KR102088632B1 - 세정 방법 및 세정 장치 - Google Patents

세정 방법 및 세정 장치 Download PDF

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Publication number
KR102088632B1
KR102088632B1 KR1020167000332A KR20167000332A KR102088632B1 KR 102088632 B1 KR102088632 B1 KR 102088632B1 KR 1020167000332 A KR1020167000332 A KR 1020167000332A KR 20167000332 A KR20167000332 A KR 20167000332A KR 102088632 B1 KR102088632 B1 KR 102088632B1
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KR
South Korea
Prior art keywords
cleaned
liquid
processing
injection
discharge
Prior art date
Application number
KR1020167000332A
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English (en)
Korean (ko)
Other versions
KR20160018695A (ko
Inventor
다카히로 호시코
마사히로 사이토
Original Assignee
달톤 가부시키가이샤
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Publication date
Application filed by 달톤 가부시키가이샤 filed Critical 달톤 가부시키가이샤
Publication of KR20160018695A publication Critical patent/KR20160018695A/ko
Application granted granted Critical
Publication of KR102088632B1 publication Critical patent/KR102088632B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020167000332A 2013-06-07 2013-11-29 세정 방법 및 세정 장치 KR102088632B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013120644A JP6329342B2 (ja) 2013-06-07 2013-06-07 洗浄方法及び洗浄装置
JPJP-P-2013-120644 2013-06-07
PCT/JP2013/082252 WO2014196099A1 (ja) 2013-06-07 2013-11-29 洗浄方法及び洗浄装置

Publications (2)

Publication Number Publication Date
KR20160018695A KR20160018695A (ko) 2016-02-17
KR102088632B1 true KR102088632B1 (ko) 2020-03-16

Family

ID=52007765

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167000332A KR102088632B1 (ko) 2013-06-07 2013-11-29 세정 방법 및 세정 장치

Country Status (4)

Country Link
JP (1) JP6329342B2 (zh)
KR (1) KR102088632B1 (zh)
CN (1) CN105210177B (zh)
WO (1) WO2014196099A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017224734A (ja) * 2016-06-15 2017-12-21 株式会社ダルトン 洗浄方法及び洗浄装置
CN109318114A (zh) * 2017-07-31 2019-02-12 上海新昇半导体科技有限公司 一种半导体晶圆的最终抛光机以及最终抛光及清洗方法
JP7305090B2 (ja) * 2019-01-30 2023-07-10 アサヒプリテック株式会社 レジスト廃液からの有価金属粉回収方法、及び有価金属粉回収装置
CN112599441A (zh) * 2020-11-30 2021-04-02 硅密芯镀(海宁)半导体技术有限公司 清洗系统、晶圆清洗设备及晶圆浸润水洗方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173962A (ja) * 1998-12-07 2000-06-23 Sony Corp ウエハ洗浄装置及び洗浄方法
JP2008306104A (ja) * 2007-06-11 2008-12-18 Elpida Memory Inc ウェット処理装置及びウェット処理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441217A (en) 1987-08-07 1989-02-13 Nippon Telegraph & Telephone Method and device for manufacturing semiconductor integrated circuit
US5922138A (en) * 1996-08-12 1999-07-13 Tokyo Electron Limited Liquid treatment method and apparatus
JP2000100761A (ja) * 1998-09-25 2000-04-07 Seiko Epson Corp 半導体装置の製造方法及び製造装置
JP2000308857A (ja) * 1999-04-27 2000-11-07 Tokyo Electron Ltd 液処理方法及び液処理装置
KR100481858B1 (ko) * 2002-07-22 2005-04-11 삼성전자주식회사 공비혼합 효과를 이용하여 반도체기판을 건조시키는 장비및 상기 장비를 사용하는 건조방법
JP2004327962A (ja) * 2003-04-07 2004-11-18 Matsushita Electric Ind Co Ltd レジストの剥離装置及び剥離方法
JP2005032948A (ja) * 2003-07-11 2005-02-03 Sansha Electric Mfg Co Ltd 半導体ウエハの洗浄方法および，洗浄装置
JP2005183791A (ja) * 2003-12-22 2005-07-07 Dainippon Screen Mfg Co Ltd 基板処理方法及びその装置
JP4207205B2 (ja) * 2003-12-24 2009-01-14 和夫 田▲邉▼ リフトオフ方法及び装置
JP4502854B2 (ja) 2005-03-22 2010-07-14 株式会社高田工業所 基板の処理装置及び処理方法
JP4705517B2 (ja) * 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP2008166426A (ja) * 2006-12-27 2008-07-17 Siltronic Ag 洗浄方法及び洗浄装置
JP5690168B2 (ja) * 2011-02-25 2015-03-25 芝浦メカトロニクス株式会社 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000173962A (ja) * 1998-12-07 2000-06-23 Sony Corp ウエハ洗浄装置及び洗浄方法
JP2008306104A (ja) * 2007-06-11 2008-12-18 Elpida Memory Inc ウェット処理装置及びウェット処理方法

Also Published As

Publication number Publication date
CN105210177A (zh) 2015-12-30
CN105210177B (zh) 2018-08-07
KR20160018695A (ko) 2016-02-17
JP6329342B2 (ja) 2018-05-23
WO2014196099A1 (ja) 2014-12-11
JP2014239141A (ja) 2014-12-18

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