WO2010013610A1 - 平面アンテナ - Google Patents
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- WO2010013610A1 WO2010013610A1 PCT/JP2009/062969 JP2009062969W WO2010013610A1 WO 2010013610 A1 WO2010013610 A1 WO 2010013610A1 JP 2009062969 W JP2009062969 W JP 2009062969W WO 2010013610 A1 WO2010013610 A1 WO 2010013610A1
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- dielectric layer
- ground
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
Definitions
- the present invention relates to a planar antenna used for a wireless communication device or the like.
- a flat antenna having a patch antenna structure in which a ground conductor and a rectangular (rectangular or square) or circular antenna conductor are formed on a dielectric substrate is widely used.
- the resonance frequency is determined by the size of the antenna conductor and the dielectric constant of the dielectric substrate. In general, the lower the frequency band to be used, the larger the size of the antenna conductor, requiring a wider mounting area. In order to reduce the size of the antenna, the resonance frequency may be lowered without changing the size of the antenna conductor.
- FIG. 1 of Patent Document 1 proposes a built-in antenna for the purpose of miniaturization, high performance, high integration, and the like.
- This built-in antenna includes a microstrip antenna 1 having an antenna pattern 12 formed on a printed board 11 and a dielectric substrate 2 disposed on the surface of the microstrip antenna 1.
- FIG. 1 of Patent Document 2 proposes a planar antenna device for reducing the resonance frequency and miniaturizing the antenna.
- the planar antenna device includes a capacitor electrode portion 8 extending substantially at right angles from an outer edge portion of the radiating conductor layer 7 functioning as an antenna, a ground conductor layer 10 facing the radiating conductor layer 7 at a predetermined interval, A metal case 2 having an upper opening 2a for projecting the radiation conductor layer 7 and electrically connected to the ground conductor layer 10 is provided.
- the side wall portion 2b of the metal case 2 that operates as an electrical ground is disposed outside the capacitor electrode portion 8 so as to be opposed to each other, and the side wall portion 2b and the capacitor electrode portion 8 are capacitively coupled. Has been.
- FIG. 2 of Patent Document 4 proposes a chip antenna 10 for the purpose of widening and downsizing the chip antenna.
- the chip antenna 10 includes a rectangular parallelepiped base 11 having a mounting surface 111, and a power supply electrode 12 and a ground electrode 13 are provided on the surface of the base 11.
- a second dielectric substrate is required in addition to the printed circuit board (dielectric substrate) on which the microstrip antenna is formed.
- the resonance frequency is lowered by the wavelength shortening effect of the electric field in the second dielectric substrate described above.
- an antenna conductor and a ground conductor formed on a dielectric substrate are electromagnetically strongly coupled, and an electric field is not easily concentrated on the second dielectric substrate.
- the second dielectric substrate has a dielectric constant that is several to several tens of times greater than that of the first dielectric substrate, and is electrically Therefore, it is necessary to form the second dielectric substrate so as to have a thickness that cannot be ignored.
- An object of the present invention is to solve the above-described problems, and one of the objects is to reduce the resonance frequency of the antenna conductor without using a special material or structure, thereby enabling miniaturization and high integration. Is to provide a flat antenna.
- a planar antenna includes a first dielectric layer and a second dielectric layer, and a first dielectric layer and a second dielectric layer.
- the first dielectric layer is disposed so as to be sandwiched between the antenna conductor and the ground conductor.
- the second dielectric layer is disposed between one of the antenna conductor and the ground conductor and the pad conductor.
- the planar antenna includes a connection conductor that electrically connects the other of the antenna conductor and the ground conductor to the pad conductor.
- a planar antenna according to a second aspect of the present invention includes a first dielectric layer, a second dielectric layer, and a third dielectric layer, a first dielectric layer, a second dielectric layer, And an antenna conductor, a ground conductor, a first pad conductor, and a second pad conductor provided so as to sandwich the third dielectric layer in the stacking direction.
- the first dielectric layer is disposed between the antenna conductor and the ground conductor.
- the second dielectric layer is disposed between one of the antenna conductor and the ground conductor and the pad conductor.
- the third dielectric layer is disposed between the other of the antenna conductor and the ground conductor and the pad conductor.
- the planar antenna includes a first connection conductor that electrically connects the other of the antenna conductor and the ground conductor and the first pad conductor, one of the antenna conductor and the ground conductor, and a second pad conductor.
- a second connection conductor for electrical connection.
- the resonance frequency of the antenna conductor can be lowered, and as a result, the planar antenna can be reduced in size. Can be realized.
- planar antenna According to the planar antenna according to the second aspect of the present invention, two capacitances (first capacitance and second capacitance) are added between the antenna conductor and the ground conductor, as in the first aspect. Therefore, the resonance frequency of the antenna conductor can be reduced, and as a result, the planar antenna can be reduced in size.
- the non-conductive portion is provided in the antenna conductor or the ground conductor, and the ground conductor or the antenna conductor and the pad conductor are provided with a simple connection structure.
- the connection conductor can electrically connect the ground conductor or the antenna conductor and the pad conductor via the non-conductive portion, and the manufacturing cost of the planar antenna can be reduced.
- planar antenna of 1st Embodiment It is a disassembled perspective view which shows the planar antenna of 1st Embodiment.
- the planar antenna of 1st Embodiment it is a perspective view which shows the connection form by a connection conductor.
- a disassembled perspective view which shows the other structure of the planar antenna of 1st Embodiment.
