KR102162594B1 - 인쇄 배선판 및 그 제조 방법 - Google Patents

인쇄 배선판 및 그 제조 방법 Download PDF

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Publication number
KR102162594B1
KR102162594B1 KR1020150166257A KR20150166257A KR102162594B1 KR 102162594 B1 KR102162594 B1 KR 102162594B1 KR 1020150166257 A KR1020150166257 A KR 1020150166257A KR 20150166257 A KR20150166257 A KR 20150166257A KR 102162594 B1 KR102162594 B1 KR 102162594B1
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KR
South Korea
Prior art keywords
open stub
wiring board
printed wiring
power supply
circuit
Prior art date
Application number
KR1020150166257A
Other languages
English (en)
Korean (ko)
Other versions
KR20160065008A (ko
Inventor
요시타카 토요타
켄고 이오키베
유키 야마시타
토시유키 카네코
마사노리 나이토
키요히코 카이야
토시히사 우에하라
코이치 콘도
Original Assignee
교세라 가부시키가이샤
고꾸리츠 다이가꾸 호우징 오까야마 다이가꾸
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교세라 가부시키가이샤, 고꾸리츠 다이가꾸 호우징 오까야마 다이가꾸 filed Critical 교세라 가부시키가이샤
Publication of KR20160065008A publication Critical patent/KR20160065008A/ko
Application granted granted Critical
Publication of KR102162594B1 publication Critical patent/KR102162594B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0138—Electrical filters or coupling circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020150166257A 2014-11-28 2015-11-26 인쇄 배선판 및 그 제조 방법 KR102162594B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014242125 2014-11-28
JPJP-P-2014-242125 2014-11-28
JP2015039026A JP6894602B2 (ja) 2014-11-28 2015-02-27 印刷配線板およびその製造方法
JPJP-P-2015-039026 2015-02-27

Publications (2)

Publication Number Publication Date
KR20160065008A KR20160065008A (ko) 2016-06-08
KR102162594B1 true KR102162594B1 (ko) 2020-10-07

Family

ID=56124862

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150166257A KR102162594B1 (ko) 2014-11-28 2015-11-26 인쇄 배선판 및 그 제조 방법

Country Status (4)

Country Link
JP (2) JP6894602B2 (ja)
KR (1) KR102162594B1 (ja)
CN (1) CN105657957B (ja)
TW (1) TWI705737B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102176897B1 (ko) * 2016-07-27 2020-11-10 고꾸리츠 다이가꾸 호우징 오까야마 다이가꾸 인쇄 배선판
JP6611066B2 (ja) * 2016-07-27 2019-11-27 国立大学法人 岡山大学 印刷配線板
JP6744201B2 (ja) * 2016-11-28 2020-08-19 京セラ株式会社 印刷配線板
US11039052B2 (en) 2017-02-04 2021-06-15 Ningbo Sunny Opotech Co., Ltd. Camera module and molding circuit board assembly, circuit board and application thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133801A (ja) * 2001-10-25 2003-05-09 Hitachi Ltd 高周波回路モジュール
JP2008010859A (ja) * 2006-06-02 2008-01-17 Renesas Technology Corp 半導体装置
WO2008062562A1 (fr) * 2006-11-22 2008-05-29 Nec Tokin Corporation Structure de bande interdite électromagnétique, étiquette d'identification par radiofréquence, filtre antiparasite, feuille d'absorption de bruit et tableau de connexions à fonction d'absorption de bruit
US20080158840A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation DC power plane structure
WO2009082003A1 (ja) * 2007-12-26 2009-07-02 Nec Corporation 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ
JP2011249862A (ja) * 2010-05-21 2011-12-08 Nec Tokin Corp ノイズ抑制伝送路及びそれに用いられるシート状構造体
JP2013183082A (ja) * 2012-03-02 2013-09-12 Oki Printed Circuits Co Ltd 多層プリント配線板
JP2013232613A (ja) * 2012-04-05 2013-11-14 Sony Corp 配線基板及び電子機器
US20140209691A1 (en) 2011-09-11 2014-07-31 David Finn Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008154A (ja) * 2001-06-21 2003-01-10 Nec Corp 印刷配線板、同軸ケーブル及び電子装置
TW200818451A (en) * 2006-06-02 2008-04-16 Renesas Tech Corp Semiconductor device
TWI375499B (en) * 2007-11-27 2012-10-21 Asustek Comp Inc Improvement method for ebg structures and multi-layer board applying the same
JP5326649B2 (ja) * 2009-02-24 2013-10-30 日本電気株式会社 アンテナ、アレイアンテナ、プリント基板、及びそれを用いた電子装置
KR101044203B1 (ko) * 2009-11-18 2011-06-29 삼성전기주식회사 전자기 밴드갭 구조물 및 이를 포함하는 인쇄회로기판
JP6497649B2 (ja) * 2015-01-30 2019-04-10 国立大学法人 岡山大学 印刷配線板およびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133801A (ja) * 2001-10-25 2003-05-09 Hitachi Ltd 高周波回路モジュール
JP2008010859A (ja) * 2006-06-02 2008-01-17 Renesas Technology Corp 半導体装置
WO2008062562A1 (fr) * 2006-11-22 2008-05-29 Nec Tokin Corporation Structure de bande interdite électromagnétique, étiquette d'identification par radiofréquence, filtre antiparasite, feuille d'absorption de bruit et tableau de connexions à fonction d'absorption de bruit
US20080158840A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation DC power plane structure
WO2009082003A1 (ja) * 2007-12-26 2009-07-02 Nec Corporation 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ
JP2011249862A (ja) * 2010-05-21 2011-12-08 Nec Tokin Corp ノイズ抑制伝送路及びそれに用いられるシート状構造体
US20140209691A1 (en) 2011-09-11 2014-07-31 David Finn Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles
JP2013183082A (ja) * 2012-03-02 2013-09-12 Oki Printed Circuits Co Ltd 多層プリント配線板
JP2013232613A (ja) * 2012-04-05 2013-11-14 Sony Corp 配線基板及び電子機器

Also Published As

Publication number Publication date
TW201630479A (zh) 2016-08-16
JP6829448B2 (ja) 2021-02-10
JP6894602B2 (ja) 2021-06-30
JP2016111314A (ja) 2016-06-20
TWI705737B (zh) 2020-09-21
CN105657957B (zh) 2020-07-14
JP2019134185A (ja) 2019-08-08
CN105657957A (zh) 2016-06-08
KR20160065008A (ko) 2016-06-08

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