KR102174876B1 - 주석 합금 도금액 - Google Patents

주석 합금 도금액 Download PDF

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Publication number
KR102174876B1
KR102174876B1 KR1020197024869A KR20197024869A KR102174876B1 KR 102174876 B1 KR102174876 B1 KR 102174876B1 KR 1020197024869 A KR1020197024869 A KR 1020197024869A KR 20197024869 A KR20197024869 A KR 20197024869A KR 102174876 B1 KR102174876 B1 KR 102174876B1
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KR
South Korea
Prior art keywords
tin
plating solution
acid
alloy plating
tin alloy
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KR1020197024869A
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English (en)
Korean (ko)
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KR20190103460A (ko
Inventor
고우지 다츠미
츠카사 야소시마
다쿠마 가타세
Original Assignee
미쓰비시 마테리알 가부시키가이샤
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Priority claimed from PCT/JP2017/044668 external-priority patent/WO2018142776A1/ja
Publication of KR20190103460A publication Critical patent/KR20190103460A/ko
Application granted granted Critical
Publication of KR102174876B1 publication Critical patent/KR102174876B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020197024869A 2017-01-31 2017-12-13 주석 합금 도금액 Active KR102174876B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2017-015219 2017-01-31
JP2017015219 2017-01-31
JPJP-P-2017-222433 2017-11-20
JP2017222433A JP6432667B2 (ja) 2017-01-31 2017-11-20 錫合金めっき液
PCT/JP2017/044668 WO2018142776A1 (ja) 2017-01-31 2017-12-13 錫合金めっき液

Publications (2)

Publication Number Publication Date
KR20190103460A KR20190103460A (ko) 2019-09-04
KR102174876B1 true KR102174876B1 (ko) 2020-11-05

Family

ID=63110055

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197024869A Active KR102174876B1 (ko) 2017-01-31 2017-12-13 주석 합금 도금액

Country Status (6)

Country Link
US (1) US20190390357A1 (https=)
EP (1) EP3578692A4 (https=)
JP (1) JP6432667B2 (https=)
KR (1) KR102174876B1 (https=)
CN (1) CN110249076A (https=)
TW (1) TWI681084B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7243002B2 (ja) * 2018-07-20 2023-03-22 三菱マテリアル株式会社 錫めっき液及び錫合金めっき液
US20240116861A1 (en) 2019-12-12 2024-04-11 Mitsubishi Materials Corporation Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution
JP2021095396A (ja) * 2019-12-12 2021-06-24 三菱マテリアル株式会社 ジチアポリエーテルジオール及びその製造方法並びに該ジチアポリエーテルジオールを含むＳｎＡｇめっき液、該ＳｎＡｇめっき液を用いてめっき皮膜を形成する方法
CN111188069A (zh) * 2019-12-31 2020-05-22 大连长丰实业总公司 一种镀锡铋合金溶液及其制备方法
JP7686981B2 (ja) * 2021-01-13 2025-06-03 三菱マテリアル株式会社 錫合金めっき液
CN112981459A (zh) * 2021-03-12 2021-06-18 昆明理工大学 一种电解精炼粗焊锡的方法
US12509789B2 (en) * 2021-05-20 2025-12-30 Basf Se Sulfonate electroplating bath, process for refining metal by electrolytic depositing and process for controlling metal morphology in electrolytic refining

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4296358B2 (ja) 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP3718790B2 (ja) 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
JP4162246B2 (ja) 2005-08-12 2008-10-08 石原薬品株式会社 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP2016148085A (ja) * 2015-02-12 2016-08-18 ユケン工業株式会社 スズ−銅めっき液および導電部材
JP6631348B2 (ja) * 2015-03-26 2020-01-15 三菱マテリアル株式会社 ホスホニウム塩を用いためっき液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴

Also Published As

Publication number Publication date
CN110249076A (zh) 2019-09-17
TWI681084B (zh) 2020-01-01
EP3578692A1 (en) 2019-12-11
KR20190103460A (ko) 2019-09-04
US20190390357A1 (en) 2019-12-26
JP6432667B2 (ja) 2018-12-05
TW201833391A (zh) 2018-09-16
JP2018123421A (ja) 2018-08-09
EP3578692A4 (en) 2020-12-09

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