KR102159839B1 - 기판 액처리 장치 및 기류 이상 검출 방법 - Google Patents

기판 액처리 장치 및 기류 이상 검출 방법 Download PDF

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KR102159839B1
KR102159839B1 KR1020140023461A KR20140023461A KR102159839B1 KR 102159839 B1 KR102159839 B1 KR 102159839B1 KR 1020140023461 A KR1020140023461 A KR 1020140023461A KR 20140023461 A KR20140023461 A KR 20140023461A KR 102159839 B1 KR102159839 B1 KR 102159839B1
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South Korea
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cup
liquid
substrate
housing
pressure
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Korean (ko)
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KR20140111953A (ko
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노리히로 이토
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140023461A 2013-03-12 2014-02-27 기판 액처리 장치 및 기류 이상 검출 방법 Active KR102159839B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-048919 2013-03-12
JP2013048919A JP5833046B2 (ja) 2013-03-12 2013-03-12 基板液処理装置および気流異常検出方法

Publications (2)

Publication Number Publication Date
KR20140111953A KR20140111953A (ko) 2014-09-22
KR102159839B1 true KR102159839B1 (ko) 2020-09-24

Family

ID=51521618

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KR1020140023461A Active KR102159839B1 (ko) 2013-03-12 2014-02-27 기판 액처리 장치 및 기류 이상 검출 방법

Country Status (4)

Country Link
US (1) US9478445B2 (enExample)
JP (1) JP5833046B2 (enExample)
KR (1) KR102159839B1 (enExample)
TW (1) TWI562192B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6461617B2 (ja) 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6691836B2 (ja) * 2016-06-20 2020-05-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101853373B1 (ko) * 2016-08-01 2018-06-20 세메스 주식회사 기판 처리 장치
US10824175B2 (en) * 2017-07-28 2020-11-03 Stmicroelectronics, Inc. Air flow measurement using pressure sensors
JP6981092B2 (ja) * 2017-08-10 2021-12-15 東京エレクトロン株式会社 液処理装置
CN110021535A (zh) * 2018-01-10 2019-07-16 弘塑科技股份有限公司 基板处理装置及其旋转台
KR102121240B1 (ko) * 2018-05-03 2020-06-18 세메스 주식회사 기판 처리 장치 및 방법
JP2020035794A (ja) * 2018-08-27 2020-03-05 キオクシア株式会社 基板処理装置および半導体装置の製造方法
JP7027284B2 (ja) * 2018-09-07 2022-03-01 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
KR102790512B1 (ko) 2020-01-09 2025-04-08 주식회사 모원 진단 장치
CN111842021B (zh) * 2020-07-11 2021-05-25 吉林北方捷凯传动轴有限公司 传动轴移动端节护盖装配用自动涂胶及检测设备
JP7471171B2 (ja) 2020-08-17 2024-04-19 東京エレクトロン株式会社 基板処理装置
TWI770753B (zh) * 2021-01-04 2022-07-11 南亞科技股份有限公司 清洗裝置及清洗方法
KR20220131680A (ko) 2021-03-22 2022-09-29 세메스 주식회사 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118676A1 (en) 2002-12-19 2004-06-24 Dainippon Screen Mfg. Co., Ltd. Plating apparatus and plating method
JP2006332085A (ja) * 2005-05-23 2006-12-07 Mitsubishi Electric Corp スピン乾燥装置
JP2009059795A (ja) * 2007-08-30 2009-03-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102854A (ja) * 1985-10-29 1987-05-13 Dainippon Screen Mfg Co Ltd 回転処理装置
US5254367A (en) * 1989-07-06 1993-10-19 Tokyo Electron Limited Coating method and apparatus
JP2982439B2 (ja) * 1991-10-29 1999-11-22 東京エレクトロン株式会社 処理液塗布装置及び処理液塗布方法
JPH05136041A (ja) * 1991-11-14 1993-06-01 Nec Corp 薬液塗布装置
US5358740A (en) * 1992-06-24 1994-10-25 Massachusetts Institute Of Technology Method for low pressure spin coating and low pressure spin coating apparatus
JPH0878385A (ja) * 1994-09-06 1996-03-22 Hitachi Ltd 乾燥方法および乾燥装置
JPH09148231A (ja) 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
US7694650B2 (en) * 2002-09-04 2010-04-13 Taiwan Semiconductor Manufacturing Co. Exhaust monitoring cup
KR100632945B1 (ko) * 2004-07-01 2006-10-12 삼성전자주식회사 상승기류를 억제할 수 있는 스핀 공정 설비 및 스핀 공정설비의 배기량 제어 방법
US7322225B2 (en) * 2004-11-08 2008-01-29 Nec Electronics America, Inc. Adhesion promotion vacuum monitoring system for photo resist coaters
JP4912008B2 (ja) * 2006-03-29 2012-04-04 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040118676A1 (en) 2002-12-19 2004-06-24 Dainippon Screen Mfg. Co., Ltd. Plating apparatus and plating method
JP2006332085A (ja) * 2005-05-23 2006-12-07 Mitsubishi Electric Corp スピン乾燥装置
JP2009059795A (ja) * 2007-08-30 2009-03-19 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2014175581A (ja) 2014-09-22
US9478445B2 (en) 2016-10-25
TWI562192B (en) 2016-12-11
TW201447972A (zh) 2014-12-16
JP5833046B2 (ja) 2015-12-16
US20140261172A1 (en) 2014-09-18
KR20140111953A (ko) 2014-09-22

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