KR102205248B1 - 반도체 다이 봉지 또는 캐리어 실장 방법 및 장치 - Google Patents

반도체 다이 봉지 또는 캐리어 실장 방법 및 장치 Download PDF

Info

Publication number
KR102205248B1
KR102205248B1 KR1020157024180A KR20157024180A KR102205248B1 KR 102205248 B1 KR102205248 B1 KR 102205248B1 KR 1020157024180 A KR1020157024180 A KR 1020157024180A KR 20157024180 A KR20157024180 A KR 20157024180A KR 102205248 B1 KR102205248 B1 KR 102205248B1
Authority
KR
South Korea
Prior art keywords
semiconductor die
insert member
displaceable insert
tool
displaceable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157024180A
Other languages
English (en)
Korean (ko)
Other versions
KR20150136476A (ko
Inventor
요하네스 코르넬리스 데 베이저
미힐 헨드리커스 안토니우스 빌헬무스 루텐
거 후이징
마이크 루이스 테오도어 후더마커
Original Assignee
보쉬맨 테크놀로지스 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 보쉬맨 테크놀로지스 비.브이. filed Critical 보쉬맨 테크놀로지스 비.브이.
Publication of KR20150136476A publication Critical patent/KR20150136476A/ko
Application granted granted Critical
Publication of KR102205248B1 publication Critical patent/KR102205248B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/67092—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • H01L21/56—
    • H01L21/67126—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • B29C2045/822—Pneumatic circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020157024180A 2013-02-06 2014-02-05 반도체 다이 봉지 또는 캐리어 실장 방법 및 장치 Active KR102205248B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2010252 2013-02-06
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
PCT/NL2014/050069 WO2014123413A1 (en) 2013-02-06 2014-02-05 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus

Publications (2)

Publication Number Publication Date
KR20150136476A KR20150136476A (ko) 2015-12-07
KR102205248B1 true KR102205248B1 (ko) 2021-01-21

Family

ID=47891868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024180A Active KR102205248B1 (ko) 2013-02-06 2014-02-05 반도체 다이 봉지 또는 캐리어 실장 방법 및 장치

Country Status (8)

Country Link
US (1) US9536760B2 (https=)
EP (1) EP2954550B1 (https=)
JP (1) JP6420259B2 (https=)
KR (1) KR102205248B1 (https=)
CN (1) CN105247671B (https=)
NL (1) NL2010252C2 (https=)
TW (1) TWI642118B (https=)
WO (1) WO2014123413A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220113363A (ko) * 2019-10-17 2022-08-12 보쉬맨 테크놀로지스 비.브이. 압력 소결 장치 또는 부품 캡슐화 장치와 같은 부품 처리 장치

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
IT201700000191A1 (it) 2017-01-02 2018-07-02 Amx Automatrix S R L Pressa e metodo di sinterizzazione di componenti elettronici su un substrato
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
DE102017216545A1 (de) 2017-09-19 2018-11-29 Conti Temic Microelectronic Gmbh Vorrichtung und Verfahren zur Herstellung einer Niedertemperatur-Drucksinterverbindung für eine elektronische Baugruppe
WO2019217503A1 (en) * 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
NL2021137B1 (en) * 2018-06-15 2019-12-20 Boschman Tech Bv Sintering Process Product Carrier
IT201800006846A1 (it) 2018-07-02 2020-01-02 Gruppo di pressatura per una pressa di sinterizzazione di componenti elettronici su un substrato
IT201800007256A1 (it) * 2018-07-17 2020-01-17 Organo pressore, gruppo di pressatura e pressa di sinterizzazione di componenti elettronici su un substrato
CN113039052B (zh) 2018-11-16 2023-09-05 惠普发展公司，有限责任合伙企业 引线框架装配件及引线框架的两步模制成型方法
JP6667879B1 (ja) * 2018-12-19 2020-03-18 アサヒ・エンジニアリング株式会社 電子部品の実装装置
DE102018133456A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133420A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018010352B4 (de) 2018-12-21 2021-05-12 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133434B4 (de) 2018-12-21 2021-03-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats
JP2020119983A (ja) * 2019-01-23 2020-08-06 トヨタ自動車株式会社 半導体素子接合装置、及び半導体素子接合方法
JP6762578B2 (ja) * 2019-02-09 2020-09-30 アサヒ・エンジニアリング株式会社 電子部品実装装置
KR102196397B1 (ko) * 2020-05-13 2020-12-30 제엠제코(주) 메탈포스트, 이를 포함하는 반도체 패키지 및 반도체 패키지 제조방법
DE102020114442A1 (de) 2020-05-29 2021-12-02 Danfoss Silicon Power Gmbh Halbleiterbauelement
DE102020207343A1 (de) 2020-06-15 2021-12-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optischer und/oder optoelektronischer Systeme mit verbesserter Wärmeabfuhr und verbesserter thermischer und/oder mechanischer Stabilität, sowie mittels dieses Verfahrens erhaltene optische und/oder optoelektronische Systeme
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices
US12072251B2 (en) * 2022-03-01 2024-08-27 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
CN116631917B (zh) * 2023-07-19 2023-12-19 江苏快克芯装备科技有限公司 气压膜压接装置
AT527921B1 (de) 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110744A (ja) 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd 半導体実装装置、および半導体実装方法
JP2003133706A (ja) 2001-10-22 2003-05-09 Matsushita Electric Ind Co Ltd 圧着装置および圧着方法
JP2004119410A (ja) 2002-09-24 2004-04-15 Towa Corp 樹脂封止金型
JP2008235488A (ja) 2007-03-19 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法、樹脂封止用金型及び半導体装置の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL193526C (nl) * 1991-02-26 2000-01-04 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen met een kunststof.
JP3026550B2 (ja) * 1996-05-07 2000-03-27 富士通株式会社 半導体装置の製造方法
SG64937A1 (en) * 1996-06-21 2000-08-22 Advanced Systems Automation Wedge device for linear force amplification in a press
JPH11121479A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 半導体部品の実装方法および実装装置
TW341171U (en) * 1998-01-16 1998-09-21 Li-Li Chen A platform radial dissipation forming mold
KR100533067B1 (ko) * 1999-12-16 2005-12-02 다이-이치 세이코 가부시키가이샤 수지봉지용 금형장치
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
JP2005026608A (ja) * 2003-07-02 2005-01-27 Tokyo Electron Ltd 接合方法および接合装置
JP2006156796A (ja) * 2004-11-30 2006-06-15 Towa Corp 半導体チップの樹脂封止成形方法、及び、装置
US7520052B2 (en) * 2005-06-27 2009-04-21 Texas Instruments Incorporated Method of manufacturing a semiconductor device
JP4941305B2 (ja) * 2005-10-12 2012-05-30 株式会社村田製作所 接合装置
JP2007317738A (ja) * 2006-05-23 2007-12-06 Matsushita Electric Ind Co Ltd 部品圧着実装機の加重測定方法と装置、それらを用いた部品圧着実装機
US7948034B2 (en) * 2006-06-22 2011-05-24 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor bonding
JP2008192725A (ja) * 2007-02-02 2008-08-21 Spansion Llc 半導体装置及びその製造方法並びに半導体装置の製造装置
CN100576478C (zh) * 2007-09-29 2009-12-30 南茂科技股份有限公司 晶粒重新配置的封装方法
WO2009119096A1 (ja) * 2008-03-27 2009-10-01 株式会社ニコン 接合装置および接合方法
US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP5777660B2 (ja) * 2013-05-17 2015-09-09 アサヒ・エンジニアリング株式会社 樹脂成形装置及び半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110744A (ja) 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd 半導体実装装置、および半導体実装方法
JP2003133706A (ja) 2001-10-22 2003-05-09 Matsushita Electric Ind Co Ltd 圧着装置および圧着方法
JP2004119410A (ja) 2002-09-24 2004-04-15 Towa Corp 樹脂封止金型
JP2008235488A (ja) 2007-03-19 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法、樹脂封止用金型及び半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220113363A (ko) * 2019-10-17 2022-08-12 보쉬맨 테크놀로지스 비.브이. 압력 소결 장치 또는 부품 캡슐화 장치와 같은 부품 처리 장치
KR102864794B1 (ko) 2019-10-17 2025-09-25 보쉬맨 테크놀로지스 비.브이. 압력 소결 장치 또는 부품 캡슐화 장치와 같은 부품 처리 장치

Also Published As

Publication number Publication date
EP2954550A1 (en) 2015-12-16
JP2016507164A (ja) 2016-03-07
WO2014123413A1 (en) 2014-08-14
US9536760B2 (en) 2017-01-03
EP2954550B1 (en) 2017-06-28
KR20150136476A (ko) 2015-12-07
TWI642118B (zh) 2018-11-21
CN105247671B (zh) 2017-12-22
JP6420259B2 (ja) 2018-11-07
US20150371880A1 (en) 2015-12-24
NL2010252C2 (en) 2014-08-07
TW201438117A (zh) 2014-10-01
CN105247671A (zh) 2016-01-13

Similar Documents

Publication Publication Date Title
KR102205248B1 (ko) 반도체 다이 봉지 또는 캐리어 실장 방법 및 장치
US7915089B2 (en) Encapsulation method
US12224208B2 (en) Method of separating electronic devices having a back layer and apparatus
JP5934138B2 (ja) 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
KR102332745B1 (ko) 열압착 본딩 시스템 및 열압착 본딩 시스템 작동 방법
KR102522168B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR102527948B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR102184809B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JP6861609B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
US20250006511A1 (en) Semiconductor device packaging warpage control
JP2010214595A (ja) 樹脂封止装置
US7352039B2 (en) Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device
TWI900462B (zh) 接合工具及接合機
JP7448584B2 (ja) 半導体デバイスを接合するための可撓性のある焼結ツール
JP2001024011A (ja) 半導体装置の製造方法およびそれに使用されるポッティング装置
TWI784558B (zh) 用以封裝設置於載體上之電子組件之方法及模具
JP2007505491A (ja) 可撓性圧力素子を用いて電子部品をカプセル封入する方法および装置
CN120527245A (zh) 激光辅助键合装置和将半导体裸片键合到衬底上的方法
TWI529819B (zh) 用於半導體封裝之滾裝式囊封方法
KR20150118792A (ko) 와이어 본딩 장치

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000