- FIG. 1 It is a disassembled perspective view which shows other structure of the planar antenna of 1st Embodiment. It is a perspective view which shows the connection form by a connection conductor in other structure of the planar antenna of 1st Embodiment. It is a disassembled perspective view which shows other structure of the planar antenna of 1st Embodiment. It is a perspective view which shows the connection form by a connection conductor in other structure of the planar antenna of 1st Embodiment. It is a disassembled perspective view which shows the planar antenna of 2nd Embodiment. It is a perspective view which shows the connection form by a connection conductor in the planar antenna of 2nd Embodiment. FIG.
- FIG. 5 is an exploded perspective view showing a planar antenna having a patch antenna structure in which an antenna conductor and a ground conductor are formed on a dielectric substrate. It is a disassembled perspective view which shows the electromagnetic field simulation model of the planar antenna which concerns on this invention. It is a top view which shows the arrangement
- planar antenna of the embodiment will be described with reference to the drawings.
- the planar antenna according to the present invention is provided so as to sandwich the first dielectric layer 1 and the second dielectric layer 2 and the first dielectric layer 1 and the second dielectric layer 2 in the stacking direction, respectively.
- the planar antennas 10A, 10B, 10C, and 10D (the planar antenna according to the first aspect.
- the “planar antenna according to the first embodiment”) including the antenna conductor 4, the ground conductor 5, and the pad conductor 6. (See FIGS. 1, 2, 4 and 5).
- the planar antenna according to the present invention includes a first dielectric layer 1, a second dielectric layer 2, and a third dielectric layer 3, and these first dielectric layer 1 and second dielectric layer.
- FIGS. 1A and 1B, FIGS. 2A and 2B, FIGS. 4A and 4B, and FIGS. 5A and 5B are schematic configuration diagrams illustrating examples of the planar antenna according to the first embodiment.
- 1A, 2A, 4A, and 5A are exploded perspective views
- FIGS. 1B, 2B, 4B, and 5B are perspective views of connection forms using connection conductors.
- the planar antenna of the first embodiment is configured such that the antenna conductor 4 and the ground conductor 5 face each other with the first dielectric layer 1 in between.
- One of the conductor 4 and the ground conductor 5 ”and the pad conductor 6 are arranged to face each other with the second dielectric layer 2 interposed therebetween, and“ the other of the antenna conductor 4 and the ground conductor 5 ”and the pad conductor 6 are connected to each other. 7 to be electrically connected.
- one of the antenna conductor 4 and the ground conductor 5 refers to one of the antenna conductor 4 and the ground conductor 5, and “the other of the antenna conductor 4 and the ground conductor 5” is the other.
- One of the things For example, when “one of the antenna conductor 4 and the ground conductor 5” is the antenna conductor 4, “the other of the antenna conductor 4 and the ground conductor 5” becomes the ground conductor 5, and conversely, “the antenna conductor 4 and the ground conductor 5”. If “one of the two” is the ground conductor 5, “the other of the antenna conductor 4 and the ground conductor 5” is the antenna conductor 4.
- the antenna conductor 4 and the pad conductor 6 are arranged with capacitance (second dielectric layer 2), and “the other of the antenna conductor 4 and the ground conductor 5” and the pad conductor 6 are electrically connected by the connection conductor 7. Since they are connected, the above-described capacitance is added between the antenna conductor 4 and the ground conductor 5. The capacitance acts on the voltage between the antenna conductor 4 and the ground conductor 5. For this reason, by electrically connecting the pad conductor to “the other of the antenna conductor 4 and the ground conductor 5”, the resonance frequency can be effectively reduced, and the planar antenna can be reduced in size.
- FIGS. 1A, 1B, 2A, 2B, 4A, 4B, 5A, and 5B will be described in detail.
- FIG. 1A and 1B are schematic configuration diagrams illustrating an example of a planar antenna 10A according to the first embodiment.
- 2A and 2B are schematic configuration diagrams illustrating another example of the planar antenna 10B according to the first embodiment.
- 1A and 2A are exploded perspective views, and FIGS. 1B and 2B are perspective views showing an electrical connection state between the pad conductor 6 and the ground conductor 5.
- FIG. The planar antennas 10A and 10B shown in FIG. 1A and FIG. 2A have a ground conductor 5, a first dielectric layer 1, an antenna conductor 4, a second dielectric layer 2, and a pad conductor from the bottom to the top in the drawings. They are arranged in the order of 6.
- the first dielectric layer 1 is sandwiched between the antenna conductor 4 and the ground conductor 5, and the second dielectric layer 2 is sandwiched between the antenna conductor 4 and the pad conductor 6.
- the ground conductor 5 and the pad conductor 6 are electrically connected by the connection conductor 7.
- the ground conductor 5 and the antenna conductor 4 are respectively disposed on both surfaces of the first dielectric layer 1, and the antenna conductor 4 and the pad conductor 6 are disposed on both surfaces of the second dielectric layer 2.
- the ground conductor 5 and the pad conductor 6 are electrically connected by the connection conductor 7.
- Examples of the material of the antenna conductor 4, the ground conductor 5, and the pad conductor 6 include copper, aluminum, and other materials commonly used as conductor materials for planar antennas.
- Examples of the material of the first dielectric layer 1 and the second dielectric layer 2 include a resin-based material used for a printed board and a ceramic-based material used for a dielectric substrate. .
- the size, shape, thickness, etc. of each of the conductors 4, 5, 6 and the dielectric layers 1, 2 may be considered so as to obtain a desired resonance frequency, and are not particularly limited. May be set to a size, a shape, a thickness, and the like.
- the antenna conductor 4 is formed in a square shape (square or rectangular shape) and is smaller than the ground conductor 5.
