KR102217791B1 - 자기-정렬되는 미리 형성된 렌즈를 갖는 발광 디바이스 - Google Patents
자기-정렬되는 미리 형성된 렌즈를 갖는 발광 디바이스 Download PDFInfo
- Publication number
- KR102217791B1 KR102217791B1 KR1020167023018A KR20167023018A KR102217791B1 KR 102217791 B1 KR102217791 B1 KR 102217791B1 KR 1020167023018 A KR1020167023018 A KR 1020167023018A KR 20167023018 A KR20167023018 A KR 20167023018A KR 102217791 B1 KR102217791 B1 KR 102217791B1
- Authority
- KR
- South Korea
- Prior art keywords
- led
- light emitting
- cavity
- lens
- emitting device
- Prior art date
Links
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461930586P | 2014-01-23 | 2014-01-23 | |
US61/930,586 | 2014-01-23 | ||
PCT/IB2015/050050 WO2015110927A1 (en) | 2014-01-23 | 2015-01-04 | Light emitting device with self-aligning preformed lens |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160113198A KR20160113198A (ko) | 2016-09-28 |
KR102217791B1 true KR102217791B1 (ko) | 2021-02-22 |
Family
ID=52396775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167023018A KR102217791B1 (ko) | 2014-01-23 | 2015-01-04 | 자기-정렬되는 미리 형성된 렌즈를 갖는 발광 디바이스 |
Country Status (6)
Country | Link |
---|---|
US (3) | US10416356B2 (zh) |
EP (1) | EP3097351A1 (zh) |
JP (2) | JP2017504215A (zh) |
KR (1) | KR102217791B1 (zh) |
CN (2) | CN111063787A (zh) |
WO (1) | WO2015110927A1 (zh) |
Families Citing this family (6)
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WO2015110927A1 (en) | 2014-01-23 | 2015-07-30 | Koninklijke Philips N.V. | Light emitting device with self-aligning preformed lens |
JP6645781B2 (ja) * | 2015-09-11 | 2020-02-14 | アルパッド株式会社 | 半導体発光装置 |
US10340173B2 (en) * | 2016-10-11 | 2019-07-02 | Micron Technology, Inc. | System for handling semiconductor dies |
DE102017122325A1 (de) * | 2017-09-26 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
KR20190120715A (ko) * | 2018-04-16 | 2019-10-24 | 리지텍 일렉트로닉스 컴퍼니 리미티드 | 구조화된 광 투사 시스템 |
EP3832199A1 (en) * | 2019-12-06 | 2021-06-09 | Marelli Automotive Lighting Italy S.p.A. | Automotive lighting and/or signaling device and related assembly method |
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2015
- 2015-01-04 WO PCT/IB2015/050050 patent/WO2015110927A1/en active Application Filing
- 2015-01-04 JP JP2016547552A patent/JP2017504215A/ja active Pending
- 2015-01-04 US US15/110,840 patent/US10416356B2/en active Active
- 2015-01-04 CN CN201911355103.9A patent/CN111063787A/zh active Pending
- 2015-01-04 EP EP15701247.7A patent/EP3097351A1/en not_active Withdrawn
- 2015-01-04 CN CN201580005512.XA patent/CN105940262B/zh active Active
- 2015-01-04 KR KR1020167023018A patent/KR102217791B1/ko active IP Right Grant
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2019
- 2019-09-16 US US16/572,074 patent/US10895669B2/en active Active
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2020
- 2020-09-30 JP JP2020164629A patent/JP2021002682A/ja active Pending
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2021
- 2021-01-14 US US17/149,129 patent/US11313996B2/en active Active
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US20030168670A1 (en) | 1999-03-15 | 2003-09-11 | Roberts John K. | Method of making radiation emitter devices |
JP2007059618A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Works Ltd | Led照明器具 |
JP2012533904A (ja) * | 2009-07-22 | 2012-12-27 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 角度に対する色変化が低減されたled |
US20110110097A1 (en) | 2009-11-09 | 2011-05-12 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led unit |
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CN111063787A (zh) | 2020-04-24 |
US20210132263A1 (en) | 2021-05-06 |
KR20160113198A (ko) | 2016-09-28 |
US10416356B2 (en) | 2019-09-17 |
US10895669B2 (en) | 2021-01-19 |
CN105940262B (zh) | 2020-01-07 |
EP3097351A1 (en) | 2016-11-30 |
WO2015110927A1 (en) | 2015-07-30 |
US20200116902A1 (en) | 2020-04-16 |
CN105940262A (zh) | 2016-09-14 |
US20160341852A1 (en) | 2016-11-24 |
US11313996B2 (en) | 2022-04-26 |
JP2021002682A (ja) | 2021-01-07 |
JP2017504215A (ja) | 2017-02-02 |
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