KR102085553B1 - 3차원 전기 전도성 접착 필름 - Google Patents

3차원 전기 전도성 접착 필름 Download PDF

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Publication number
KR102085553B1
KR102085553B1 KR1020147034181A KR20147034181A KR102085553B1 KR 102085553 B1 KR102085553 B1 KR 102085553B1 KR 1020147034181 A KR1020147034181 A KR 1020147034181A KR 20147034181 A KR20147034181 A KR 20147034181A KR 102085553 B1 KR102085553 B1 KR 102085553B1
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South Korea
Prior art keywords
adhesive
particles
adhesive sheet
conductive particles
resins
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KR1020147034181A
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English (en)
Korean (ko)
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KR20150013703A (ko
Inventor
레스모나 셰르프
토르스텐 크라빙켈
알렉산더 피셔
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테사 소시에타스 유로파에아
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Publication of KR20150013703A publication Critical patent/KR20150013703A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020147034181A 2012-05-04 2013-04-05 3차원 전기 전도성 접착 필름 Active KR102085553B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012207462.7 2012-05-04
DE102012207462A DE102012207462A1 (de) 2012-05-04 2012-05-04 Dreidimensional elektrisch leitfähige Klebstofffolie
PCT/EP2013/057233 WO2013164154A1 (de) 2012-05-04 2013-04-05 Dreidimensional elektrisch leitfähige klebstofffolie

Publications (2)

Publication Number Publication Date
KR20150013703A KR20150013703A (ko) 2015-02-05
KR102085553B1 true KR102085553B1 (ko) 2020-03-06

Family

ID=48095832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147034181A Active KR102085553B1 (ko) 2012-05-04 2013-04-05 3차원 전기 전도성 접착 필름

Country Status (11)

Country Link
US (1) US9598614B2 (enExample)
EP (1) EP2844690B1 (enExample)
JP (1) JP2015521214A (enExample)
KR (1) KR102085553B1 (enExample)
CN (1) CN104284928B (enExample)
DE (1) DE102012207462A1 (enExample)
IN (1) IN2014DN10108A (enExample)
MX (1) MX358202B (enExample)
PL (1) PL2844690T3 (enExample)
TW (1) TW201402772A (enExample)
WO (1) WO2013164154A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160012931A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Conductive Particle
US20160012934A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Composite Formulation and Composite Product
CN107075265A (zh) * 2014-07-31 2017-08-18 拓自达电线株式会社 导电性组成物及含有该组成物的导电片
KR101836566B1 (ko) 2015-05-15 2018-03-08 현대자동차주식회사 도전성 접착제 및 이를 이용한 복합소재의 접합방법
JP5989928B1 (ja) 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
JP5972489B1 (ja) * 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005312B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005313B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
WO2018042701A1 (ja) 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
KR102346866B1 (ko) * 2017-05-09 2022-01-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착제
CN111527164B (zh) * 2017-12-28 2022-11-18 昭和电工材料株式会社 粘接剂膜
CN111512502B (zh) 2017-12-28 2022-06-03 昭和电工材料株式会社 连接结构体及其制造方法
KR102580259B1 (ko) * 2018-01-30 2023-09-19 타츠타 전선 주식회사 도전성 접착제 조성물
JP6805190B2 (ja) * 2018-01-30 2020-12-23 タツタ電線株式会社 導電性接着剤組成物
WO2020241818A1 (ja) * 2019-05-31 2020-12-03 タツタ電線株式会社 等方導電性粘着シート
CN113825815B (zh) * 2019-05-31 2022-09-30 拓自达电线株式会社 各向同性导电性粘着片
JP7686908B2 (ja) * 2021-07-29 2025-06-03 サカタインクス株式会社 ２液硬化型導電性接着剤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032165A (ja) 2004-07-16 2006-02-02 Sumitomo Metal Mining Co Ltd 導電性金属粒子とそれを用いた導電性樹脂組成物及び導電性接着剤
US20100276645A1 (en) * 2007-06-01 2010-11-04 Hexcel Composites Limited Improved structural adhesive materials

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475213A (en) 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3970608A (en) 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
US4113981A (en) 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
NL8204288A (nl) * 1982-11-05 1984-06-01 Gen Electric Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel.
US4606962A (en) 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
AU612771B2 (en) 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
DE4012061A1 (de) * 1990-04-10 1991-10-17 Mittweida Ing Hochschule Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln
DE19912628A1 (de) 1998-07-04 2000-01-05 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie
EP1102823B1 (de) * 1998-07-04 2005-07-27 tesa AG Elektrisch leitfähige, thermoplastische und hitzeaktivierbare klebstofffolie
DE19853805B4 (de) * 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
JP2004288924A (ja) * 2003-03-24 2004-10-14 Alps Electric Co Ltd 可変抵抗器
WO2011003948A2 (en) * 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
DE102010060904A1 (de) * 2010-11-30 2012-05-31 Benecke-Kaliko Ag Polymermischung
EP4012061A1 (de) * 2020-12-09 2022-06-15 MTU Aero Engines AG Nickelbasislegierung und bauteil aus dieser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032165A (ja) 2004-07-16 2006-02-02 Sumitomo Metal Mining Co Ltd 導電性金属粒子とそれを用いた導電性樹脂組成物及び導電性接着剤
US20100276645A1 (en) * 2007-06-01 2010-11-04 Hexcel Composites Limited Improved structural adhesive materials

Also Published As

Publication number Publication date
US20150129812A1 (en) 2015-05-14
PL2844690T3 (pl) 2016-12-30
CN104284928A (zh) 2015-01-14
KR20150013703A (ko) 2015-02-05
JP2015521214A (ja) 2015-07-27
IN2014DN10108A (enExample) 2015-08-21
US9598614B2 (en) 2017-03-21
DE102012207462A1 (de) 2013-11-07
CN104284928B (zh) 2016-04-13
WO2013164154A1 (de) 2013-11-07
EP2844690A1 (de) 2015-03-11
MX2014013046A (es) 2015-02-04
EP2844690B1 (de) 2016-07-20
MX358202B (es) 2018-08-09
TW201402772A (zh) 2014-01-16

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