KR102160840B1 - 임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) - Google Patents

임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) Download PDF

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KR102160840B1
KR102160840B1 KR1020157008261A KR20157008261A KR102160840B1 KR 102160840 B1 KR102160840 B1 KR 102160840B1 KR 1020157008261 A KR1020157008261 A KR 1020157008261A KR 20157008261 A KR20157008261 A KR 20157008261A KR 102160840 B1 KR102160840 B1 KR 102160840B1
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periodic structure
target
overlay
layer
periodic
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KR20150053770A (ko
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누리엘 아미르
동섭 최
탈 이츠코비치
다니엘 칸델
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케이엘에이 코포레이션
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    • H01L22/12—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • H01L23/544—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
KR1020157008261A 2012-09-06 2013-09-05 임베디드 sem 구조물 오버레이 타겟을 갖는 ovl을 위한 디바이스 상관 계측(dcm) Active KR102160840B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261697503P 2012-09-06 2012-09-06
US61/697,503 2012-09-06
US13/776,550 US9093458B2 (en) 2012-09-06 2013-02-25 Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
US13/776,550 2013-02-25
PCT/US2013/058278 WO2014039689A1 (en) 2012-09-06 2013-09-05 Device correlated metrology (dcm) for ovl with embedded sem structure overlay targets

Publications (2)

Publication Number Publication Date
KR20150053770A KR20150053770A (ko) 2015-05-18
KR102160840B1 true KR102160840B1 (ko) 2020-09-29

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US (1) US9093458B2 (cg-RX-API-DMAC10.html)
JP (1) JP6320387B2 (cg-RX-API-DMAC10.html)
KR (1) KR102160840B1 (cg-RX-API-DMAC10.html)
TW (1) TWI594294B (cg-RX-API-DMAC10.html)
WO (1) WO2014039689A1 (cg-RX-API-DMAC10.html)

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KR20150053770A (ko) 2015-05-18
JP2015532733A (ja) 2015-11-12
US20140065736A1 (en) 2014-03-06
TWI594294B (zh) 2017-08-01
WO2014039689A1 (en) 2014-03-13
TW201419377A (zh) 2014-05-16
US9093458B2 (en) 2015-07-28
JP6320387B2 (ja) 2018-05-09

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