KR102127109B1 - 기판 계측 장치 및 레이저 가공 시스템 - Google Patents

기판 계측 장치 및 레이저 가공 시스템 Download PDF

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Publication number
KR102127109B1
KR102127109B1 KR1020197000560A KR20197000560A KR102127109B1 KR 102127109 B1 KR102127109 B1 KR 102127109B1 KR 1020197000560 A KR1020197000560 A KR 1020197000560A KR 20197000560 A KR20197000560 A KR 20197000560A KR 102127109 B1 KR102127109 B1 KR 102127109B1
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KR
South Korea
Prior art keywords
substrate
processing
laser processing
laser
position coordinates
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KR1020197000560A
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English (en)
Korean (ko)
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KR20190017021A (ko
Inventor
데이지 다카하시
히로유키 가와노
게이스케 후루타
도모타카 가츠라
노조미 히라야마
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20190017021A publication Critical patent/KR20190017021A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020197000560A 2016-07-14 2017-06-16 기판 계측 장치 및 레이저 가공 시스템 KR102127109B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-139423 2016-07-14
JP2016139423 2016-07-14
PCT/JP2017/022410 WO2018012199A1 (ja) 2016-07-14 2017-06-16 基板計測装置およびレーザ加工システム

Publications (2)

Publication Number Publication Date
KR20190017021A KR20190017021A (ko) 2019-02-19
KR102127109B1 true KR102127109B1 (ko) 2020-06-26

Family

ID=60951821

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197000560A KR102127109B1 (ko) 2016-07-14 2017-06-16 기판 계측 장치 및 레이저 가공 시스템

Country Status (5)

Country Link
JP (1) JP6594545B2 (ja)
KR (1) KR102127109B1 (ja)
CN (1) CN109475974B (ja)
TW (1) TWI633279B (ja)
WO (1) WO2018012199A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667471B (zh) * 2018-04-13 2019-08-01 揚朋科技股份有限公司 Apparatus and method for repairing printed circuit boards
JP2020134407A (ja) * 2019-02-22 2020-08-31 キオクシア株式会社 検査装置および検査方法
JP7444548B2 (ja) * 2019-04-15 2024-03-06 ビアメカニクス株式会社 パターン検出とレーザ加工を行うための装置及び検出方法
CN110488512B (zh) * 2019-06-11 2021-12-24 惠科股份有限公司 一种显示面板测量设备的补正方法和补正系统
TWI768235B (zh) * 2019-08-14 2022-06-21 健鼎科技股份有限公司 二維條碼雷射雕刻機及定位方法
CN110441836A (zh) * 2019-08-21 2019-11-12 Oppo（重庆）智能科技有限公司 镜片的制备方法
CN114630721B (zh) * 2019-11-11 2024-04-16 三菱电机株式会社 层叠造形装置
KR102470505B1 (ko) * 2020-02-21 2022-11-25 미쓰비시덴키 가부시키가이샤 가공 에너지의 제어 방법 및 레이저 가공 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000176666A (ja) 1998-12-16 2000-06-27 Mitsubishi Electric Corp レーザ加工装置
JP2003088983A (ja) 2001-09-18 2003-03-25 Toppan Printing Co Ltd レーザードリル装置および多層配線基板の製造方法およびそれを用いた多層配線基板
JP2010162559A (ja) 2009-01-13 2010-07-29 Mitsubishi Electric Corp レーザ加工方法および加工装置並びに被加工物

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Publication number Priority date Publication date Assignee Title
WO1998022252A1 (fr) * 1996-11-20 1998-05-28 Ibiden Co., Ltd. Appareil d'usinage laser, et procede et dispositif de fabrication d'une carte imprimee multicouche
JP3126316B2 (ja) * 1996-11-20 2001-01-22 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
JP3550617B2 (ja) * 1997-06-03 2004-08-04 日立ビアメカニクス株式会社 レーザ加工装置
CN1124917C (zh) * 1997-12-26 2003-10-22 三菱电机株式会社 激光加工装置
JP2004288824A (ja) * 2003-03-20 2004-10-14 Juki Corp 電子部品装着装置のキャリブレーション法及びその方法を用いた装置
CN101178544A (zh) * 2006-04-12 2008-05-14 富士胶片株式会社 对准单元及使用该对准单元的图像记录装置
JP4933424B2 (ja) * 2006-09-28 2012-05-16 三菱電機株式会社 レーザ加工装置
JP4907725B2 (ja) * 2010-03-23 2012-04-04 シャープ株式会社 キャリブレーション装置、欠陥検出装置、欠陥修復装置、表示パネル、表示装置、キャリブレーション方法
CN101870039B (zh) * 2010-06-12 2014-01-22 中国电子科技集团公司第四十五研究所 双工作台驱动激光加工机及其加工方法
WO2012029142A1 (ja) * 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
JP5240272B2 (ja) * 2010-10-15 2013-07-17 三星ダイヤモンド工業株式会社 レーザー加工装置、被加工物の加工方法および被加工物の分割方法
JP2014013547A (ja) * 2012-07-05 2014-01-23 Amada Co Ltd 加工システムにおける誤差補正装置および方法
JP5952875B2 (ja) * 2014-09-30 2016-07-13 株式会社片岡製作所 レーザ加工機、レーザ加工機のワーク歪補正方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000176666A (ja) 1998-12-16 2000-06-27 Mitsubishi Electric Corp レーザ加工装置
JP2003088983A (ja) 2001-09-18 2003-03-25 Toppan Printing Co Ltd レーザードリル装置および多層配線基板の製造方法およびそれを用いた多層配線基板
JP2010162559A (ja) 2009-01-13 2010-07-29 Mitsubishi Electric Corp レーザ加工方法および加工装置並びに被加工物

Also Published As

Publication number Publication date
TWI633279B (zh) 2018-08-21
KR20190017021A (ko) 2019-02-19
TW201807376A (zh) 2018-03-01
JP6594545B2 (ja) 2019-10-23
JPWO2018012199A1 (ja) 2018-11-01
CN109475974B (zh) 2021-01-01
WO2018012199A1 (ja) 2018-01-18
CN109475974A (zh) 2019-03-15

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