KR102124550B1 - 전기 특성의 검사 방법 - Google Patents

전기 특성의 검사 방법 Download PDF

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Publication number
KR102124550B1
KR102124550B1 KR1020187024764A KR20187024764A KR102124550B1 KR 102124550 B1 KR102124550 B1 KR 102124550B1 KR 1020187024764 A KR1020187024764 A KR 1020187024764A KR 20187024764 A KR20187024764 A KR 20187024764A KR 102124550 B1 KR102124550 B1 KR 102124550B1
Authority
KR
South Korea
Prior art keywords
electrode
semiconductor device
conductive film
anisotropic conductive
inspection
Prior art date
Application number
KR1020187024764A
Other languages
English (en)
Korean (ko)
Other versions
KR20180104733A (ko
Inventor
게이지 혼죠
다모츠 오와다
야스유키 히구치
준이치 가네코
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Priority to KR1020207017000A priority Critical patent/KR102320098B1/ko
Publication of KR20180104733A publication Critical patent/KR20180104733A/ko
Application granted granted Critical
Publication of KR102124550B1 publication Critical patent/KR102124550B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
KR1020187024764A 2016-04-12 2017-03-23 전기 특성의 검사 방법 KR102124550B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020207017000A KR102320098B1 (ko) 2016-04-12 2017-03-23 전기 특성의 검사 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-079852 2016-04-12
JP2016079852A JP2017191688A (ja) 2016-04-12 2016-04-12 電気特性の検査方法
PCT/JP2017/011859 WO2017179390A1 (ja) 2016-04-12 2017-03-23 電気特性の検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207017000A Division KR102320098B1 (ko) 2016-04-12 2017-03-23 전기 특성의 검사 방법

Publications (2)

Publication Number Publication Date
KR20180104733A KR20180104733A (ko) 2018-09-21
KR102124550B1 true KR102124550B1 (ko) 2020-06-18

Family

ID=60041742

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207017000A KR102320098B1 (ko) 2016-04-12 2017-03-23 전기 특성의 검사 방법
KR1020187024764A KR102124550B1 (ko) 2016-04-12 2017-03-23 전기 특성의 검사 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020207017000A KR102320098B1 (ko) 2016-04-12 2017-03-23 전기 특성의 검사 방법

Country Status (4)

Country Link
JP (1) JP2017191688A (zh)
KR (2) KR102320098B1 (zh)
TW (1) TWI713274B (zh)
WO (1) WO2017179390A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694530B (zh) * 2019-03-08 2020-05-21 致茂電子股份有限公司 電子元件測試方法以及測試探針
CN113109610B (zh) * 2021-04-06 2021-10-26 北京中微普业科技有限公司 一种rf裸芯片扁平探针测试工装

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007064936A (ja) * 2005-09-02 2007-03-15 Jsr Corp 回路基板の検査装置および回路基板の検査方法
JP2014066527A (ja) * 2012-09-24 2014-04-17 National Institute Of Advanced Industrial & Technology 積層ｌｓｉの接続状態の検査方法
JP2014178212A (ja) * 2013-03-14 2014-09-25 Ricoh Co Ltd 半導体試験装置および半導体の試験方法
JP2014192210A (ja) * 2013-03-26 2014-10-06 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、および半導体装置の検査方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06784Y2 (ja) * 1986-10-17 1994-01-05 理化電子株式会社 電子部品の検査用治具
JPH0855648A (ja) 1994-08-12 1996-02-27 Shinano Polymer Kk エラストマーコネクター
JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH11305185A (ja) * 1998-04-17 1999-11-05 Ricoh Co Ltd 検査装置および方法
JP3616031B2 (ja) * 2001-05-10 2005-02-02 富士通株式会社 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
EP1548884A4 (en) * 2002-08-27 2007-05-09 Jsr Corp CONDUCTIVE ANISOTROPIC SHEET, PROCESS FOR PRODUCING THE SAME AND APPLICATION THEREOF
JP2004288911A (ja) * 2003-03-24 2004-10-14 Casio Comput Co Ltd 半導体ウエハ試験装置およびその試験方法
CN1967261A (zh) * 2005-11-16 2007-05-23 松下电器产业株式会社 检查装置及检查方法
JP5049694B2 (ja) 2007-08-07 2012-10-17 ルネサスエレクトロニクス株式会社 プローブカード、半導体検査装置および半導体装置の製造方法
US8502398B2 (en) * 2007-10-05 2013-08-06 Shinko Electric Industries Co., Ltd. Wiring board, semiconductor apparatus and method of manufacturing them
JP2012114319A (ja) * 2010-11-26 2012-06-14 Seiko Epson Corp マザー基板、電子部品の検査方法、電子部品、及び電子部品の製造方法、並びに電子機器
CN109166649B (zh) * 2012-08-24 2021-04-13 迪睿合电子材料有限公司 各向异性导电膜及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007064936A (ja) * 2005-09-02 2007-03-15 Jsr Corp 回路基板の検査装置および回路基板の検査方法
JP2014066527A (ja) * 2012-09-24 2014-04-17 National Institute Of Advanced Industrial & Technology 積層ｌｓｉの接続状態の検査方法
JP2014178212A (ja) * 2013-03-14 2014-09-25 Ricoh Co Ltd 半導体試験装置および半導体の試験方法
JP2014192210A (ja) * 2013-03-26 2014-10-06 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、および半導体装置の検査方法

Also Published As

Publication number Publication date
KR102320098B1 (ko) 2021-11-02
JP2017191688A (ja) 2017-10-19
KR20180104733A (ko) 2018-09-21
KR20200074244A (ko) 2020-06-24
WO2017179390A1 (ja) 2017-10-19
TWI713274B (zh) 2020-12-11
TW201803236A (zh) 2018-01-16

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