- the pad conductors 6 are disposed at both ends of the antenna conductor 4 in the X-axis direction, and are formed with a predetermined width so as to extend in the Y-axis direction.
- the pad conductor 6 is formed in a strip shape extending linearly in the Y-axis direction in the configuration example shown in FIG. 1A, and is divided into a plurality of square shapes in the configuration example shown in FIG. It is arranged in the axial direction.
- connection conductor 7 is not particularly limited as long as it is a structure that electrically connects the ground conductor 5 and the pad conductor 6.
- the connection conductor 7 is formed as a columnar conductor. Is preferred.
- the material of the connection conductor 7 include conductive materials such as copper and aluminum.
- Such a connection conductor 7 is preferably in the form of a so-called “via” in which wiring layers inside the multilayer wiring board are electrically connected through a through hole.
- a via is formed, for example, in the first dielectric layer 1 or the second dielectric layer 2 by a plating means (electroless plating, electrolytic plating, etc.), and further filled with the through hole. Can be formed.
- connection conductor 7 penetrates the antenna conductor 4 in the stacking direction in order to electrically connect the ground conductor 5 and the pad conductor 6.
- the antenna conductor 4 is preferably provided with a non-conductive portion 8 (also referred to as a clearance hole) for preventing contact with the connection conductor 7, and the connection conductor 7 passes through the non-conductive portion 8.
- a non-conductive portion 8 is formed with a via (connection conductor 7) after the above-described through hole is formed, an electrical hole shape is formed by removing the conductor portion around the via by etching or the like. It can be formed by using a (cylindrical shape in which electricity does not flow).
- connection conductors 7 are electrically connected to the ground conductor 5 as shown in FIG. 1B.
- connection conductors 7 are provided corresponding to the respective pad conductors 6 (6a1... 6an, 6b1... 6bn). Is electrically connected to the ground conductor 5 as shown in FIG.
- the ground conductor 5 and the pad conductor 6 are electrically connected in the stacking direction via a non-conductive portion 8 provided in the antenna conductor 4. For this reason, the connection distance between the ground conductor 5 and the pad conductor 6 is relatively short and the connection structure is simple. Further, by using a connection member such as a through hole or a via as described above, The pad conductor 6 can be easily connected. As a result, it is advantageous in providing a low-cost planar antenna. By adopting such a connection structure, a capacitance is added between the antenna conductor 4 and the ground conductor 5.
- the pad conductor 6 is preferably provided at a position where the voltage between the antenna conductor 4 and the ground conductor 5 is maximum at the resonance frequency of the antenna.
- the patch antenna 10 ⁇ / b> A of the present embodiment in which the rectangular antenna conductor 4 is disposed on the ground conductor 5 via the first dielectric layer 1, a half-wave voltage is applied between the antenna conductor 4 and the ground conductor 5.
- a fundamental resonance mode in which a standing wave is generated is mainly used.
- the voltage generated between the antenna conductor 4 and the ground conductor 5 is maximum in each region at both end portions farthest among the formation regions of the antenna conductor 4, and is minimum at the central portion between both end portions. become. That is, in the region where the antenna conductor 4 is formed, the voltage generated in each region at both ends where the separation distance is maximum is maximum, and the voltage generated in the central region between these both ends is minimum.
- a capacitance is added between the antenna conductor 4 and the ground conductor 5, and the capacitance acts on the voltage between the antenna conductor 4 and the ground conductor 5. For this reason, by arranging the pad conductor 6 at a position where the voltage between the antenna conductor 4 and the ground conductor 5 is maximized, the resonance frequency can be effectively reduced.
- FIGS. 1A and 1B is a configuration in the case of a fundamental resonance mode in which a half-wave voltage standing wave is generated between the antenna conductor 4 and the ground conductor 5, and the pad conductors 6a and 6b are connected to the planar antenna 10A.
- the regions where the antenna conductor 4 is formed as viewed in a plan view the regions at the farthest ends of the antenna conductor 4 (in FIG. 1A, the X-axis direction of the rectangular antenna conductor 4 (the horizontal direction in the figure)). Both ends are provided in a region extending in the Y-axis direction).
- planar antenna 10A when the planar antenna 10A is viewed in a plan view, in a region where the ground conductor 5 and the rectangular antenna conductor 4 overlap, a predetermined width is formed along opposite sides of the rectangular antenna conductor 4. Pad conductors 6a and 6b are provided.
- FIGS. 2A and 2B is a resonance mode in which a voltage standing wave of one wavelength is generated between the antenna conductor 4 and the ground conductor 5, and the pad conductors (6a1... 6an, 6b1... 6bn)
- the areas of the antenna conductor 4 that are the farthest away from each other in FIG. 2A, the X-axis direction of the rectangular antenna conductor 4 (FIG. (Regions extending in the Y-axis direction) at both ends in the middle and left-right direction).
- the pad conductors 6a and 6b having a predetermined width are formed at predetermined intervals along opposite sides of the rectangular antenna conductor 4. It is divided and provided.
- FIG. 3A shows a patch antenna in which a ground conductor 5 is formed on one surface (lower surface) of the first dielectric substrate 1 and a rectangular antenna conductor 4 is formed on the other surface (upper surface).
- FIG. 3B shows the voltage distribution in the TE10 mode
- FIG. 3C shows the voltage distribution in the TE20 mode.
- a fundamental resonance mode in which a half-wave voltage standing wave is generated between the antenna conductor 4 and the ground conductor 5 is mainly used.
