CN104284928B - 三维导电粘合剂膜 - Google Patents

三维导电粘合剂膜 Download PDF

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Publication number
CN104284928B
CN104284928B CN201380023513.8A CN201380023513A CN104284928B CN 104284928 B CN104284928 B CN 104284928B CN 201380023513 A CN201380023513 A CN 201380023513A CN 104284928 B CN104284928 B CN 104284928B
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CN
China
Prior art keywords
adhesive sheet
adhesive
conductive particles
particles
sheet according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380023513.8A
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English (en)
Chinese (zh)
Other versions
CN104284928A (zh
Inventor
L.舍夫
T.克拉温克尔
A.费希尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of CN104284928A publication Critical patent/CN104284928A/zh
Application granted granted Critical
Publication of CN104284928B publication Critical patent/CN104284928B/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN201380023513.8A 2012-05-04 2013-04-05 三维导电粘合剂膜 Active CN104284928B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012207462.7 2012-05-04
DE102012207462A DE102012207462A1 (de) 2012-05-04 2012-05-04 Dreidimensional elektrisch leitfähige Klebstofffolie
PCT/EP2013/057233 WO2013164154A1 (de) 2012-05-04 2013-04-05 Dreidimensional elektrisch leitfähige klebstofffolie

Publications (2)

Publication Number Publication Date
CN104284928A CN104284928A (zh) 2015-01-14
CN104284928B true CN104284928B (zh) 2016-04-13

Family

ID=48095832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380023513.8A Active CN104284928B (zh) 2012-05-04 2013-04-05 三维导电粘合剂膜

Country Status (11)

Country Link
US (1) US9598614B2 (enExample)
EP (1) EP2844690B1 (enExample)
JP (1) JP2015521214A (enExample)
KR (1) KR102085553B1 (enExample)
CN (1) CN104284928B (enExample)
DE (1) DE102012207462A1 (enExample)
IN (1) IN2014DN10108A (enExample)
MX (1) MX358202B (enExample)
PL (1) PL2844690T3 (enExample)
TW (1) TW201402772A (enExample)
WO (1) WO2013164154A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160012931A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Conductive Particle
US20160012934A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Composite Formulation and Composite Product
EP3196257B1 (en) * 2014-07-31 2022-09-21 Tatsuta Electric Wire & Cable Co., Ltd. Conductive composition and conductive sheet containing the same
KR101836566B1 (ko) 2015-05-15 2018-03-08 현대자동차주식회사 도전성 접착제 및 이를 이용한 복합소재의 접합방법
JP5989928B1 (ja) 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
JP6005313B1 (ja) 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005312B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972489B1 (ja) * 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
WO2018042701A1 (ja) 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US11355469B2 (en) 2017-12-28 2022-06-07 Showa Denko Materials Co., Ltd. Connection structure and method for producing same
CN111527164B (zh) * 2017-12-28 2022-11-18 昭和电工材料株式会社 粘接剂膜
JP6805190B2 (ja) * 2018-01-30 2020-12-23 タツタ電線株式会社 導電性接着剤組成物
JP7225505B2 (ja) * 2018-01-30 2023-02-21 タツタ電線株式会社 導電性接着剤組成物
JP6794592B1 (ja) * 2019-05-31 2020-12-02 タツタ電線株式会社 等方導電性粘着シート
TWI788670B (zh) * 2019-05-31 2023-01-01 日商拓自達電線股份有限公司 各向同性導電性黏著片
JP7686908B2 (ja) * 2021-07-29 2025-06-03 サカタインクス株式会社 ２液硬化型導電性接着剤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001782A1 (de) * 1998-07-04 2000-01-13 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare klebstofffolie
CN1532853A (zh) * 2003-03-24 2004-09-29 阿尔卑斯电气株式会社 可变电阻器
WO2008146014A2 (en) * 2007-06-01 2008-12-04 Hexcel Composites Limited Improved structural adhesive materials

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475213A (en) 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3970608A (en) 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
US4113981A (en) 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
NL8204288A (nl) * 1982-11-05 1984-06-01 Gen Electric Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel.
US4606962A (en) 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
AU612771B2 (en) 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
DE4012061A1 (de) * 1990-04-10 1991-10-17 Mittweida Ing Hochschule Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln
DE19912628A1 (de) 1998-07-04 2000-01-05 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie
DE19853805B4 (de) 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
JP2006032165A (ja) 2004-07-16 2006-02-02 Sumitomo Metal Mining Co Ltd 導電性金属粒子とそれを用いた導電性樹脂組成物及び導電性接着剤
CA2766859A1 (en) * 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
DE102010060904A1 (de) * 2010-11-30 2012-05-31 Benecke-Kaliko Ag Polymermischung
EP4012061A1 (de) * 2020-12-09 2022-06-15 MTU Aero Engines AG Nickelbasislegierung und bauteil aus dieser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000001782A1 (de) * 1998-07-04 2000-01-13 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare klebstofffolie
CN1532853A (zh) * 2003-03-24 2004-09-29 阿尔卑斯电气株式会社 可变电阻器
WO2008146014A2 (en) * 2007-06-01 2008-12-04 Hexcel Composites Limited Improved structural adhesive materials

Also Published As

Publication number Publication date
EP2844690A1 (de) 2015-03-11
MX358202B (es) 2018-08-09
KR102085553B1 (ko) 2020-03-06
US9598614B2 (en) 2017-03-21
JP2015521214A (ja) 2015-07-27
DE102012207462A1 (de) 2013-11-07
KR20150013703A (ko) 2015-02-05
PL2844690T3 (pl) 2016-12-30
MX2014013046A (es) 2015-02-04
US20150129812A1 (en) 2015-05-14
WO2013164154A1 (de) 2013-11-07
IN2014DN10108A (enExample) 2015-08-21
EP2844690B1 (de) 2016-07-20
TW201402772A (zh) 2014-01-16
CN104284928A (zh) 2015-01-14

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C14 Grant of patent or utility model
GR01 Patent grant
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CP02 Change in the address of a patent holder

Address after: Norderstedt

Patentee after: Tesa Europe Corporation

Address before: hamburg

Patentee before: Tesa Europe Corporation

CP01 Change in the name or title of a patent holder

Address after: Norderstedt

Patentee after: Tesa AG

Address before: Norderstedt

Patentee before: Tesa Europe Corporation

CP01 Change in the name or title of a patent holder