JP7023094B2 - ロボット - Google Patents

ロボット Download PDF

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Publication number
JP7023094B2
JP7023094B2 JP2017233453A JP2017233453A JP7023094B2 JP 7023094 B2 JP7023094 B2 JP 7023094B2 JP 2017233453 A JP2017233453 A JP 2017233453A JP 2017233453 A JP2017233453 A JP 2017233453A JP 7023094 B2 JP7023094 B2 JP 7023094B2
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Japan
Prior art keywords
work
hand
sensor
robot
teaching
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JP2017233453A
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English (en)
Japanese (ja)
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JP2019102695A (ja
JP2019102695A5 (https=
Inventor
▲カク▼ 王
保 栗林
徹也 猪股
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Nidec Instruments Corp
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Nidec Sankyo Corp
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Priority to JP2017233453A priority Critical patent/JP7023094B2/ja
Priority to KR1020180124934A priority patent/KR102184953B1/ko
Priority to CN201811364496.5A priority patent/CN109866208B/zh
Publication of JP2019102695A publication Critical patent/JP2019102695A/ja
Publication of JP2019102695A5 publication Critical patent/JP2019102695A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2017233453A 2017-12-05 2017-12-05 ロボット Active JP7023094B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017233453A JP7023094B2 (ja) 2017-12-05 2017-12-05 ロボット
KR1020180124934A KR102184953B1 (ko) 2017-12-05 2018-10-19 로봇 및 로봇의 교시 방법
CN201811364496.5A CN109866208B (zh) 2017-12-05 2018-11-16 机器人及机器人的示教方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017233453A JP7023094B2 (ja) 2017-12-05 2017-12-05 ロボット

Publications (3)

Publication Number Publication Date
JP2019102695A JP2019102695A (ja) 2019-06-24
JP2019102695A5 JP2019102695A5 (https=) 2020-12-17
JP7023094B2 true JP7023094B2 (ja) 2022-02-21

Family

ID=66847687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017233453A Active JP7023094B2 (ja) 2017-12-05 2017-12-05 ロボット

Country Status (3)

Country Link
JP (1) JP7023094B2 (https=)
KR (1) KR102184953B1 (https=)
CN (1) CN109866208B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7049909B2 (ja) * 2018-05-11 2022-04-07 川崎重工業株式会社 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法
US10867821B2 (en) * 2018-09-11 2020-12-15 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of teaching edge position of target body
JP7303686B2 (ja) * 2019-07-26 2023-07-05 ニデックインスツルメンツ株式会社 ロボットにおけるワーク位置検出方法
JP2021048322A (ja) * 2019-09-19 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
CN112786475B (zh) * 2019-11-08 2024-07-30 沈阳新松半导体设备有限公司 一种晶圆自动纠偏方法
CN111958115B (zh) * 2020-08-10 2022-06-14 上海智殷自动化科技有限公司 一种用于激光焊缝跟踪的快速手眼标定方法
JP7671574B2 (ja) * 2020-10-02 2025-05-02 ニデックインスツルメンツ株式会社 産業用ロボット
US11554498B2 (en) * 2020-10-09 2023-01-17 Kawasaki Jukogyo Kabushiki Kaisha Wafer jig, robot system, communication method, and robot teaching method
JP2022076061A (ja) * 2020-11-09 2022-05-19 日本電産サンキョー株式会社 産業用ロボット
JP7562377B2 (ja) 2020-11-09 2024-10-07 ニデックインスツルメンツ株式会社 産業用ロボットの教示方法
JP7699457B2 (ja) * 2021-04-01 2025-06-27 ニデックインスツルメンツ株式会社 ワークの搬送装置及びマッピング方法
JP7768743B2 (ja) * 2021-11-30 2025-11-12 ニデックインスツルメンツ株式会社 産業用ロボットおよび産業用ロボットの教示方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217303A (ja) 2000-02-02 2001-08-10 Assist Japan Kk ガラス基板の基板端検出装置
JP2002076097A (ja) 2000-08-30 2002-03-15 Hirata Corp ウェハ転送装置およびウェハアライメント方法
JP2006060135A (ja) 2004-08-23 2006-03-02 Kawasaki Heavy Ind Ltd 基板状態検出装置

