-09-27 | 2019-06-25 | Apple Inc. | Controlling output power of a laser amplifier with variable pulse rate |
| CN108057953A (zh) * | 2017-12-13 | 2018-05-22 | 广东正业科技股份有限公司 | 一种激光加工系统及激光能量控制方法 |
| JP7043128B2 (ja) * | 2018-01-31 | 2022-03-29 | 住友重機械工業株式会社 | レーザ制御装置及びレーザ加工方法 |
| US11433480B2 (en) * | 2018-03-23 | 2022-09-06 | Lawrence Livermore National Security, Llc | Additive manufacturing power map to mitigate overhang structure |
| JP7241615B2 (ja) * | 2018-06-29 | 2023-03-17 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| US11454836B2 (en) | 2018-06-29 | 2022-09-27 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
| EP3670064A1 (en) * | 2018-12-21 | 2020-06-24 | Etxe-Tar, S.A. | Method and system for supervision of a scan of an energy beam |
| NL2025013A (en) | 2019-03-07 | 2020-09-11 | Asml Netherlands Bv | Laser system for source material conditioning in an euv light source |
| JP7418169B2 (ja) | 2019-08-27 | 2024-01-19 | 株式会社ディスコ | レーザー加工装置 |
| CN115776923B (zh) * | 2020-03-09 | 2025-01-07 | 山东迈特莱斯金属表面科技有限公司 | 激光冲击喷丸过程中用于脉冲激光光束控制的装置和方法 |
| US11609116B2 (en) | 2020-08-27 | 2023-03-21 | Banner Engineering Corp | Open-loop photodiode gain regulation |
| DE102020122598A1 (de) * | 2020-08-28 | 2022-03-03 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten eines Materials |
| CN114178679B (zh) * | 2020-09-15 | 2024-07-02 | 台达电子工业股份有限公司 | 激光加工装置 |
| JP2022063595A (ja) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | レーザ加工機の制御装置、レーザ加工機、及びレーザ加工方法 |
| EP4312921A4 (en) * | 2021-03-23 | 2025-05-14 | Clerio Vision, Inc. | COORDINATED SCANNING AND POWER CONTROL OF LASER FOR SHAPING STRUCTURES IN OPHTHALMIC LENSES |
| US12419684B2 (en) * | 2021-05-21 | 2025-09-23 | Boston Scientific Scimed, Inc. | Systems and methods for calibrating laser pulses |
| CN113649694B (zh) * | 2021-08-12 | 2024-02-27 | 武汉逸飞激光股份有限公司 | 圆柱电池集流体焊接方法 |
| CN116207000A (zh) * | 2021-11-30 | 2023-06-02 | 合肥本源量子计算科技有限责任公司 | 一种激光退火系统及激光退火方法 |
| CN114473196A (zh) * | 2021-12-29 | 2022-05-13 | 深圳泰德激光技术股份有限公司 | 激光焊接设备、方法、控制器及存储介质 |
| CN114498277A (zh) * | 2021-12-31 | 2022-05-13 | 中国科学院空天信息创新研究院 | 一种窄线宽脉冲激光器稳频装置 |
| CN115102020B (zh) * | 2022-07-14 | 2025-11-07 | 杭州奥创光子技术有限公司 | 一种脉冲激光输出控制装置及控制方法 |
| TWI869831B (zh) * | 2023-04-25 | 2025-01-11 | 聚嶸科技股份有限公司 | 用於複合材料鑽孔的GHz脈衝串雷射光源系統與方法 |
| CN116604202B (zh) * | 2023-06-16 | 2025-06-27 | 中冶南方工程技术有限公司 | 一种激光头距离感应器的精确校准控制方法与系统 |
| JP7672594B1 (ja) * | 2024-08-09 | 2025-05-07 | 三菱電機株式会社 | レーザ装置およびレーザ加工装置 |
| CN119457405A (zh) * | 2024-12-20 | 2025-02-18 | 舜意科技(山东)有限公司 | 一种光束调节系统及激光加工设备 |
| CN120395208A (zh) * | 2025-07-04 | 2025-08-01 | 深圳市大族数控科技股份有限公司 | 激光加工缺陷监测方法、玻璃基板激光加工方法及设备 |
| CN122275017B (zh) * | 2026-05-28 | 2026-08-07 | 无锡超强伟业科技有限公司 | 基于激光信号反馈的机械臂激光加工过程控制方法及系统 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6097020A (en) * | 1996-09-20 | 2000-08-01 | Matsushita Electric Industrial Co., Ltd. | Laser control system having a diffraction grating for use in laser processing machine utilizing laser-induced plasma detecting system |
| US6323457B1 (en) * | 1998-02-18 | 2001-11-27 | Lg. Philips Lcd Co., Ltd. | Laser annealing apparatus |
| US6552301B2 (en) * | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
| CN1611615A (zh) * | 2003-10-31 | 2005-05-04 | 通用电气公司 | 监控的激光冲击强化 |
| JP2005219077A (ja) * | 2004-02-04 | 2005-08-18 | Sumitomo Heavy Ind Ltd | レーザエネルギ調整装置、及びレーザエネルギ調整方法、及びレーザ加工機 |
| US20060016790A1 (en) * | 2003-01-31 | 2006-01-26 | Trimedyne, Inc. | Generation of efficient solid-state laser pulse trains |
| WO2006045336A1 (en) * | 2004-10-28 | 2006-05-04 | Hastein Gmbh I G | Method and apparatus for precise control of laser output energy during processing of materials |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3764937A (en) * | 1972-04-26 | 1973-10-09 | United Aircraft Corp | Frequency controlled, passively q-switch laser |
| US5593606A (en) | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US6370174B1 (en) | 1999-10-20 | 2002-04-09 | Cymer, Inc. | Injection seeded F2 lithography laser |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| JP2001038479A (ja) * | 1999-07-27 | 2001-02-13 | Toyota Motor Corp | レーザー加工装置とレーザー加工方法 |