- a voltage as shown in FIG. 3B is generated between the antenna conductor 4 and the ground conductor 5 in this basic resonance mode. That is, the patch antenna shown in FIG. 3A has no distribution with respect to the Y-axis direction.
- the voltage is maximum at both ends in the X-axis direction and the voltage is at the center in the X-axis direction.
- a voltage standing wave having a minimum half wavelength is generated.
- the capacitance arranged between the antenna conductor 4 and the pad conductor 6 (6a, 6b) is the pad conductor 6 and the ground conductor. 5 is electrically connected by the connecting conductor 7, and is added between the antenna conductor 4 and the ground conductor 5.
- the capacitance acts on the voltage between the antenna conductor 4 and the ground conductor 5. For this reason, the resonant frequency can be effectively lowered by arranging the pad conductor 6 at a position where the voltage generated between the antenna conductor 4 and the ground conductor 5 becomes maximum at the resonant frequency of the antenna.
- 2A and 2B are examples of a fundamental resonance mode in which a half-wave voltage standing wave is generated between the antenna conductor 4 and the ground conductor 5, but the X of the antenna conductor 4 that maximizes the voltage is shown.
- Opposing pad conductors 6a and 6b are formed at both ends in the axial direction.
- the pad conductor 6 may be formed so that a capacitance is added at a position where the voltage at the time of resonance is maximized, as described above.
- the pad conductor 6 may be formed so that a capacitance is added at a position where the voltage at the time of resonance is maximized, as described above.
- the pad conductor 6 may be formed so that a capacitance is added at a position where the voltage at the time of resonance is maximized, as described above.
- the pad conductor 6 may be formed so that a capacitance is added at a position where the voltage at the time of resonance is maximized, as described above.
- FIG. 3C in a resonance mode in which a voltage standing wave of one wavelength is generated between the antenna conductor 4 and the ground conductor 5, the voltage between the antenna conductor 4 and the ground conductor 5 is the maximum.
- the positions to be are the both end portions and the central portion between the both end portions. Therefore, like the planar antenna 10C shown in FIG.
- the pad conductors 6a and 6b are provided at both end portions that are farthest apart in the formation area of the antenna conductor 4, and the pad conductor 6c is also provided at the center portion between the both end portions. As a result, it is possible to effectively reduce the resonance frequency.
- the other configuration of the planar antenna 10C illustrated in FIG. 4A is the same as that of the planar antennas 10A and 10B illustrated in FIGS. 1A and 2A, and thus description thereof is omitted.
- FIG. 5A and 5B are exploded perspective views showing still another example of the planar antenna according to the first embodiment, FIG. 5A is an exploded perspective view, and FIG. 5B is a connection form between the pad conductor 6 and the antenna conductor 4.
- FIG. 10D shown in FIG. 5A the antenna conductor 4 and the ground conductor 5 are arranged to face each other with the first dielectric layer 1 interposed therebetween, and “one of the antenna conductor 4 and the ground conductor 5” and the pad conductor 6 Are arranged so as to face each other with the second dielectric layer 2 interposed therebetween, and “the other of the antenna conductor 4 and the ground conductor 5” and the pad conductor 6 are electrically connected by the connection conductor 7.
- This is conceptually the same as the planar antennas 10A, 10B, and 10C shown in FIGS. 1A, 2A, and 4A.
- FIG. 5A when viewed from the lower side toward the upper side, the pad conductor 6, the second dielectric layer 2, the ground conductor 5, the first dielectric layer 1, and the antenna conductor 4 are stacked in this order.
- the specific arrangement of the pad conductor 6 is different from the planar antennas 10A, 10B, and 10C shown in FIGS. 1A, 2A, and 4A.
- the antenna conductor 4 and the ground conductor 5 are the same as those in FIG. 1 in that the antenna conductor 4 and the ground conductor 5 are opposed to each other with the first dielectric layer 1 interposed therebetween.
- 1A and the like in that the antenna conductor 4 and the pad conductor 6 are electrically connected by the connection conductor 7.
- the ground conductor 5 is replaced with each other.
- the ground conductor 5 and the antenna conductor 4 are arranged on both surfaces of the first dielectric layer 1 in the same manner as shown in FIG.
- the ground conductor 5 and the pad conductor 6 are arranged on both surfaces, and the antenna conductor 4 and the pad conductor 6 are electrically connected by the connection conductor 7.
- the conductor 5 is replaced with each other.
- the configuration shown in FIG. 5A and the configuration shown in FIGS. 1A, 2A, and 4A are modes in which only the positional relationship between the antenna conductor 4 and the ground conductor 5 is exchanged.
- 5A the structure shown in FIG. 5A is the same as the structure shown in FIG. 1A.
- connection conductor 7 that electrically connects the antenna conductor 4 and the pad conductor 6 is provided so as to penetrate the ground conductor 5, and therefore, between the pad conductor 6 and the ground conductor 5.
- the first dielectric layer 1 functions as a capacitance added between the antenna conductor 4 and the ground conductor 5.
- the antenna conductor 4, the ground conductor 5, the pad conductor 6, the connection conductor 7, the non-conductive portion 8, and the like are the same as those shown in FIG.
- the effect of lowering the resonance frequency is obtained by the capacitance added between the antenna conductor 4 and the ground conductor 5.
- the same effect can be obtained regardless of whether the pad conductor 6 is formed opposite to the antenna conductor 4 or the ground conductor 5.
- the pad conductor 6 may be provided to face the antenna conductor 4 depending on the layer configuration of the printed circuit board and the configuration of the power feeding circuit to the antenna. Further, it may be provided so as to face the ground conductor 5, and the range of selection is expanded.
