KR102156003B1 - 발잉크성 조성물, 네거티브형 감광성 수지 조성물, 경화막, 격벽, 및 광학 소자 - Google Patents

발잉크성 조성물, 네거티브형 감광성 수지 조성물, 경화막, 격벽, 및 광학 소자 Download PDF

Info

Publication number
KR102156003B1
KR102156003B1 KR1020157005779A KR20157005779A KR102156003B1 KR 102156003 B1 KR102156003 B1 KR 102156003B1 KR 1020157005779 A KR1020157005779 A KR 1020157005779A KR 20157005779 A KR20157005779 A KR 20157005779A KR 102156003 B1 KR102156003 B1 KR 102156003B1
Authority
KR
South Korea
Prior art keywords
group
compound
ink
photosensitive resin
partition wall
Prior art date
Application number
KR1020157005779A
Other languages
English (en)
Korean (ko)
Other versions
KR20150060689A (ko
Inventor
히데유키 다카하시
게이고 마츠우라
마사유키 가와시마
Original Assignee
에이지씨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이지씨 가부시키가이샤 filed Critical 에이지씨 가부시키가이샤
Publication of KR20150060689A publication Critical patent/KR20150060689A/ko
Application granted granted Critical
Publication of KR102156003B1 publication Critical patent/KR102156003B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/50—Sympathetic, colour changing or similar inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C08L33/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H01L51/0019—
    • H01L51/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020157005779A 2012-09-24 2013-09-19 발잉크성 조성물, 네거티브형 감광성 수지 조성물, 경화막, 격벽, 및 광학 소자 KR102156003B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012209084 2012-09-24
JPJP-P-2012-209084 2012-09-24
PCT/JP2013/075365 WO2014046209A1 (ja) 2012-09-24 2013-09-19 撥インク性組成物、ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子

Publications (2)

Publication Number Publication Date
KR20150060689A KR20150060689A (ko) 2015-06-03
KR102156003B1 true KR102156003B1 (ko) 2020-09-15

Family

ID=50341513

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005779A KR102156003B1 (ko) 2012-09-24 2013-09-19 발잉크성 조성물, 네거티브형 감광성 수지 조성물, 경화막, 격벽, 및 광학 소자

Country Status (5)

Country Link
JP (1) JP6065915B2 (zh)
KR (1) KR102156003B1 (zh)
CN (1) CN104684994B (zh)
TW (1) TWI649621B (zh)
WO (1) WO2014046209A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372956B1 (ko) * 2013-12-17 2022-03-10 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자
KR102378162B1 (ko) * 2014-04-25 2022-03-23 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 격벽 및 광학 소자
JP6317624B2 (ja) * 2014-05-22 2018-04-25 双葉電子工業株式会社 乾燥剤、封止構造及び有機ｅｌ素子
JP6593331B2 (ja) 2014-06-09 2019-10-23 Ａｇｃ株式会社 撥インク剤、ネガ型感光性樹脂組成物、隔壁および光学素子
CN111566560A (zh) * 2018-01-26 2020-08-21 三菱化学株式会社 感光性树脂组合物、间隔壁、有机场致发光元件、图像显示装置及照明
WO2022168829A1 (ja) * 2021-02-08 2022-08-11 セントラル硝子株式会社 撥液剤、硬化性組成物、硬化物、隔壁、有機電界発光素子、含フッ素塗膜の製造方法及び含フッ素塗膜
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203786A (ja) 2007-02-22 2008-09-04 Fujifilm Corp カラーフィルタ用感光性組成物、並びに感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、表示装置
JP2008249867A (ja) 2007-03-29 2008-10-16 Fujifilm Corp 感光性樹脂組成物、感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、並びに表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190951A (ja) * 1989-12-19 1991-08-20 Asahi Glass Co Ltd フルオロシリコーン重合体とフルオロアクリレート重合体からなる組成物
JP3512200B2 (ja) * 1996-11-18 2004-03-29 ダイキン工業株式会社 耐久性撥水剤及び塗装物品
EP1560068B1 (en) * 2002-11-06 2008-01-23 Asahi Glass Company Ltd. Barrier rib and its method of preparation
CN100524021C (zh) * 2003-03-07 2009-08-05 旭硝子株式会社 感光性树脂组合物及其涂膜固化物
KR20080078645A (ko) * 2005-12-15 2008-08-27 아사히 가라스 가부시키가이샤 함불소 중합체, 네거티브형 감광성 조성물 및 격벽
TWI459132B (zh) * 2008-07-03 2014-11-01 Asahi Glass Co Ltd A photosensitive composition, a partition wall, a color filter, and an organic EL element
JP5093352B2 (ja) * 2008-08-01 2012-12-12 旭硝子株式会社 ネガ型感光性組成物、それを用いた光学素子用隔壁および該隔壁を有する光学素子
EP2204392A1 (en) * 2008-12-31 2010-07-07 Rohm and Haas Electronic Materials LLC Compositions and processes for photolithography
WO2011081151A1 (ja) 2009-12-28 2011-07-07 旭硝子株式会社 感光性組成物、隔壁、カラーフィルタおよび有機ｅｌ素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203786A (ja) 2007-02-22 2008-09-04 Fujifilm Corp カラーフィルタ用感光性組成物、並びに感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、表示装置
JP2008249867A (ja) 2007-03-29 2008-10-16 Fujifilm Corp 感光性樹脂組成物、感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、並びに表示装置

Also Published As

Publication number Publication date
TWI649621B (zh) 2019-02-01
KR20150060689A (ko) 2015-06-03
JPWO2014046209A1 (ja) 2016-08-18
WO2014046209A1 (ja) 2014-03-27
CN104684994B (zh) 2016-08-24
TW201423277A (zh) 2014-06-16
JP6065915B2 (ja) 2017-01-25
CN104684994A (zh) 2015-06-03

Similar Documents

Publication Publication Date Title
JP6350287B2 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁及び光学素子
JP6398774B2 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
KR102156003B1 (ko) 발잉크성 조성물, 네거티브형 감광성 수지 조성물, 경화막, 격벽, 및 광학 소자
KR101842317B1 (ko) 네거티브형 감광성 수지 조성물, 경화막, 격벽 및 블랙 매트릭스와 그 제조 방법, 컬러 필터 그리고 유기 el 소자
JP6115471B2 (ja) ネガ型感光性樹脂組成物、隔壁、ブラックマトリックス及び光学素子
KR101420470B1 (ko) 감광성 조성물, 격벽, 블랙 매트릭스
JP6341093B2 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
JP6593331B2 (ja) 撥インク剤、ネガ型感光性樹脂組成物、隔壁および光学素子
JP6020557B2 (ja) ネガ型感光性樹脂組成物、硬化膜、隔壁および光学素子
WO2015093415A1 (ja) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁および光学素子
WO2014046210A1 (ja) 部分加水分解縮合物およびこれを用いた撥インク剤
KR102611589B1 (ko) 네거티브형 감광성 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant