JP6590667B2 - インプリント装置、インプリント方法、および物品の製造方法 - Google Patents

インプリント装置、インプリント方法、および物品の製造方法 Download PDF

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Publication number
JP6590667B2
JP6590667B2 JP2015234318A JP2015234318A JP6590667B2 JP 6590667 B2 JP6590667 B2 JP 6590667B2 JP 2015234318 A JP2015234318 A JP 2015234318A JP 2015234318 A JP2015234318 A JP 2015234318A JP 6590667 B2 JP6590667 B2 JP 6590667B2
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Japan
Prior art keywords
imprint material
substrate
imprint
discharge port
supply
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JP2015234318A
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English (en)
Japanese (ja)
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JP2017103313A (ja
JP2017103313A5 (enrdf_load_stackoverflow
Inventor
怜介 堤
怜介 堤
坂本　英治
英治 坂本
永 難波
永 難波
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015234318A priority Critical patent/JP6590667B2/ja
Priority to PCT/JP2016/084601 priority patent/WO2017094563A1/ja
Priority to KR1020187018568A priority patent/KR102102754B1/ko
Priority to TW105138895A priority patent/TWI647089B/zh
Publication of JP2017103313A publication Critical patent/JP2017103313A/ja
Publication of JP2017103313A5 publication Critical patent/JP2017103313A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Data Mining & Analysis (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015234318A 2015-11-30 2015-11-30 インプリント装置、インプリント方法、および物品の製造方法 Active JP6590667B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015234318A JP6590667B2 (ja) 2015-11-30 2015-11-30 インプリント装置、インプリント方法、および物品の製造方法
PCT/JP2016/084601 WO2017094563A1 (ja) 2015-11-30 2016-11-22 インプリント装置、インプリント方法、および物品の製造方法
KR1020187018568A KR102102754B1 (ko) 2015-11-30 2016-11-22 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
TW105138895A TWI647089B (zh) 2015-11-30 2016-11-25 壓印裝置、壓印方法、及物品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015234318A JP6590667B2 (ja) 2015-11-30 2015-11-30 インプリント装置、インプリント方法、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2017103313A JP2017103313A (ja) 2017-06-08
JP2017103313A5 JP2017103313A5 (enrdf_load_stackoverflow) 2019-01-24
JP6590667B2 true JP6590667B2 (ja) 2019-10-16

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JP2015234318A Active JP6590667B2 (ja) 2015-11-30 2015-11-30 インプリント装置、インプリント方法、および物品の製造方法

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JP (1) JP6590667B2 (enrdf_load_stackoverflow)
KR (1) KR102102754B1 (enrdf_load_stackoverflow)
TW (1) TWI647089B (enrdf_load_stackoverflow)
WO (1) WO2017094563A1 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7015134B2 (ja) * 2017-10-12 2022-02-02 キヤノン株式会社 インプリント装置、インプリント方法、情報処理装置、生成方法、プログラム及び物品の製造方法
JP6988767B2 (ja) * 2018-11-07 2022-01-05 オムロン株式会社 塗布装置
JP7257817B2 (ja) * 2019-03-04 2023-04-14 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7263088B2 (ja) * 2019-04-08 2023-04-24 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP7610463B2 (ja) * 2021-04-20 2025-01-08 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7699993B2 (ja) * 2021-07-30 2025-06-30 キヤノン株式会社 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法
CN120178595B (zh) * 2025-05-20 2025-07-22 普雨科技(苏州)有限公司 一种步进式重复纳米压印设备、控制方法及控制系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163499A (ja) * 1992-11-19 1994-06-10 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0943424A (ja) * 1995-08-01 1997-02-14 Canon Inc カラーフィルタの製造方法及び製造装置
WO2000045964A1 (fr) * 1999-02-08 2000-08-10 Canon Kabushiki Kaisha Composant electronique, procede de production d'une source d'electrons, composant de formation d'image et dispositif servant a fabriquer un composant electronique
JP4934927B2 (ja) * 2001-08-20 2012-05-23 コニカミノルタホールディングス株式会社 インクジェット記録装置
JP2007296783A (ja) * 2006-05-01 2007-11-15 Canon Inc 加工装置及び方法、並びに、デバイス製造方法
JP4819577B2 (ja) * 2006-05-31 2011-11-24 キヤノン株式会社 パターン転写方法およびパターン転写装置
JP5361309B2 (ja) * 2008-09-25 2013-12-04 キヤノン株式会社 インプリント装置およびインプリント方法
US20100102471A1 (en) * 2008-10-24 2010-04-29 Molecular Imprints, Inc. Fluid transport and dispensing
JP2011062590A (ja) * 2009-09-15 2011-03-31 Seiko Epson Corp 吐出方法及び液滴吐出装置
JP5229206B2 (ja) * 2009-12-18 2013-07-03 大日本印刷株式会社 反射防止フィルムの製造方法
JP5563319B2 (ja) * 2010-01-19 2014-07-30 キヤノン株式会社 インプリント装置、および物品の製造方法
JP5335717B2 (ja) * 2010-03-16 2013-11-06 富士フイルム株式会社 レジスト組成物配置装置及びパターン形成体の製造方法
JP5214683B2 (ja) * 2010-08-31 2013-06-19 株式会社東芝 インプリントレシピ作成装置及び方法並びにインプリント装置及び方法
JP5404570B2 (ja) * 2010-09-24 2014-02-05 株式会社東芝 滴下制御方法および滴下制御装置
JP2012190877A (ja) * 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
JP5727905B2 (ja) * 2011-09-15 2015-06-03 富士フイルム株式会社 インクジェットヘッドの吐出量補正方法、吐出量補正装置、及びナノインプリントシステム
JP5661666B2 (ja) * 2012-02-29 2015-01-28 株式会社東芝 パターン形成装置及び半導体装置の製造方法
JP6083203B2 (ja) * 2012-11-19 2017-02-22 大日本印刷株式会社 インプリント樹脂滴下位置決定方法、インプリント方法及び半導体装置製造方法

Also Published As

Publication number Publication date
TW201733773A (zh) 2017-10-01
WO2017094563A1 (ja) 2017-06-08
JP2017103313A (ja) 2017-06-08
TWI647089B (zh) 2019-01-11
KR20180087399A (ko) 2018-08-01
KR102102754B1 (ko) 2020-04-21

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