KR102153655B1 - 멀티 하전 입자빔 묘화 장치 및 멀티 하전 입자빔 조정 방법 - Google Patents

멀티 하전 입자빔 묘화 장치 및 멀티 하전 입자빔 조정 방법 Download PDF

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KR102153655B1
KR102153655B1 KR1020180059599A KR20180059599A KR102153655B1 KR 102153655 B1 KR102153655 B1 KR 102153655B1 KR 1020180059599 A KR1020180059599 A KR 1020180059599A KR 20180059599 A KR20180059599 A KR 20180059599A KR 102153655 B1 KR102153655 B1 KR 102153655B1
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South Korea
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objective lens
aperture
opening
charged particle
stopping
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KR20180133792A (ko
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히로후미 모리타
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가부시키가이샤 뉴플레어 테크놀로지
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1471—Arrangements for directing or deflecting the discharge along a desired path for centering, aligning or positioning of ray or beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3175—Projection methods, i.e. transfer substantially complete pattern to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/043—Beam blanking
    • H01J2237/0432—High speed and short duration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/043—Beam blanking
    • H01J2237/0435—Multi-aperture
    • H01J2237/0437—Semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/049—Focusing means
    • H01J2237/0492—Lens systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/1501—Beam alignment means or procedures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H01J2237/1502—Mechanical adjustments

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electron Beam Exposure (AREA)
KR1020180059599A 2017-06-07 2018-05-25 멀티 하전 입자빔 묘화 장치 및 멀티 하전 입자빔 조정 방법 Active KR102153655B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017112753A JP6957998B2 (ja) 2017-06-07 2017-06-07 マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム調整方法
JPJP-P-2017-112753 2017-06-07

Publications (2)

Publication Number Publication Date
KR20180133792A KR20180133792A (ko) 2018-12-17
KR102153655B1 true KR102153655B1 (ko) 2020-09-08

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KR1020180059599A Active KR102153655B1 (ko) 2017-06-07 2018-05-25 멀티 하전 입자빔 묘화 장치 및 멀티 하전 입자빔 조정 방법

Country Status (4)

Country Link
US (1) US20180358203A1 (enExample)
JP (1) JP6957998B2 (enExample)
KR (1) KR102153655B1 (enExample)
TW (1) TWI684831B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023176194A (ja) * 2022-05-31 2023-12-13 株式会社日立ハイテク 荷電粒子ビーム装置、荷電粒子ビームシステム、調整方法
WO2024154185A1 (ja) * 2023-01-16 2024-07-25 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置
JP7619466B2 (ja) * 2023-01-16 2025-01-22 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053002A (ja) * 2006-08-23 2008-03-06 Sii Nanotechnology Inc 荷電粒子ビーム装置及びアパーチャの軸調整方法
JP2010267909A (ja) * 2009-05-18 2010-11-25 Nuflare Technology Inc 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
US20110204253A1 (en) * 2010-02-22 2011-08-25 Elmar Platzgummer Pattern definition device with multiple multibeam array
US20140175302A1 (en) * 2012-12-26 2014-06-26 Nuflare Technology, Inc. Multi charged particle beam writing apparatus
JP2017098429A (ja) * 2015-11-25 2017-06-01 株式会社ニューフレアテクノロジー アパーチャのアライメント方法及びマルチ荷電粒子ビーム描画装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0456210A (ja) * 1990-06-26 1992-02-24 Mitsubishi Electric Corp 電子ビーム露光装置
JP3400608B2 (ja) * 1995-06-01 2003-04-28 株式会社日立製作所 走査電子顕微鏡
DE10211977A1 (de) * 2002-03-18 2003-10-02 Leo Elektronenmikroskopie Gmbh Rasterelektronenmikroskop
JP3803105B2 (ja) * 2004-09-07 2006-08-02 株式会社日立ハイテクノロジーズ 電子ビーム応用装置
JP2006120331A (ja) * 2004-10-19 2006-05-11 Jeol Ltd 集束イオンビーム装置および収差補正集束イオンビーム装置
DE102004052994C5 (de) * 2004-11-03 2010-08-26 Vistec Electron Beam Gmbh Multistrahlmodulator für einen Partikelstrahl und Verwendung des Multistrahlmodulators zur maskenlosen Substratsstrukturierung
EP1760762B1 (en) * 2005-09-06 2012-02-01 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Device and method for selecting an emission area of an emission pattern
JP4994151B2 (ja) * 2007-08-14 2012-08-08 日本電子株式会社 荷電粒子線装置
JP2009200565A (ja) * 2008-02-19 2009-09-03 Murata Mach Ltd デジタル複合機
JP5537050B2 (ja) * 2008-04-11 2014-07-02 株式会社日立ハイテクノロジーズ 集束イオンビーム装置
DE102008062450B4 (de) * 2008-12-13 2012-05-03 Vistec Electron Beam Gmbh Anordnung zur Beleuchtung eines Substrats mit mehreren individuell geformten Partikelstrahlen zur hochauflösenden Lithographie von Strukturmustern
JP5315302B2 (ja) * 2010-07-27 2013-10-16 株式会社日立ハイテクノロジーズ 走査透過電子顕微鏡及びその軸調整方法
JP5822535B2 (ja) * 2011-05-16 2015-11-24 キヤノン株式会社 描画装置、および、物品の製造方法
JP5977550B2 (ja) * 2012-03-22 2016-08-24 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置
JP6293435B2 (ja) * 2013-08-08 2018-03-14 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
JP6353229B2 (ja) * 2014-01-22 2018-07-04 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
JP6320186B2 (ja) * 2014-06-16 2018-05-09 株式会社日立ハイテクノロジーズ 荷電粒子線応用装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053002A (ja) * 2006-08-23 2008-03-06 Sii Nanotechnology Inc 荷電粒子ビーム装置及びアパーチャの軸調整方法
JP2010267909A (ja) * 2009-05-18 2010-11-25 Nuflare Technology Inc 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
US20110204253A1 (en) * 2010-02-22 2011-08-25 Elmar Platzgummer Pattern definition device with multiple multibeam array
US20140175302A1 (en) * 2012-12-26 2014-06-26 Nuflare Technology, Inc. Multi charged particle beam writing apparatus
JP2017098429A (ja) * 2015-11-25 2017-06-01 株式会社ニューフレアテクノロジー アパーチャのアライメント方法及びマルチ荷電粒子ビーム描画装置

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US20180358203A1 (en) 2018-12-13
KR20180133792A (ko) 2018-12-17
JP2018207014A (ja) 2018-12-27
TWI684831B (zh) 2020-02-11
JP6957998B2 (ja) 2021-11-02
TW201903535A (zh) 2019-01-16

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