KR102102754B1 - 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Download PDF

Info

Publication number
KR102102754B1
KR102102754B1 KR1020187018568A KR20187018568A KR102102754B1 KR 102102754 B1 KR102102754 B1 KR 102102754B1 KR 1020187018568 A KR1020187018568 A KR 1020187018568A KR 20187018568 A KR20187018568 A KR 20187018568A KR 102102754 B1 KR102102754 B1 KR 102102754B1
Authority
KR
South Korea
Prior art keywords
substrate
imprint material
discharge port
imprint
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020187018568A
Other languages
English (en)
Korean (ko)
Other versions
KR20180087399A (ko
Inventor
료스케 츠츠미
에이지 사카모토
히사시 남바
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180087399A publication Critical patent/KR20180087399A/ko
Application granted granted Critical
Publication of KR102102754B1 publication Critical patent/KR102102754B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Data Mining & Analysis (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020187018568A 2015-11-30 2016-11-22 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Active KR102102754B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015234318A JP6590667B2 (ja) 2015-11-30 2015-11-30 インプリント装置、インプリント方法、および物品の製造方法
JPJP-P-2015-234318 2015-11-30
PCT/JP2016/084601 WO2017094563A1 (ja) 2015-11-30 2016-11-22 インプリント装置、インプリント方法、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20180087399A KR20180087399A (ko) 2018-08-01
KR102102754B1 true KR102102754B1 (ko) 2020-04-21

Family

ID=58797304

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187018568A Active KR102102754B1 (ko) 2015-11-30 2016-11-22 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6590667B2 (enrdf_load_stackoverflow)
KR (1) KR102102754B1 (enrdf_load_stackoverflow)
TW (1) TWI647089B (enrdf_load_stackoverflow)
WO (1) WO2017094563A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7015134B2 (ja) * 2017-10-12 2022-02-02 キヤノン株式会社 インプリント装置、インプリント方法、情報処理装置、生成方法、プログラム及び物品の製造方法
JP6988767B2 (ja) * 2018-11-07 2022-01-05 オムロン株式会社 塗布装置
JP7257817B2 (ja) * 2019-03-04 2023-04-14 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7263088B2 (ja) * 2019-04-08 2023-04-24 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7610463B2 (ja) * 2021-04-20 2025-01-08 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7699993B2 (ja) * 2021-07-30 2025-06-30 キヤノン株式会社 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
CN120178595B (zh) * 2025-05-20 2025-07-22 普雨科技(苏州)有限公司 一种步进式重复纳米压印设备、控制方法及控制系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003053957A (ja) * 2001-08-20 2003-02-26 Konica Corp インクジェット記録装置
JP2007296783A (ja) 2006-05-01 2007-11-15 Canon Inc 加工装置及び方法、並びに、デバイス製造方法
JP4541560B2 (ja) * 1999-02-08 2010-09-08 キヤノン株式会社 電子デバイス、電子源及び画像形成装置の製造方法
JP2011128396A (ja) 2009-12-18 2011-06-30 Dainippon Printing Co Ltd 成形用スタンパー、反射防止フィルムの製造方法及び反射防止フィルム
JP2012069758A (ja) * 2010-09-24 2012-04-05 Toshiba Corp 滴下制御方法および滴下制御装置
JP2012190877A (ja) 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
JP2013065624A (ja) 2011-09-15 2013-04-11 Fujifilm Corp インクジェットヘッドの吐出量補正方法、吐出量補正装置、及び機能性インク配置装置並びにナノインプリントシステム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163499A (ja) * 1992-11-19 1994-06-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0943424A (ja) * 1995-08-01 1997-02-14 Canon Inc カラーフィルタの製造方法及び製造装置
JP4819577B2 (ja) * 2006-05-31 2011-11-24 キヤノン株式会社 パターン転写方法およびパターン転写装置
JP5361309B2 (ja) * 2008-09-25 2013-12-04 キヤノン株式会社 インプリント装置およびインプリント方法
US20100102471A1 (en) * 2008-10-24 2010-04-29 Molecular Imprints, Inc. Fluid transport and dispensing
JP2011062590A (ja) * 2009-09-15 2011-03-31 Seiko Epson Corp 吐出方法及び液滴吐出装置
JP5563319B2 (ja) * 2010-01-19 2014-07-30 キヤノン株式会社 インプリント装置、および物品の製造方法
JP5335717B2 (ja) * 2010-03-16 2013-11-06 富士フイルム株式会社 レジスト組成物配置装置及びパターン形成体の製造方法
JP5214683B2 (ja) * 2010-08-31 2013-06-19 株式会社東芝 インプリントレシピ作成装置及び方法並びにインプリント装置及び方法
JP5661666B2 (ja) * 2012-02-29 2015-01-28 株式会社東芝 パターン形成装置及び半導体装置の製造方法
JP6083203B2 (ja) * 2012-11-19 2017-02-22 大日本印刷株式会社 インプリント樹脂滴下位置決定方法、インプリント方法及び半導体装置製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4541560B2 (ja) * 1999-02-08 2010-09-08 キヤノン株式会社 電子デバイス、電子源及び画像形成装置の製造方法
JP2003053957A (ja) * 2001-08-20 2003-02-26 Konica Corp インクジェット記録装置
JP2007296783A (ja) 2006-05-01 2007-11-15 Canon Inc 加工装置及び方法、並びに、デバイス製造方法
JP2011128396A (ja) 2009-12-18 2011-06-30 Dainippon Printing Co Ltd 成形用スタンパー、反射防止フィルムの製造方法及び反射防止フィルム
JP2012069758A (ja) * 2010-09-24 2012-04-05 Toshiba Corp 滴下制御方法および滴下制御装置
JP2012190877A (ja) 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
JP2013065624A (ja) 2011-09-15 2013-04-11 Fujifilm Corp インクジェットヘッドの吐出量補正方法、吐出量補正装置、及び機能性インク配置装置並びにナノインプリントシステム

Also Published As

Publication number Publication date
TW201733773A (zh) 2017-10-01
WO2017094563A1 (ja) 2017-06-08
JP2017103313A (ja) 2017-06-08
TWI647089B (zh) 2019-01-11
JP6590667B2 (ja) 2019-10-16
KR20180087399A (ko) 2018-08-01

Similar Documents

Publication Publication Date Title
KR102102754B1 (ko) 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
US11413793B2 (en) Imprint apparatus, imprint method, and method for manufacturing product
JP2013062286A (ja) インプリント装置、それを用いた物品の製造方法
KR20200055096A (ko) 임프린트 장치, 및 물품의 제조 방법
JP6701300B2 (ja) ナノインプリントシステムのスループットを改善するためのシステムおよび方法
KR102382790B1 (ko) 임프린트 장치, 임프린트 방법, 정보 처리 장치, 생성 방법, 프로그램 및 물품 제조 방법
KR20190140397A (ko) 몰드에 의해 기판 상의 조성물을 성형하는 성형 장치 및 물품 제조 방법
KR20190133600A (ko) 데이터 생성 방법, 임프린트 방법, 임프린트 장치, 및 물품 제조 방법
KR20200136827A (ko) 리소그래피 장치 및 물품의 제조 방법
KR102316054B1 (ko) 거푸집, 임프린트 장치, 및 물품의 제조 방법
US20230049521A1 (en) Imprint apparatus and method of manufacturing article
JP7699993B2 (ja) 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
KR102744794B1 (ko) 임프린트 장치, 임프린트 방법, 및 물품 제조 방법
JP6548560B2 (ja) インプリント装置、計測方法、インプリント方法、および物品の製造方法
TWI631599B (zh) 壓印裝置，測量方法，壓印方法，及物品製造方法
JP6552392B2 (ja) インプリント装置、計測方法、インプリント方法、および物品の製造方法
US11573487B2 (en) Imprint apparatus, imprinting method, and method of manufacturing article
JP7441037B2 (ja) インプリント装置、情報処理装置、インプリント方法及び物品の製造方法
US11664225B2 (en) Imprint apparatus, and product manufacturing method
JP7604343B2 (ja) 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
JP7289895B2 (ja) インプリント装置、インプリント方法、および、物品の製造方法
JP2022190891A (ja) 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
KR20230091021A (ko) 임프린트 장치 및 물품 제조 방법
KR20230068314A (ko) 임프린트 장치 및 물품 제조 방법
KR20220000364A (ko) 임프린트 시스템에서 왜곡을 교정하는 나노제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20180629

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20190617

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20191203

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20200210

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200414

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200416

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240401

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20250324

Start annual number: 6

End annual number: 6