KR102103169B1 - 보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법 - Google Patents

보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법 Download PDF

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Publication number
KR102103169B1
KR102103169B1 KR1020157008404A KR20157008404A KR102103169B1 KR 102103169 B1 KR102103169 B1 KR 102103169B1 KR 1020157008404 A KR1020157008404 A KR 1020157008404A KR 20157008404 A KR20157008404 A KR 20157008404A KR 102103169 B1 KR102103169 B1 KR 102103169B1
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KR
South Korea
Prior art keywords
protective film
forming layer
film forming
sheet
dicing sheet
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KR1020157008404A
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English (en)
Korean (ko)
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KR20150067164A (ko
Inventor
케이 다카야마
토모노리 시노다
나오야 사에키
켄 다카노
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20150067164A publication Critical patent/KR20150067164A/ko
Application granted granted Critical
Publication of KR102103169B1 publication Critical patent/KR102103169B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/005—Presence of (meth)acrylic polymer in the release coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020157008404A 2012-10-05 2013-10-04 보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법 KR102103169B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012223113 2012-10-05
JPJP-P-2012-223113 2012-10-05
PCT/JP2013/077088 WO2014054781A1 (ja) 2012-10-05 2013-10-04 保護膜形成層付ダイシングシートおよびチップの製造方法

Publications (2)

Publication Number Publication Date
KR20150067164A KR20150067164A (ko) 2015-06-17
KR102103169B1 true KR102103169B1 (ko) 2020-04-22

Family

ID=50435100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157008404A KR102103169B1 (ko) 2012-10-05 2013-10-04 보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법

Country Status (5)

Country Link
JP (1) JP6104925B2 (ja)
KR (1) KR102103169B1 (ja)
CN (1) CN104685609B (ja)
TW (1) TWI647295B (ja)
WO (1) WO2014054781A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201705001TA (en) * 2014-12-19 2017-07-28 Lintec Corp Sheet laminate for forming resin film
JP2016213236A (ja) * 2015-04-30 2016-12-15 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
EP3098277A1 (en) * 2015-05-27 2016-11-30 Henkel AG & Co. KGaA Pre-cut film and a production method thereof
JP6506116B2 (ja) * 2015-06-25 2019-04-24 リンテック株式会社 保護膜形成用フィルム、保護膜形成用シート、及びワーク又は加工物の製造方法
JP6506117B2 (ja) * 2015-06-25 2019-04-24 リンテック株式会社 保護膜形成用フィルム、保護膜形成用シート、ワーク又は加工物の製造方法、検査方法、良品と判断されたワーク、及び良品と判断された加工物
JP6506118B2 (ja) * 2015-06-25 2019-04-24 リンテック株式会社 保護膜形成用フィルム、保護膜形成用シート、ワーク又は加工物の製造方法、検査方法、良品と判断されたワーク、及び良品と判断された加工物
SG11201804481WA (en) * 2016-02-24 2018-06-28 Lintec Corp Adhesive sheet and usage method therefor
CN108778722A (zh) * 2016-03-04 2018-11-09 琳得科株式会社 保护膜形成用复合片
CN108701640B (zh) * 2016-04-28 2022-12-20 琳得科株式会社 保护膜形成用膜以及保护膜形成用复合片
JP6812212B2 (ja) * 2016-11-14 2021-01-13 日東電工株式会社 シート、テープおよび半導体装置の製造方法
CN106791340B (zh) * 2017-03-22 2022-12-27 蓝思科技股份有限公司 一种含保护膜的摄像头组件
TWI757498B (zh) * 2017-05-31 2022-03-11 日商琳得科股份有限公司 黏著薄片及密封體
CN107680834A (zh) * 2017-09-25 2018-02-09 中国振华集团云科电子有限公司 一种芯片电容的优化切割工艺及芯片电容
CN111630117B (zh) * 2018-01-19 2023-04-04 Mti株式会社 用于剥离切割工艺用保护性涂层剂的剥离剂
JP7066464B2 (ja) * 2018-03-19 2022-05-13 リンテック株式会社 部品固定用粘着シート、その製造方法および部品の固定方法
WO2020105677A1 (ja) * 2018-11-22 2020-05-28 リンテック株式会社 熱硬化性保護膜形成用フィルム、保護膜形成用複合シート、及びチップの製造方法
KR102585712B1 (ko) 2019-01-11 2023-10-10 삼성디스플레이 주식회사 보호 필름, 그것의 제조 방법, 및 그것을 이용한 표시 장치의 제조 방법
JP6802312B2 (ja) * 2019-03-28 2020-12-16 リンテック株式会社 保護膜形成用フィルム、保護膜形成用シート、及びワーク又は加工物の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140348A (ja) * 2004-11-12 2006-06-01 Lintec Corp マーキング方法および保護膜形成兼ダイシング用シート
JP2010222524A (ja) 2009-03-25 2010-10-07 Dic Corp フィルム保護層用活性エネルギー線硬化型樹脂組成物
JP2011223014A (ja) 2011-06-02 2011-11-04 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2012033741A (ja) * 2010-07-30 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP4805203B2 (ja) * 2007-03-28 2011-11-02 古河電気工業株式会社 チップ保護用フィルム
JP5805367B2 (ja) 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5534896B2 (ja) * 2010-03-30 2014-07-02 古河電気工業株式会社 帯電防止性半導体加工用粘着テープ
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
KR101351622B1 (ko) * 2010-12-29 2014-01-15 제일모직주식회사 다이싱 다이 본딩 필름

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140348A (ja) * 2004-11-12 2006-06-01 Lintec Corp マーキング方法および保護膜形成兼ダイシング用シート
JP2010222524A (ja) 2009-03-25 2010-10-07 Dic Corp フィルム保護層用活性エネルギー線硬化型樹脂組成物
JP2012033741A (ja) * 2010-07-30 2012-02-16 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
JP2011223014A (ja) 2011-06-02 2011-11-04 Furukawa Electric Co Ltd:The チップ保護用フィルム

Also Published As

Publication number Publication date
CN104685609B (zh) 2018-06-08
TWI647295B (zh) 2019-01-11
WO2014054781A1 (ja) 2014-04-10
JPWO2014054781A1 (ja) 2016-08-25
JP6104925B2 (ja) 2017-03-29
KR20150067164A (ko) 2015-06-17
CN104685609A (zh) 2015-06-03
TW201428079A (zh) 2014-07-16

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