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US6317953B1 (en) * 1981-05-11 2001-11-20 Lmi-Diffracto Vision target based assembly
JPH08148546A (ja) * 1994-11-22 1996-06-07 Sumitomo Metal Ind Ltd ウェハ配列検出装置
JPH10223732A (ja) * 1996-12-02 1998-08-21 Toyota Autom Loom Works Ltd 位置ずれ検出装置およびその方法
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
CA2344125C (en) * 1999-03-10 2005-01-18 Mitsubishi Heavy Industries, Ltd. Working robot
KR100690669B1 (ko) * 2005-05-17 2007-03-09 엘지전자 주식회사 자율 주행 로봇의 위치인식 시스템
JP4930853B2 (ja) * 2005-07-15 2012-05-16 株式会社安川電機 ウェハ搬送装置
TWI398335B (zh) 2006-11-27 2013-06-11 日本電產三協股份有限公司 Workpiece conveying system
JP5453590B2 (ja) 2007-12-29 2014-03-26 日本電産サンキョー株式会社 ロボットのハンドの制御方法及びワーク搬送ロボットシステム
US20090182454A1 (en) * 2008-01-14 2009-07-16 Bernardo Donoso Method and apparatus for self-calibration of a substrate handling robot
JP5450401B2 (ja) * 2008-05-27 2014-03-26 ローツェ株式会社 搬送装置、位置教示方法及びセンサ治具
JP5280901B2 (ja) * 2009-03-18 2013-09-04 光洋サーモシステム株式会社 基板処理システムおよび基板処理方法
JP5491834B2 (ja) * 2009-12-01 2014-05-14 川崎重工業株式会社 エッジグリップ装置、及びそれを備えるロボット。
JP5333408B2 (ja) * 2010-10-22 2013-11-06 東京エレクトロン株式会社 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体
JP6040757B2 (ja) * 2012-10-15 2016-12-07 東京エレクトロン株式会社 搬送機構の位置決め方法、被処理体の位置ずれ量算出方法及び搬送機構のティーチングデータの修正方法
JP2015168012A (ja) * 2014-03-04 2015-09-28 株式会社安川電機 教示ジグ、教示システムおよび教示方法
JP6384195B2 (ja) * 2014-08-20 2018-09-05 株式会社安川電機 ロボットシステムおよびロボット教示方法
KR20160055010A (ko) * 2014-11-07 2016-05-17 삼성전자주식회사 웨이퍼 이송 로봇 및 그 제어 방법
JP6522325B2 (ja) 2014-12-08 2019-05-29 日本電産サンキョー株式会社 産業用ロボットおよび産業用ロボットの教示方法
JP6316742B2 (ja) * 2014-12-24 2018-04-25 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
JP6468856B2 (ja) * 2015-01-20 2019-02-13 リンテック株式会社 移載装置
JP6710518B2 (ja) * 2015-12-03 2020-06-17 東京エレクトロン株式会社 搬送装置及び補正方法
CN105666489B (zh) * 2015-12-31 2017-11-10 北京七星华创电子股份有限公司 用于修正离线示教数据的机械手及方法
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217303A (ja) 2000-02-02 2001-08-10 Assist Japan Kk ガラス基板の基板端検出装置
JP2002076097A (ja) 2000-08-30 2002-03-15 Hirata Corp ウェハ転送装置およびウェハアライメント方法
JP2006060135A (ja) 2004-08-23 2006-03-02 Kawasaki Heavy Ind Ltd 基板状態検出装置

Also Published As

Publication number Publication date
CN109866208B (zh) 2022-06-03
KR20190066545A (ko) 2019-06-13
KR102184953B1 (ko) 2020-12-01
JP2019102695A (ja) 2019-06-24
CN109866208A (zh) 2019-06-11

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