| US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP4443208B2 (ja) * | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7133188B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing an upstream Bragg adjustment device |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| DE502005011156D1 (de) * | 2005-04-27 | 2011-05-05 | Vitro Laser Gmbh | Suboberflächenmarkierungen in einem transparenten Körper |
| US7244906B2 (en) * | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US7767930B2 (en) * | 2005-10-03 | 2010-08-03 | Aradigm Corporation | Method and system for LASER machining |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| JP5025391B2 (ja) * | 2007-08-30 | 2012-09-12 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8680430B2 (en) | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI594828B (zh) * | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| KR102383125B1 (ko) | 2010-10-22 | 2022-04-08 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
-
2014
- 2014-01-09 CN CN201480004050.5A patent/CN104903044B/zh active Active
- 2014-01-09 US US14/151,420 patent/US9486877B2/en active Active
- 2014-01-09 JP JP2015552777A patent/JP6339102B2/ja active Active
- 2014-01-09 EP EP14737541.4A patent/EP2943311A4/en not_active Withdrawn
- 2014-01-09 KR KR1020157017949A patent/KR102231727B1/ko active Active
- 2014-01-09 WO PCT/US2014/010902 patent/WO2014110276A1/en not_active Ceased
- 2014-01-10 TW TW103100936A patent/TWI718087B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6097020A (en) * | 1996-09-20 | 2000-08-01 | Matsushita Electric Industrial Co., Ltd. | Laser control system having a diffraction grating for use in laser processing machine utilizing laser-induced plasma detecting system |
| US6323457B1 (en) * | 1998-02-18 | 2001-11-27 | Lg. Philips Lcd Co., Ltd. | Laser annealing apparatus |
| US6552301B2 (en) * | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
| US20060016790A1 (en) * | 2003-01-31 | 2006-01-26 | Trimedyne, Inc. | Generation of efficient solid-state laser pulse trains |
| CN1611615A (zh) * | 2003-10-31 | 2005-05-04 | 通用电气公司 | 监控的激光冲击强化 |
| JP2005163174A (ja) * | 2003-10-31 | 2005-06-23 | General Electric Co <Ge> | 監視付レーザ衝撃ピーニング |
| JP2005219077A (ja) * | 2004-02-04 | 2005-08-18 | Sumitomo Heavy Ind Ltd | レーザエネルギ調整装置、及びレーザエネルギ調整方法、及びレーザ加工機 |
| WO2006045336A1 (en) * | 2004-10-28 | 2006-05-04 | Hastein Gmbh I G | Method and apparatus for precise control of laser output energy during processing of materials |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11687065B2 (en) | 2020-12-18 | 2023-06-27 | Industrial Technology Research Institute | Method and system for generating and updating position distribution graph |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016504199A (ja) | 2016-02-12 |
| WO2014110276A1 (en) | 2014-07-17 |
| EP2943311A4 (en) | 2016-08-31 |
| US9486877B2 (en) | 2016-11-08 |
| CN104903044A (zh) | 2015-09-09 |
| EP2943311A1 (en) | 2015-11-18 |
| TW201434563A (zh) | 2014-09-16 |
| JP6339102B2 (ja) | 2018-06-06 |
| US20140197140A1 (en) | 2014-07-17 |
| TWI718087B (zh) | 2021-02-11 |
| KR102231727B1 (ko) | 2021-03-26 |
| KR20150104563A (ko) | 2015-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102231727B1 (ko) | 레이저 펄스 에너지 제어 시스템 및 방법 | |
| JP6087916B2 (ja) | 使用中の音響光学ビーム偏向器および音響光学変調器の温度安定性を実現するためのシステムならびに方法 | |
| KR102093841B1 (ko) | 타겟 특징부와 레이저 비임의 관통 렌즈 정렬을 사용하는 레이저 처리 시스템 | |
| JP2016504199A5 (enExample) | ||
| US9089927B2 (en) | Laser pulse generation method and apparatus | |
| KR20160127461A (ko) | 레이저 가공 장치 및 그 가공방법 | |
| JP2024001046A (ja) | レーザパワー制御装置、レーザ加工装置及びレーザパワー制御方法 | |
| JP2011003630A (ja) | レーザ照射装置、及びレーザ照射方法 | |
| CN104733339A (zh) | 用于校正线束能量的方法和装置 | |
| TW202428385A (zh) | 用於監控雷射工具機的雷射加工處理的方法 | |
| JP3827865B2 (ja) | レーザ処理装置および該レーザ処理装置の制御方法 | |
| JP6370517B1 (ja) | レーザ加工装置 | |
| KR100870710B1 (ko) | 스캐너 오작동 감지방법 | |
| KR101591490B1 (ko) | 레이저 보정 방법 및 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |