KR102184953B1 - 로봇 및 로봇의 교시 방법 - Google Patents

로봇 및 로봇의 교시 방법 Download PDF

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KR102184953B1
KR102184953B1 KR1020180124934A KR20180124934A KR102184953B1 KR 102184953 B1 KR102184953 B1 KR 102184953B1 KR 1020180124934 A KR1020180124934 A KR 1020180124934A KR 20180124934 A KR20180124934 A KR 20180124934A KR 102184953 B1 KR102184953 B1 KR 102184953B1
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work
hand
sensor
robot
light
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KR20190066545A (ko
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주에 왕
다모츠 구리바야시
데츠야 이노마타
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니혼 덴산 산쿄 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H01L21/67742—
    • H01L21/67259—
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

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  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020180124934A 2017-12-05 2018-10-19 로봇 및 로봇의 교시 방법 Active KR102184953B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-233453 2017-12-05
JP2017233453A JP7023094B2 (ja) 2017-12-05 2017-12-05 ロボット

Publications (2)

Publication Number Publication Date
KR20190066545A KR20190066545A (ko) 2019-06-13
KR102184953B1 true KR102184953B1 (ko) 2020-12-01

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KR1020180124934A Active KR102184953B1 (ko) 2017-12-05 2018-10-19 로봇 및 로봇의 교시 방법

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JP (1) JP7023094B2 (https=)
KR (1) KR102184953B1 (https=)
CN (1) CN109866208B (https=)

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JP7049909B2 (ja) * 2018-05-11 2022-04-07 川崎重工業株式会社 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法
US10867821B2 (en) * 2018-09-11 2020-12-15 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of teaching edge position of target body
JP7303686B2 (ja) * 2019-07-26 2023-07-05 ニデックインスツルメンツ株式会社 ロボットにおけるワーク位置検出方法
JP2021048322A (ja) * 2019-09-19 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
CN112786475B (zh) * 2019-11-08 2024-07-30 沈阳新松半导体设备有限公司 一种晶圆自动纠偏方法
CN111958115B (zh) * 2020-08-10 2022-06-14 上海智殷自动化科技有限公司 一种用于激光焊缝跟踪的快速手眼标定方法
JP7671574B2 (ja) * 2020-10-02 2025-05-02 ニデックインスツルメンツ株式会社 産業用ロボット
US11554498B2 (en) * 2020-10-09 2023-01-17 Kawasaki Jukogyo Kabushiki Kaisha Wafer jig, robot system, communication method, and robot teaching method
JP2022076061A (ja) * 2020-11-09 2022-05-19 日本電産サンキョー株式会社 産業用ロボット
JP7562377B2 (ja) 2020-11-09 2024-10-07 ニデックインスツルメンツ株式会社 産業用ロボットの教示方法
JP7699457B2 (ja) * 2021-04-01 2025-06-27 ニデックインスツルメンツ株式会社 ワークの搬送装置及びマッピング方法
JP7768743B2 (ja) * 2021-11-30 2025-11-12 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの教示方法

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KR20160055010A (ko) * 2014-11-07 2016-05-17 삼성전자주식회사 웨이퍼 이송 로봇 및 그 제어 방법
JP6522325B2 (ja) 2014-12-08 2019-05-29 日本電産サンキョー株式会社 産業用ロボットおよび産業用ロボットの教示方法
JP6316742B2 (ja) * 2014-12-24 2018-04-25 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
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CN109866208B (zh) 2022-06-03
KR20190066545A (ko) 2019-06-13
JP2019102695A (ja) 2019-06-24
CN109866208A (zh) 2019-06-11
JP7023094B2 (ja) 2022-02-21

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