- FIG. 6A and 6B are schematic configuration diagrams showing an example of the planar antenna according to the second embodiment
- FIG. 6A is an exploded perspective view
- FIG. 6B is a connection structure between the first pad conductor and the ground conductor
- FIG. It is a perspective view which shows the connection structure of an antenna conductor and a 2nd pad conductor.
- the planar antenna 10E of the second embodiment has an antenna conductor so as to sandwich the first dielectric layer 1, the second dielectric layer 2, and the third dielectric layer 3, respectively. 4, a ground antenna 5, a first pad conductor 6, and a second pad conductor 9.
- the antenna conductor 4 and the ground conductor 5 are arranged to face each other with the first dielectric layer 1 interposed therebetween, and “one of the antenna conductor 4 and the ground conductor 5” and the first pad conductor 6 are the second. Are disposed opposite to each other with the dielectric layer 9 therebetween.
- “the other of the antenna conductor 4 and the ground conductor 5” and the first pad conductor 6 are electrically connected by the first connection conductor 7, and “the other of the antenna conductor 4 and the ground conductor 5” and the first
- the two pad conductors 9 are arranged to face each other with the third dielectric layer 3 interposed therebetween, and “one of the antenna conductor 4 and the ground conductor 5” and the second pad conductor 9 are the second connection conductors 7.
- one of the antenna conductor 4 and the ground conductor 5 refers to one of the antenna conductor 4 and the ground conductor 5, and “the other of the antenna conductor 4 and the ground conductor 5”. Means the other one which is not one of the above.
- the voltage between the antenna conductor 4 and the ground conductor 5 facing each other across the first dielectric layer 1 is maximum.
- the second dielectric layer 2 (which becomes the first capacitance) is disposed between “one of the antenna conductor 4 and the ground conductor 5” and the “first pad conductor 6”.
- a third dielectric layer 3 (which becomes a second capacitance) is disposed between “the other of the antenna conductor 4 and the ground conductor 5” and the “second pad conductor 9”.
- the “one pad conductor 6” is electrically connected to “the other of the antenna conductor 4 and the ground conductor 5” by the connection conductor 7, and “the second pad conductor 9” is “one of the antenna conductor 4 and the ground conductor 5”. Connected electrically with connecting conductor 7 ' To have. Therefore, the first capacitance is added between the antenna conductor 4 and the ground conductor 5. On the other hand, a second capacitance is also added between the antenna conductor 4 and the ground conductor 5. Further, since the first capacitance and the second capacitance act on the voltage generated between both the antenna conductor 4 and the ground conductor 5, the first pad conductor 6 is “the antenna conductor 4 and the ground conductor”. 5 ”and the second pad conductor 9 is electrically connected to“ one of the antenna conductor 4 and the ground conductor 5 ”, thereby effectively reducing the resonance frequency. The downsizing of the planar antenna can be realized.
- the planar antenna 10E shown in FIG. 6A includes a second pad conductor 9, a third dielectric layer 3, a ground conductor 5, and a first dielectric layer from the bottom to the top in the drawing. 1, the antenna conductor 4, the second dielectric layer 2, and the first pad conductor 6 are laminated in this order.
- the first dielectric layer 1 is disposed between the antenna conductor 4 and the ground conductor 5
- the second dielectric layer 2 is disposed between the antenna conductor 4 and the first pad conductor 6.
- the third dielectric layer 3 is sandwiched and disposed between the ground conductor 5 and the second pad conductor 9.
- the ground conductor 5 and the first pad conductor 6 are electrically connected by the connection conductor 7, and the antenna conductor 4 and the second pad conductor 9 are electrically connected by the connection conductor 7 '.
- the ground conductor 5 and the antenna conductor 4 are respectively disposed on both surfaces of the first dielectric layer 1, and the antenna conductor 4 and the first pad conductor 6 are respectively disposed on both surfaces of the second dielectric layer 2.
- the ground conductor 5 and the second pad conductor 9 are respectively disposed on both surfaces of the third dielectric layer 3.
- the ground conductor 5 and the first pad conductor 6 are electrically connected by the connection conductor 7, and the antenna conductor 4 and the second pad conductor 9 are electrically connected by the connection conductor 7 '.
- the components constituting the planar antenna of the second embodiment are the same as those of the planar antenna of the first embodiment described above.
- the antenna conductor 4, the ground conductor 5, the first pad conductor 6, and the second Examples of the material of the pad conductor 9 include copper, aluminum, and other materials generally used as a conductor material for a planar antenna.
- the first dielectric layer 1, the second dielectric layer 2, and the third dielectric layer 3 may be made of a resin material used for a printed circuit board or a dielectric substrate, for example. Examples thereof include ceramic materials.
- the size, shape, thickness, and the like are not particularly limited as long as a desired resonance frequency can be obtained, and can be set to various sizes, shapes, thicknesses, and the like. .
- the first pad conductor 6 provided on the upper surface of the second dielectric layer 2 is arranged in the X-axis direction of the antenna conductor 4 (FIG. 1A, FIG. 4A and the like) are formed in a square shape divided into a plurality of portions in the Y-axis direction.
- a total of 2n pieces are provided at each end, and constitute a first pad conductor 6 (6a1... 6an, 6b1... 6bn).
- each of the first pad conductors 6 (6a1... 6an, 6b1... 6bn) is provided with a connection conductor 7, and the plurality of connection conductors 7 are connected to the antenna as shown in FIG.
- the non-conductive portion 8 of the conductor 4 is penetrated and electrically connected to the ground conductor 5.
