KR102173658B1 - 기판처리시스템 - Google Patents

기판처리시스템 Download PDF

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Publication number
KR102173658B1
KR102173658B1 KR1020160161109A KR20160161109A KR102173658B1 KR 102173658 B1 KR102173658 B1 KR 102173658B1 KR 1020160161109 A KR1020160161109 A KR 1020160161109A KR 20160161109 A KR20160161109 A KR 20160161109A KR 102173658 B1 KR102173658 B1 KR 102173658B1
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KR
South Korea
Prior art keywords
tray
substrate
substrate processing
module
unit
Prior art date
Application number
KR1020160161109A
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English (en)
Korean (ko)
Other versions
KR20180061675A (ko
Inventor
엄용택
장석필
허현강
Original Assignee
주식회사 원익아이피에스
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Priority to KR1020160161109A priority Critical patent/KR102173658B1/ko
Priority to CN201710749543.7A priority patent/CN108122809B/zh
Publication of KR20180061675A publication Critical patent/KR20180061675A/ko
Application granted granted Critical
Publication of KR102173658B1 publication Critical patent/KR102173658B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160161109A 2016-11-30 2016-11-30 기판처리시스템 KR102173658B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020160161109A KR102173658B1 (ko) 2016-11-30 2016-11-30 기판처리시스템
CN201710749543.7A CN108122809B (zh) 2016-11-30 2017-08-28 基板处理系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160161109A KR102173658B1 (ko) 2016-11-30 2016-11-30 기판처리시스템

Publications (2)

Publication Number Publication Date
KR20180061675A KR20180061675A (ko) 2018-06-08
KR102173658B1 true KR102173658B1 (ko) 2020-11-03

Family

ID=62228264

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160161109A KR102173658B1 (ko) 2016-11-30 2016-11-30 기판처리시스템

Country Status (2)

Country Link
KR (1) KR102173658B1 (zh)
CN (1) CN108122809B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109244186B (zh) * 2018-09-19 2024-02-27 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法
CN112992748A (zh) * 2021-02-26 2021-06-18 苏州新米特电子科技有限公司 一种晶圆全自动取粒机
CN114005768A (zh) * 2021-10-29 2022-02-01 北京北方华创微电子装备有限公司 半导体工艺设备、托盘及片盒
CN114800578B (zh) * 2022-06-28 2022-10-25 江苏邑文微电子科技有限公司 晶圆传输设备及其控制方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688948B1 (ko) * 2005-07-27 2007-03-02 주식회사 아이피에스 클러스터 타입의 플라즈마 처리 시스템 및 방법
KR100790797B1 (ko) * 2006-06-08 2008-01-02 주식회사 아이피에스 진공처리장치
KR101401516B1 (ko) * 2007-05-23 2014-06-09 주성엔지니어링(주) 트레이 정렬장치와 이를 포함하는 태양전지 제조장치 및이를 이용한 트레이 정렬방법
US20100111650A1 (en) * 2008-01-31 2010-05-06 Applied Materials, Inc. Automatic substrate loading station
KR101428522B1 (ko) * 2008-05-21 2014-08-12 주식회사 원익아이피에스 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법
JP5139253B2 (ja) * 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
JP4707749B2 (ja) * 2009-04-01 2011-06-22 東京エレクトロン株式会社 基板交換方法及び基板処理装置
KR101630804B1 (ko) * 2009-11-18 2016-06-15 주식회사 원익아이피에스 기판처리시스템 및 기판처리시스템의 언로드락모듈
KR101651164B1 (ko) * 2009-12-22 2016-08-25 주식회사 원익아이피에스 기판처리시스템, 그에 사용되는 기판처리시스템의 공정모듈
KR101329303B1 (ko) * 2010-06-17 2013-11-20 세메스 주식회사 기판들의 로딩 및 언로딩을 위한 기판 처리 장치
TWI451521B (zh) * 2010-06-21 2014-09-01 Semes Co Ltd 基板處理設備及基板處理方法
KR101624982B1 (ko) * 2010-09-03 2016-05-27 주식회사 원익아이피에스 기판처리시스템 및 기판처리방법
KR101713799B1 (ko) * 2011-04-15 2017-03-09 주식회사 원익아이피에스 반도체 제조장치 및 제조방법
KR101765234B1 (ko) * 2011-12-26 2017-08-07 주식회사 원익아이피에스 트레이교환모듈, 기판처리장치 및 기판처리방법
CN103219261A (zh) * 2012-01-21 2013-07-24 圆益Ips股份有限公司 基板处理装置及基板处理方法
JP5990279B2 (ja) * 2012-11-22 2016-09-07 富士機械製造株式会社 部品実装機
CN103400789B (zh) * 2013-08-01 2018-01-26 上海集成电路研发中心有限公司 设备平台系统及其晶圆传输方法
KR101957832B1 (ko) * 2014-11-14 2019-03-14 주식회사 원익아이피에스 기판처리장치
KR102055370B1 (ko) * 2015-04-16 2019-12-16 주식회사 원익아이피에스 기판처리장치

Also Published As

Publication number Publication date
KR20180061675A (ko) 2018-06-08
CN108122809A (zh) 2018-06-05
CN108122809B (zh) 2021-11-26

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