KR102172881B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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KR102172881B1
KR102172881B1 KR1020170084715A KR20170084715A KR102172881B1 KR 102172881 B1 KR102172881 B1 KR 102172881B1 KR 1020170084715 A KR1020170084715 A KR 1020170084715A KR 20170084715 A KR20170084715 A KR 20170084715A KR 102172881 B1 KR102172881 B1 KR 102172881B1
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South Korea
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substrate
mold
abnormality
release operation
unit
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Korean (ko)
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KR20180007313A (ko
Inventor
가츠토시 사카이
다다시 핫토리
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/002—Panels; Plates; Sheets

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170084715A 2016-07-12 2017-07-04 임프린트 장치 및 물품 제조 방법 Active KR102172881B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016137957A JP6706983B2 (ja) 2016-07-12 2016-07-12 インプリント装置及び物品の製造方法
JPJP-P-2016-137957 2016-07-12

Publications (2)

Publication Number Publication Date
KR20180007313A KR20180007313A (ko) 2018-01-22
KR102172881B1 true KR102172881B1 (ko) 2020-11-02

Family

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KR1020170084715A Active KR102172881B1 (ko) 2016-07-12 2017-07-04 임프린트 장치 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US10871709B2 (enExample)
JP (1) JP6706983B2 (enExample)
KR (1) KR102172881B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7091138B2 (ja) * 2018-05-15 2022-06-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7233174B2 (ja) * 2018-05-17 2023-03-06 キヤノン株式会社 インプリント装置、物品製造方法、平坦化層形成装置、情報処理装置、及び、決定方法
JP7265824B2 (ja) * 2018-11-02 2023-04-27 キヤノン株式会社 成形装置および物品製造方法
JP7383450B2 (ja) * 2019-10-23 2023-11-20 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7657631B2 (ja) * 2021-03-29 2025-04-07 キヤノン株式会社 評価装置、プログラム、評価方法、成形システム、および物品製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140445A1 (en) * 2007-12-04 2009-06-04 Molecular Imprints High Throughput Imprint Based on Contact Line Motion Tracking Control
US20100314798A1 (en) * 2009-06-16 2010-12-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20120261849A1 (en) * 2011-04-14 2012-10-18 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method using same
JP2015115370A (ja) 2013-12-09 2015-06-22 キヤノン株式会社 インプリント装置、及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147294A (ja) * 2008-12-19 2010-07-01 Canon Inc 基板保持方法及び基板保持装置、それを用いた露光装置及びデバイスの製造方法
JP5665336B2 (ja) * 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
JP5455583B2 (ja) 2009-11-30 2014-03-26 キヤノン株式会社 インプリント装置
WO2011118006A1 (ja) * 2010-03-25 2011-09-29 パイオニア株式会社 転写装置及び方法、並びにコンピュータプログラム
JP6004738B2 (ja) 2011-09-07 2016-10-12 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2014033050A (ja) * 2012-08-02 2014-02-20 Toshiba Corp インプリントシステム及びインプリント方法
US9269712B2 (en) * 2013-10-31 2016-02-23 Stmicroelectronics, Inc. Semiconductor device providing enhanced fin isolation and related methods
JP6413533B2 (ja) * 2014-09-16 2018-10-31 大日本印刷株式会社 物品の品質判別方法、物品の品質判別システムおよび物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090140445A1 (en) * 2007-12-04 2009-06-04 Molecular Imprints High Throughput Imprint Based on Contact Line Motion Tracking Control
US20100314798A1 (en) * 2009-06-16 2010-12-16 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
US20120261849A1 (en) * 2011-04-14 2012-10-18 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method using same
JP2015115370A (ja) 2013-12-09 2015-06-22 キヤノン株式会社 インプリント装置、及び物品の製造方法
US20160052179A1 (en) * 2013-12-09 2016-02-25 Canon Kabushiki Kaisha Imprint apparatus, and method of manufacturing article

Also Published As

Publication number Publication date
US10871709B2 (en) 2020-12-22
KR20180007313A (ko) 2018-01-22
US20180017863A1 (en) 2018-01-18
JP2018010942A (ja) 2018-01-18
JP6706983B2 (ja) 2020-06-10

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