- the third pad conductor 9 provided on the lower surface of the third dielectric layer 3 is located in a central region between both ends of the antenna conductor 4 in the X-axis direction (see FIGS. 1A, 4A, etc.) It is formed in a square shape divided into a plurality in the Y-axis direction.
- n pieces are provided in a central region of the central portion, and constitute a third pad conductor 9 (9a1... 9an).
- each of the third pad conductors 9 (9a1... 9an) provided on the lower surface of the third dielectric layer 3 is provided with a connection conductor 7 ′, and the plurality of connection conductors 7 are provided. 'Is electrically connected to the antenna conductor 4 through the non-conductive portion 8' of the ground conductor 5 as shown in FIG. 6B.
- the first pad conductors 6a and 6b provided on the upper surface of the second dielectric layer 2 are positions where the voltage between the antenna conductor 4 and the ground conductor 5 becomes maximum. That is, the antenna conductor 4 is provided at a position facing each of the regions at the farthest ends in the region where the antenna conductor 4 is formed. Even if this position is a fundamental resonance mode in which a half-wave voltage standing wave is generated between the antenna conductor 4 and the ground conductor 5, a one-wave voltage standing wave is generated between the antenna conductor 4 and the ground conductor 5. Even in a resonance mode in which the voltage occurs, the voltage is at a maximum position.
- the first capacitance acts on the voltage between the antenna conductor 4 and the ground conductor 5.
- the second pad conductor 9 provided on the lower surface of the third dielectric layer 3 is provided in a central region between both ends of the antenna conductor 4 in the X-axis direction (see FIGS. 1A, 4A, etc.). However, this region is a position where the maximum is the same as the voltage at both ends in the resonance mode in which a voltage standing wave of one wavelength is generated between the antenna conductor 4 and the ground conductor 5.
- the second capacitance (third dielectric layer 3) disposed between the ground conductor 5 and the second pad conductor 9 is such that the antenna conductor 4 and the second pad conductor 9 are connected conductors 7 ′.
- the resonance frequency is effectively lowered by providing the second pad conductor 9 in the central region where the voltage between the antenna conductor 4 and the ground conductor 5 is maximized. be able to.
- connection conductor 7 that penetrates in the stacking direction via a non-conductive portion 8 provided in the antenna conductor 4.
- the second pad conductor 9 is electrically connected by a connection conductor 7 ′ penetrating in the stacking direction via a nonconductive portion 8 ′ provided in the ground conductor 5.
- this embodiment has a short connection distance and a simple connection structure, and can be easily connected using connection members such as through holes and vias, as in the planar antenna of the first embodiment. .
- connection structures of the second embodiment functions to add capacitance between the antenna conductor 4 and the ground conductor 5.
- connection conductors 7 and 7 ′ and the non-conductive portions 8 and 8 ′ have the same configuration as that of the planar antenna according to the first embodiment described above, and thus description thereof is omitted.
- the first capacitance and the second capacitance are added between the antenna conductor 4 and the ground conductor 5, the first implementation in which one capacitance is added.
- the capacitance can be increased as compared with the planar antenna of the form, the resonance frequency can be more effectively reduced, and further downsizing of the planar antenna can be realized.
- the planar antenna according to the first and second embodiments of the present invention includes the pad conductor and the antenna according to the size, shape, and arrangement position of the pad conductor, and the thickness and dielectric constant of the dielectric layer forming the pad conductor. By changing the capacitance formed between the conductor and the ground conductor, it is possible to control the reduction rate of the resonance frequency.
- FIG. 7 is an exploded perspective view showing a planar antenna having a patch antenna structure in which an antenna conductor 4 and a ground conductor 5 are formed on a dielectric substrate (hereinafter referred to as a dielectric substrate 1) which is the first dielectric layer 1. It is.
- FIG. 8 is an exploded perspective view showing an electromagnetic field simulation model of the planar antenna according to the present invention.
- 9A, 9B, and 9C are plan views showing an arrangement pattern of the pad conductor 6.
- FIG. 9A shows an example (hereinafter referred to as “pattern 1”) in which there are six first pad conductors in total.
- FIG. 9B shows an example (hereinafter referred to as “pattern 2”) in which there are a total of ten first pad conductors.
- FIG. 9C shows an example (hereinafter referred to as “pattern 3”) having a total of 14 first pad conductors.
- a ground conductor 5 having a size of 50 mm ⁇ 50 mm is formed on the bottom surface of the dielectric substrate 1 having a size of 50 mm ⁇ 50 mm and a thickness t 1.
- An antenna conductor 4 having a size of 30 mm ⁇ 30 mm is formed at the center of the upper surface.
- the dielectric substrate 1 is made of a fluororesin substrate and has a relative dielectric constant of “2.4” and a dielectric loss tangent of “0.002”.
- a 50 ⁇ resistor and a voltage source are connected in series between the antenna conductor 4 and the ground conductor 5 to form a power feeding unit for the antenna.
- the patch antenna is used in a fundamental mode that generates a half-wave voltage standing wave in the X-axis direction, and the X-axis direction of the antenna conductor 4 is used in order to match the resistance of the feeder and the input impedance of the antenna.
- a signal source connection position P is provided at the center, which is a position 10.5 mm from the end and 15 mm from the end in the Y-axis direction.
- FIG. 8 is an exploded perspective view showing the planar antenna of the present embodiment.
- a second dielectric layer 2 having a thickness t2 is formed on the top of the antenna conductor 4, and the X-axis direction of the antenna conductor 4 at which the voltage becomes maximum at the time of resonance.
- An example is shown in which a plurality of square pad conductors 6 having a size (d ⁇ d) are arranged on the upper surface of the second dielectric layer 2 facing both ends.
- FIGS. 9A to 9C There are three types of pad conductors 6 shown in FIGS. 9A to 9C, which are referred to as patterns 1 to 3, respectively.
- connection conductor 7 that passes through the antenna conductor 4 via the nonconductive portion 8 of the antenna conductor 4, as in FIG. 1B.
- the diameter of the connecting conductor 7 is 0.3 mm, and the diameter of the nonconductive portion 8 (clearance hole) is 1.0 mm.
- the power reflection coefficient which is the ratio of the input power from the signal source to the reflected power
- FDTD Finite Difference Time Domain
- the simulation results for the arrangement patterns 1 to 3 of the pad conductor 6 (corresponding to FIGS. 9A to 9C, respectively) are shown.
- the arrangement of the pad conductors 6 corresponds to pattern 1 (corresponding to FIG. 9A).
- This is a simulation result for the size d 3 mm, 5 mm, and 7 mm of the pad conductor 6.
- the arrangement of the pad conductor 6 is the same as the configuration shown in FIG. 13.
- FIGS. 10 to 15 show only the results near the resonance frequency in the fundamental mode among the simulated power reflection coefficients.
- the frequency that minimizes the power reflection coefficient is the resonance frequency.
- the second dielectric layer 2 is thinned, that is, the pad conductors 6 and the antenna conductors 4
- the resonance frequency decreases as the capacitance formed between the two increases. Further, as shown in FIGS. 13 to 15, even if the capacitance between the pad conductor 6 and the antenna conductor 4 is the same, the thickness of the dielectric layer 1 between the antenna conductor 4 and the ground conductor 5 is the same. The greater the is, the greater the degree of decrease in the resonance frequency.
- the rate of decrease in the resonance frequency can be increased. Adjustable.
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Abstract
Description
図1A,1B、図2A,2B、図4A,4B及び図5A,5Bは、第1の実施形態の平面アンテナの例を示す概略構成図である。図1A,2A,4A,5Aは分解斜視図であり、図1B,2B,4B,5Bは接続導体による接続形態の斜視図である。
図6A,6Bは、第2の実施形態の平面アンテナの一例を示す概略構成図であり、図6Aは分解斜視図であり、図6Bは第1のパッド導体とグラウンド導体との接続構造、及びアンテナ導体と第2のパッド導体との接続構造を示す斜視図である。第2の実施形態の平面アンテナ10Eは、図6Aに示すように、第1の誘電体層1と第2の誘電体層2と第3の誘電体層3とをそれぞれ挟むように、アンテナ導体4とグラウンド導体5と第1のパッド導体6と第2のパッド導体9とが設けられた平面アンテナである。そして、アンテナ導体4とグラウンド導体5とが第1の誘電体層1を挟んで対向して配置され、「アンテナ導体4及びグラウンド導体5の一方」と、第1のパッド導体6とが第2の誘電体層9を挟んで対向して配置されている。また、「アンテナ導体4及びグラウンド導体5の他方」と、第1のパッド導体6とが第1の接続導体7によって電気的に接続され、「アンテナ導体4及びグラウンド導体5の他方」と、第2のパッド導体9とが第3の誘電体層3を挟んで対向して配置され、「アンテナ導体4及びグラウンド導体5の一方」と、第2のパッド導体9とが第2の接続導体7’によって電気的に接続されているように構成されている。なお、上述と同様に、「アンテナ導体4及びグラウンド導体5の一方」とは、アンテナ導体4及びグラウンド導体5のうちのいずれか一方を指しており、「アンテナ導体4及びグラウンド導体5の他方」とは、上記一方ではない他の一方を指している。
以下、平面アンテナによる共振周波数の低下に関するシミュレーションを行い、その結果を参照して、本発明についてさらに詳しく説明する。
図7は、第1の誘電体層1である誘電体基板(以下、誘電体基板1と称する)に、アンテナ導体4とグラウンド導体5が形成されたパッチアンテナ構造の平面アンテナを示す分解斜視図である。図8は、本発明に係る平面アンテナの電磁界シミュレーションモデルを示す分解斜視図である。図9A,9B、9Cは、パッド導体6の配置パターンを示す平面図である。図9Aに、第1のパッド導体が計6個である例(以下「パターン1」と呼ぶ。)を示す。図9Bに、第1のパッド導体が計10個である例(以下「パターン2」と呼ぶ。)を示す。図9Cに、第1のパッド導体が計14個である例(以下「パターン3」と呼ぶ。)を示す。
図10は、誘電体基板1の厚さをt1=1.6mmとし、第2の誘電体層2の厚さをt2=0.2mmとし、パッド導体6の一辺の長さをd=3mmとしたとき、パッド導体6の配置パターン1~3(図9A~図9Cにそれぞれ対応する。)に対するシミュレーション結果である。図10において、波形11は、図8に示したシミュレーションモデルのt1=1.6mmにおける電力反射係数を示している。波形21は、図9Aに示したシミュレーションモデルのパターン1、t1=1.6mm、t2=0.2mm、d=3mmにおける電力反射係数を示している。波形22は、図9Bに示したシミュレーションモデルのパターン2、t1=1.6mm、t2=0.2mm、d=3mmにおける電力反射係数を示している。波形23は、図9Cに示したシミュレーションモデルのパターン3、t1=1.6mm、t2=0.2mm、d=3mmにおける電力反射係数を示している。
2 第2の誘電体層
3 第3の誘電体層
4 アンテナ導体
5 グラウンド導体
6 パッド導体(第1のパッド導体)
7,7’ 接続導体
8,8’ 非導電部
9 パッド導体(第2のパッド導体)
10A,10B,10C,10D,10E 平面アンテナ
Claims (13)
- 第1の誘電体層及び第2の誘電体層と、
前記第1の誘電体層及び前記第2の誘電体層を積層方向にそれぞれ挟むように設けられた、アンテナ導体、グラウンド導体、及びパッド導体と、を備え、
前記第1の誘電体層は、前記アンテナ導体と前記グランド導体との間に挟まれて配置され、
前記第2の誘電体層は、前記アンテナ導体及び前記グランド導体の一方と、前記パッド導体との間に挟まれて配置され、
前記アンテナ導体及び前記グラウンド導体の他方と、前記パッド導体とを電気的に接続する接続導体を備える平面アンテナ。 - 前記アンテナ導体には非導電部が設けられ、
前記接続導体は、前記非導電部を経由して前記アンテナ導体を積層方向に貫通し、前記グラウンド導体と前記パッド導体とを電気的に接続している、請求項1に記載の平面アンテナ。 - 前記グラウンド導体には非導電部が設けられ、
前記接続導体は、前記非導電部を経由して前記グラウンド導体を積層方向に貫通し、前記アンテナ導体と前記パッド導体とを電気的に接続している、請求項1に記載の平面アンテナ。 - 複数の前記パッド導体を備え、
前記接続導体が前記複数のパッド導体それぞれに電気的に接続されて設けられている、請求項1ないし3のいずれか1項に記載の平面アンテナ。 - 前記パッド導体は、アンテナの共振周波数において、前記アンテナ導体と前記グラウンド導体との間の電圧が最大となる位置に設けられている、請求項1ないし4のいずれか1項に記載の平面アンテナ。
- 前記パッド導体が、前記第1及び第2誘電体層を挟んで対向する前記アンテナ導体の形成領域において最も離間した両端部の各領域に設けられている、請求項5に記載の平面アンテナ。
- 更に他のパッド導体が、前記最も離間した両端部間の中央部の領域にも設けられている、請求項6に記載の平面アンテナ。
- 第1の誘電体層、第2の誘電体層、及び第3の誘電体層と、
前記第1の誘電体層、前記第2の誘電体層、及び前記第3の誘電体層を積層方向にそれぞれ挟むように設けられた、アンテナ導体、グラウンド導体、第1のパッド導体、及び第2のパッド導体と、を備え、
前記第1の誘電体層は、前記アンテナ導体と前記グラウンド導体との間に挟まれて配置され、
前記第2の誘電体層は、前記アンテナ導体及び前記グランド導体の一方と、前記パッド導体との間に挟まれて配置され、
前記第3の誘電体層は、前記アンテナ導体及び前記グランド導体の他方と、前記パッド導体との間に挟まれて配置され、
前記アンテナ導体及び前記グラウンド導体の他方と、前記第1のパッド導体とを電気的に接続する第1の接続導体と、
前記アンテナ導体及び前記グラウンド導体の一方と、前記第2のパッド導体とを電気的に接続する第2の接続導体と、を備える平面アンテナ。 - 前記アンテナ導体には非導電部が設けられ、
前記第1及び第2の接続導体は、前記非導電部を経由して前記アンテナ導体を積層方向に貫通し、前記グラウンド導体と前記第1及び第2のパッド導体とをそれぞれ電気的に接続している、請求項8に記載の平面アンテナ。 - 前記グラウンド導体には非導電部が設けられ、
前記第1及び第2の接続導体は、前記非導電部を経由して前記グラウンド導体を積層方向に貫通し、前記アンテナ導体と前記第1及び第2のパッド導体とをそれぞれ電気的に接続している、請求項8に記載の平面アンテナ。 - 前記第1及び第2のパッド導体は、アンテナの共振周波数において、前記アンテナ導体と前記グラウンド導体との間の電圧が最大となる位置に設けられている、請求項8ないし10のいずれか1項に記載の平面アンテナ。
- 前記第1、第2のパッド導体が、前記第1、第2及び第3の誘電体層を挟んで対向する前記アンテナ導体の形成領域において最も離間した両端部の各領域に設けられている、請求項11に記載の平面アンテナ。
- 更に他のパッド導体が、前記最も離間した両端部間の中央部の領域にも設けられている、請求項12に記載の平面アンテナ。
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JP2014075723A (ja) * | 2012-10-05 | 2014-04-24 | Yokowo Co Ltd | 路側アンテナ |
JP2018186349A (ja) * | 2017-04-24 | 2018-11-22 | 京セラ株式会社 | Rfidタグ用基板、rfidタグおよびrfidシステム |
WO2021124623A1 (ja) * | 2019-12-17 | 2021-06-24 | 株式会社村田製作所 | Rficモジュール及びrfidタグ |
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USD740261S1 (en) * | 2012-03-13 | 2015-10-06 | Megabyte Limited | Radio frequency tag |
US10122074B2 (en) * | 2014-11-19 | 2018-11-06 | Panasonic Intellectual Property Management Co., Ltd. | Antenna device using EBG structure, wireless communication device, and radar device |
JP6525249B2 (ja) * | 2015-03-20 | 2019-06-05 | カシオ計算機株式会社 | アンテナ装置及び電子機器 |
JP2019057832A (ja) * | 2017-09-21 | 2019-04-11 | 株式会社フジクラ | アンテナ装置 |
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US11211689B2 (en) | 2019-08-13 | 2021-12-28 | Samsung Electro-Mechanics Co., Ltd. | Chip antenna |
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